• Title/Summary/Keyword: Mixed mode distribution

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Relationship between Pattern of Fatigue Crack Surface and Fatigue Crack Growth Behavior under $K_{III}$ Mode-Four Point Shear in Al 5083-O

  • Kim Gun-Ho;Won Young-Jun;Sakakur Keigo;Fujimot Takehiro;Nishioka Toshihisa
    • Journal of Advanced Marine Engineering and Technology
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    • v.30 no.4
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    • pp.474-482
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    • 2006
  • Generally almost all fatigue crack growth is affected by mode I. For this reason a study on mode I has concentrated in the field of fracture mechanics. However the fatigue crack initiation and growth in machines and structures usually occur in mixed mode loading. If there is any relationship between the cause of fracture in mixed mode loading and fracture surface, fracture surface pattern will be the main mean explaining reasons of fatigue fracture and obtaining further information about fracture process. In this paper low point shear-fatigue test with Aluminum alloy hi 5083-O is carried out from this prospect and then the mixed mode distribution of fracture surface is examined from the result after identifying the generation of fatigue crack surface pattern. It was found from the experimental results that the fatigue crack surface pattern and the fatigue crack shear direction are remarkably consistent. Furthermore It is possible that the analysis of distribution of mixed mode through the fatigue crack surface pattern.

Relationship between Pattern of Fatigue Crack Surface and Fatigue Crack Growth Behavior under $K_{III}$ Mode-Four Point Shear in Al 5083-O (Al 5083-O재에 있어서 $K_{III}$ 모드 4점 전단 하에서의 피로파단면 무늬와 피로균열진전거동의 관계)

  • Kim, Gun-Ho;Won, Young-Jun;Sakakura, Keigo;Fujimoto, Takehiro;Nishioka, Toshihisa
    • Proceedings of the Korean Society of Marine Engineers Conference
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    • 2006.06a
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    • pp.43-44
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    • 2006
  • Generally almost all fatigue crack growth is affected by model. For this reason a study on model has concentrated in the field of fracture mechanics. However the fatigue crack initiation and growth in machines and structures usually occur in mixed mode loading. If there is any relationship between the cause of fracture in mixed mode loading and fracture surface, fracture surface pattern will be the main mean explaining reasons of fatigue fracture and obtaining further information about fracture process. In this paper four point shear-fatigue test with Aluminum alloy Al 5083-O is carried out from this prospect and then the mixed mode distribution of fracture surface is examined from the result after identifying the generation of fatigue crack surface pattern. It was found from the experimental results that the fatigue crack surface pattern and the fatigue crack shear direction are remarkably consistent. Furthermore It is possible that the analysis of distribution of mixed mode through the fatigue crack surface pattern.

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혼합모드 피로균열의 응력재분배 상태 하의 전파거동

  • 이정무;송삼홍
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.05a
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    • pp.103-103
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    • 2004
  • 실제 작용하는 하중상태는 요소의 형상과 작용하중의 복잡성 때문에 혼합모드 하중상태를 나타낸다. 또한 혼합모드 피로균열은 전파과정 동안 부재의 구속형상이나 외부 작용하중의 급격한 변화에 의해서도 영향 받게 된다. 이로 인하여 피로균열은 균열선단에서 지속적이면서 급격한 응력 재분배의 상태를 경험한다. 그러므로 다양한 응력 재분배 상태에서의 혼합모드 피로균열에 대한 고찰이 필요하다. 본 연구에서는 응력 재분배상태 하에서 나타나는 혼합모드 피로균열의 전파거동에 대한 특징이 실험적으로 고찰되었다.(중략)

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The Effect of the CFRP/GFRP Composite Thickness on AE Characteristics and Mixed Mode Crack Behavior (CFRP/GFRP 적층복합재의 두께가 혼합모드 균열거동과 AE에 미치는 영향)

  • Yun, Yu-Seong;Kim, Da-Jin-Sol;Kwon, Oh-Heon
    • Journal of the Korean Society of Safety
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    • v.29 no.6
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    • pp.9-14
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    • 2014
  • Recently many efforts and researches have been done to cope with industrial facilities that require a low energy machines due to the gradual depletion of the natural resources. The fiber-reinforced composite materials in general have good properties and have the proper mechanical properties according to the change of the ply sequences and fiber distribution types. However, in the fiber-reinforced composite material, there are several problems, including fiber breaking, peeling, layer lamination, fiber cracking that can not be seen from the metallic material. Particularly, the fracture and delamination are likely to be affected by the thickness of the stacking laminates when the bi-material laminated structure is subjected to a load of the mixed mode. In this study, we investigated the effect of the thickness ratio of the difference in the CFRP/GFRP bi-material laminate composites by measuring the cracking behavior and the AE characteristics in a mixed mode loading, which may be generated in the actual structure. The results show that the thickness of the CFRP becomes more thick, the mode I energy release rate becomes a larger, and also the influence of mode I is greater than that of mode II. In addition, AE amplitude which shows the level of the damage in the structure was obtained the more damage in the CFRP with the thin thickness.

