• Proceedings of the KWS Conference
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• 2002.10a
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• pp.798-802
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• 2002

Metallurgical studies on the bonded interlayer of directionally solidified Ni-base superalloy GTD111 joints were carried out during transient liquid phase bonding. The formation mechanism of solid during solidification process was also investigated. Microstructures at the bonded interlayer of joints were characterized with bonding temperature. In the bonding process held at 1403K, liquid insert metal was eliminated by well known mechanism of isothermal solidification process and formation of the solid from the liquid at the bonded interlayer were achieved by epitaxial growth. In addition, grain boundary formed at bonded interlayer is consistent with those of base metal. However, in the bonding process held at 1453K, extensive formation of the liquid phase was found to have taken place along dendrite boundaries and grain boundaries adjacent to bonded interlayer. Liquid phases were also observed at grain boundaries far from the bonding interface. This phenomenon results in liquation of grain boundaries. With prolonged holding, liquid phases decreased gradually and changed to isolated granules, but did not disappeared after holding for 7.2ks at 1473K. This isothermal solidification occurs by diffusion of Ti to be result in liquation. In addition, grain boundaries formed at bonded interlayer were corresponded with those of base metal. In the GTD-ll1 alloy, bonding mechanism differs with bonding temperature.

• The Journal of Korean Academy of Prosthodontics
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• v.19 no.1
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• pp.61-73
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• 1981

The effects of the opaque porcelain firing temperature, the bonding agent and the degassing prior to the opaque firing On the bond strength were investigated by means of the tensile shear stIe$. The diffusional behaviours at the interface of the porcelain and the alloy, and .the microstructures of the ceramic and metal composite were studied for understanding the bonding mechanism. The results obtained in this experiment were summarizd as follow; 1. With no application of bonding agent, the tensile shear strength of the specimen firing at $1840^{\circ}F$ was higher than that of the specimen firing at $1760^{\circ}F$. 2. The highest bond strength was obtained by application of bonding agent without degassing prior to the opaque firing. 3. Application of bonding agent after the degassing showed the lowest bond strength. 4. The greater number of pores were observed at the firing temperature of $1840^{\circ}F$ than that of $1760^{\circ}F$ in the porcelain and the interface respectively.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.05a
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• pp.147-150
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• 2001

The ARB (Accumulative Rolling Bonding) Process was applied to a 6061 Al alloy to obtain ultra-fine grains. After 4 ARB cycles at $315^{\circ}C$, original equilibrium large grains were transformed to ultra-fine grains of several hundred nano-meter size with nonequilibrium grain boundaries. At lower number of cycles, microsutcture of highly-tangled dislocation cells were observed. Large grains and coarsened precipitates filled the microstructure of specimens experienced ARB cycles more than 5. Sliding wear tests using a pin-on-disk type wear tester were conducted on the ARB processed 6061 Al alloy plate. Wear rates of the 6061 Al alloy increased with the increase of ARB cycle number as well as the applied load. Worn surfaces and debris, cross-sections of the worn specimen were examined with scanning electron microscopy (SEM) to investigate the wear mechanism of the ultra-fine grained 6061 Al Tensile properties of the 6061 Al alloy were also studied and used to correlate the wear test results with the microstructures, which evolved continuously with the number of ARB cycles.

• Journal of Welding and Joining
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• v.23 no.3
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• pp.61-67
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• 2005

Since lead (Pb)-free solders for electronics have higher melting points than that of eutectic Sn-Pb solder, they need higher soldering temperatures. In order to decrease the soldering temperature we tried to coat Sn-Bi layer on $Sn-3.5\%Ag$ solder by electroplating, which applies the mechanism of transient liquid phase bonding to soldering. During heating Bi will diffuse into the $Sn-3.5\%Ag$ solder and this results in decreasing soldering temperature. As bonding samples, the 1608 capacitor electroplated with Sn, and PCB, its surface was finished with electroless-plated Ni/Au, were selected. The $Sn-95.7\%Bi$ coated Sn-3.5Ag was supplied as a solder between the capacitor and PCB land. The samples were reflowed at $220^{\circ}C$, which was lower than that of normal reflow temperature, $240\~250^{\circ}C$, for the Pb-free. As experimental result, the joint of $Sn-95.7\%Bi$ coated Sn-3.5Ag showed high shear strength. In the as-reflowed state, the shear strength of the coated solder showed 58.8N, whereas those of commercial ones were 37.2N (Sn-37Pb), 31.4N (Sn-3Ag-0.5Cu), and 40.2N (Sn-8Zn-3Bi). After thermal shock of 1000 cycles between $-40^{\circ}C$ and $+125^{\circ}C$, shear strength of the coated solder showed 56.8N, whereas the previous commercial solders were in the range of 32.3N and 45.1N. As the microstructures, in the solder $Ag_3Sn$ intermetallic compound (IMC), and along the bonded interface $Ni_3Sn_4$ IMC were observed.

• Computers and Concrete
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• v.26 no.2
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• pp.115-125
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• 2020

To reduce the damage of concrete in fire, a new type of lightweight cinder aggregate concrete was developed due to the excellent fire resistance of cinder. To further enhance its fire resistance, Polypropylene (PP) Fibers which can enhance the fire resistance of concrete were also used in this type of concrete. However, the bond behavior of this new type of concrete after fire exposure is still unknown. To investigate its bond behavior, 185 specimens were heated up to 22, 200, 400, 600 or 800℃ for 2 h duration respectively, which is followed by subsequent compressive and tensile tests at room temperature. The concrete-rebar bond strength of C30 PP fiber-reinforced cinder concrete was subsequently investigated through pull-out tests after fire exposure. The microstructures of the PP fiber-reinforced cinder concrete and the status of the PP fibre at different temperature were inspected using an advanced scanning electron microscopy, aiming to understand the mechanism of the bonding deterioration under high temperature. The effects of rebar diameter and bond length on the bond strength of PP fiber-reinforced cinder concrete were investigated based on the test results. The bond-slip relation of PP fiber-reinforced cinder concrete after exposure at different temperature was derived based on the test results.

• Textile Coloration and Finishing
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• v.20 no.1
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• pp.8-15
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• 2008

We presented the modified decal-transfer lithography (DTL) and light stamping lithography (LSL) as new powerful methods to generate patterns of poly(dimethylsiloxane) (PDMS) on the substrate. The microstructures of PDMS fabricated by covalent binding between PDMS and substrate had played as barrier to locally control wettability. The transfer mechanism of PDMS is cohesive mechanical failure (CMF) in DTL method. In the LSL method, the features of patterned PDMS are physically torn and transferred onto a substrate via UV-induced surface reaction that results in bonding between PDMS and substrate. Additionally we have exploited to generate the patterning of rhodamine B and quantum dots (QDs), which was accomplished by hydrophobic interaction between dyes and PDMS micropatterns. The topological analysis of micropatterning of PDMS were performed by atomic force microscopy (AFM), and the patterning of rhodamine B and quantum dots was clearly shown by optical and fluorescence microscope. Furthermore, it could be applied to surface guided flow patterns in microfluidic device because of control of surface wettability. The advantages of these methods are simple process, rapid transfer of PDMS, modulation of surface wettability, and control of various pattern size and shape. It may be applied to the fabrication of chemical sensor, display units, and microfluidic devices.