Implementation of 234.7 MHz Mixed Mode Frequency Multiplication & Distribution ASIC (234.7 MHz 혼합형 주파수 체배 분배 ASIC의 구현)

  • 권광호;채상훈;정희범
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.28 no.11A
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    • pp.929-935
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    • 2003
  • An analog/digital mixed mode ASIC for network synchronization of ATM switching system has been designed and fabricated. This ASIC generates a 234.7/46.94 ㎒ system clock and 77.76/19.44 ㎒ user clock using 46.94 ㎒ transmitted clocks from other systems. It also includes digital circuits for checking and selecting of the transmitted clocks. For effective ASIC design, full custom technique is used in 2 analog PLL circuits design, and standard cell based technique is used in digital circuit design. Resistors and capacitors for analog circuits are specially designed which can be fabricated in general CMOS technology, so the chip can be implemented in 0.8$\mu\textrm{m}$ digital CMOS technology with no expensive. Testing results show stable 234.7 ㎒ and 19.44 ㎒ clocks generation with each 4㎰ and 17㎰ of low ms jitter.

A Study on Dynamic Key Management in Mixed-Mode Wireless LAN (혼합모드 무선랜에서의 동적 키 관리 방식 연구)

  • 강유성;오경희;정병호;정교일;양대헌
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.29 no.4C
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    • pp.581-593
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    • 2004
  • The interest in wireless LAN security is on the increase owing to a role of high-speed wireless Internet infrastructure of wireless LAN. Wi-Fi has released WPA standard in order to overcome drawbacks of WEP algorithm that is security element of current IEEE 802.11-based wireless LAN system. Pairwise key management and group key management in a mixed-mode which supports both terminals running WPA and terminals running original WEP security are very complicate. In this paper, we analyze flaws in WPA authenticator key management state machine for key distribution and propose the countermeasures to overcome the analyzed problems. Additionally, WPA authenticator key management state machine to which the solutions are applied is described. The reconstructed WPA authenticator key management state machine helps the AP perform efficiently group key exchange and group key update in the mixed-mode.

Design of 234.7 MHz Mixed Mode Frequency Multiplication & Distribution ASIC for ATM Switching System (ATM 교환기용 234.7 MHz 혼합형 주파수 체배분배 ASIC의 설계)

  • 채상훈;정희범
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.24 no.10A
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    • pp.1597-1602
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    • 1999
  • An analog / digital mixed mode frequency multiplication and distribution ASIC for switch link or network synchronization of ATM switching system for B-ISDN has designed. This ASIC generates 234-7 MHz system clock and 77.76 MHz, 19.44 MHz user clocks using 46.94 MHz external clock. It also includes digital circuits for checking and selecting between the two external clocks. For effective ASIC design, full custom technique is used in analog PLL circuit and standard cell based technique is used in digital circuit. Resistors and capacitors are specially designed so the chip can be implemented in 0.8$\mu\textrm{m}$ digital CMOS technology.

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Initial Growth Mode and Nanostructure of Bulk Heterojunction Layers in Planar Type Metal Pthanlocyanine Molecules

  • Kim, Hyo-Jung;Kima, Ji-Whan;Lee, Hyun-Hwi;Lee, Byeon-Du;Kim, Jang-Joo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.162-162
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    • 2012
  • ZnPc and CuPc molecules stacked similar way in the film, but showed different growth modes in thermal evaporation. The distribution of CuPc crystals did not change by the film thickness, whereas the distribution of ZnPc became random as the increase of the film thickness. The disc type nanograins of CuPc were quite regularly distributed at the initial growth regime and the regular distribution of nanograins was kept during the film growth. On the other hand, ZnPc consisted in ellipsoid shaped nanograins and the distribution of nanograins was not regular in the initial growth regime. The irregular distribution of nanograins changed to the regular mode at the later growth regime by showing structure factor in GISAXS measurement. The different initial nanograin distribution in ZnPc and CuPc was related to the different nanostructure in the mixed layer with C60 to form the bulk heterojunction.

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ANALYSIS OF LAMINAR AND TURBULENT MIXED FLOW AROUND AN AIRFOIL (익형 주위의 층류와 난류가 혼합된 유동해석)

  • Kim, C.W.;Lee, Y.G.
    • 한국전산유체공학회:학술대회논문집
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    • 2009.04a
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    • pp.87-89
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    • 2009
  • In the present paper, transition turbulence model is applied to the NACA64(3)618 and detailed flow features are studied. The turbulence model is sensitive to the boundary layer grid quality and y+ of the grid was limited to 1. The prediction of the transition region is dependent on the local flow condition. The pressure coefficient distribution of the transition turbulence model is compared with that of the fully turbulent mode and the drag distribution of the transition turbulence model was compared with that of the wind tunnel test.

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Simulation of Characteristics of Amorphous-Silicon Thin Film Transistor for Liquid Crystal Display Using the Mixed Simulator (혼합시뮬레이터를 사용한 액정 표시기용 비정질 실리콘 박막 트랜지스터의 특성 시뮬레이션)

  • 이상훈;김경호
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.32A no.12
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    • pp.122-129
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    • 1995
  • The most important feature of a-Si TFT is dense localized states such as dangling bonds which exist in tis bandgap. Electrons trapped by localized states dominate the potential distribution in the active a-Si region ,and influence the performance of a-Si TFT. In this paper, we describe the electrical characteristics of a-Si TFT with respect to trap distribution within bandgap, electron mobility and interface states using 2-Dimensional device simulator and compare the result of simulation with measurements. Using the mixed-mode simulator, we can predict the potential variation of pixel which causes residual image problem during the turn-off of a-Si TFT driving circuit. Therefore it is possible to consider trade-off between potential variation of pixel and turn-on current of a-Si TFT for the optimized driving circuit.

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