• Structural Engineering and Mechanics
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• v.42 no.5
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• pp.701-713
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• 2012

Results pertaining to 3D investigations on the effect of the thickness on the stress fields at the crack front are presented. A 3D finite element analysis is performed using a modified single edge-notched tension specimen configuration, with an inclined crack to include mixed mode I-II. A technique to mesh the crack front (3D) with singular finite elements in ANSYS without using third party software is introduced and used in this study. The effect of the specimen thickness is explicitly investigated for six thicknesses ranging from 1 to 32 mm. In addition, three crack inclination angles, including pure Mode-I, are used to study the effect of mixed-mode I-II fracture. An attempt is made to correlate the extent of a particular stress state along the crack front to thickness. In addition, ${\sigma}_{zz}/{\nu}({\sigma}_{xx}+{\sigma}_{yy})$ contours at the crack front are presented as a useful means to analyze the stress state.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.359-364
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• 2004

In this study, experiments were tried on the mixed-mode I+II single overloading model which changes the loading mode of overload and fatigue load. Aspects of deformation field in front of the crack which is formed by mixed-mode I+II single overloading were experimentally studied. Then the shape and size of mixed-mode plastic zone were approximately calculated. The propagation behavior of fatigue crack was examined under the test conditions combined by changing the loading mode. The behavior of fatigue cracks were greatly affected by shapes of plastic deformation field and applying mode of fatigue load. Accuracy of prediction and evaluation for fatigue life may be improved by considering all aspects of deformation and behavior of fatigue cracks.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.214-219
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• 2004

Crack tip behavior of single mode loading condition(mode I)depend on tensile loading component but one of mixed mode loading condition(mode I+II) have influenced on shear loading component like the practical structure. Because crack closure is caused by shear loading component under mixed-mode loading a research on the behavior in the stage of crack initiation and propagation require to be evaluate about crack closure effect by fatigue crack surface friction. For that reasion we examined the behavior at the crack tip by direct measuring method. Measured behavior at the crack tip was analyzed through vector crack tip displacement. As a result, crack propafation equation was corrected by considering with crack closure effect. In addition we compared fatigue fracture crack surface and crack closure level.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.142.1-142.1
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• 2005

• Sijohaknonchong
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• v.19 no.1
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• pp.235-260
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• 2003

Recently, I presented Gagok(歌曲) Collection Yeong-eon永言 to learned circles. Yeong-eon is very similar to Yukdang-version六堂本 CheongGuYeongeon靑丘永言. Compared with Cheong- Yuk, it is the same age or little bit early time of Cheong-Yuk in culture Icon. This paper paid attention to the considerable difference between Yeong-eon and Cheong-Yuk in the way of the distribution of Yisakdaeyap二數大 葉's Woo mode羽調 and Ke-myeon mode界面調. There was the way of gathering ‘real name’+‘namelessness’ in Yisakdaeyap, which is the feature of the 18th century Gagok Collection. I found this way just put on the 19th century Gagok Collection way which is the distribution of Yisakdaeyap's 'Woo mode and Ke-myeon mode' in CheongYuk. Then I proved in this paper that the way of gathering Yisakdaeyap in Cheong Yuk didn't correspond to an actual singing in the early 19th century when 'Woo mode and Ke-myeon mode' was fixed. In case of Yeong-eon, however, it was not written any writers' names at all, when it was researched retroactively, I knew it was distributed evenly both the works of 'real name' and 'namelessness' in Yisakdaeyaps 'Woo mode and Ke-myeon mode'. Consequently, I found Yeong-eon is the good Gagok Collection for an actual singing at that time. In addition, there was discord in the mode or key distribution among many Gagok Collections. I found this issue of the application had kept on make Gagok Collections edit during 2 centuries. Because the actual Gagok enjoyment in the specific time is connected the way of the mode application directly.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.2
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• pp.289-295
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• 2001

The aim of this study is to investigate the ductile fracture behaviour under pure Mode II loading using A533B pressure vessel steel. Single punch shear(SPS) test was performed to obtain the J-R curve under pure Mode II loading which was compared with that of the Model I loading. Simulation using Rousellier Ductile Damage Theory(RDDT) was carried out with 4-node quadrilateral element(L(sub)c=0.25mm). For the crack advance, the failed element removal technique was adopted with a $\beta$ criterion. Through the $\beta$ value tuning-up procedures, $\beta$(sub)crit(sup)II was determined as 1.5 in contrast with $\beta$(sub)crit(sup)I=5.5. In conclusion, it was found that the J-R curve under Mode II loading was located at lower part than that under Mode I loading obtained from the previous study and that the $\beta$ values strongly depended on the loading type. In addition, the predicted result using RDDT showed a good agreement with the SPS experimental one under pure Mode II loading.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.3
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• pp.511-518
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• 1997

The technique of fretting fatigue test was developed and fretting fatigue tests of A12024-T4 were conducted under several conditions. The newly developed calibration methods for measuring surface contact tractions showed good linearity and repeatability. The plate type specimen to which tow bridge type pads were attached and vision system was used to observe the crack behaviour. The oblieque cracks appeared in the early stage of crack growth and they became mode I cracks as they grow about 1 mm. The mode I transition points were found to be longer when surface tractions are higher or bulk stress is lower. Before the crack becomes mode I crack, 'well point' where crack grow about rate is minimum, was detected under every experimental condition. The crack behaviour was found to be affected by surface tractions, contact area, bulk stress. It was also found that partial slip and stick condition is most detrimental and the crack starts from the boundary of stick and slip. For gross slip crack started at the outside edge of pad. After crack mode transition, fretting fatigue cracks showed almost same behaviour of plain mode I fatigue cracks. Equivalent stress intensity factor was used to analyze the behaviour of fretting fatigue cracks and it was found that stress intensity factors can be applied to fretting fatigue cracks.

• Journal of Sensor Science and Technology
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• v.21 no.1
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• pp.1-6
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• 2012

Using a current-mode multiple reset, a current-to-voltage(I-V) converter with a wide dynamic range was produced. The converter consists of a trans-impedance amplifier(TIA), an analog-to-digital converter(ADC), and an N-bit counter. The digital output of the I-V converter is composed of higher N bits and lower bits, obtained from the N-bit counter and the ADC, respectively. For an input current that has departed from the linear region of the TIA, the counter increases its digital output, this determines a reset current which is subtracted from the input current of the I-V converter. This current-mode reset is repeated until the input current of the TIA lies in the linear region. This I-V converter is realized using 0.35 ${\mu}m$ LSI technology. It is shown that the proposed I-V converter can increase the maximum input current by a factor of $2^N$ and widen the dynamic range by $6^N$. Additionally, the I-V converter is successfully applied to a photometric sensor.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.187-192
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• 2001

Cracks in mechanical joints is generally under mixed-mode and there is the critical inclined angle at which mode I stress intensity factor becomes maximum. In order to evaluate the fatigue life of cracks in mechanical joints, horizontal crack normal to the applied load and located on minimum cross section is major concern but critical inclined crack must also be considered. In this paper mixed-mode fatigue crack growth test is performed for horizontal crack and critical inclined crack in mechanical joints. Fatigue crack growth path is predicted by maximum tangential stress criterion using mode I and mode II stress intensity factors obtained from weight function method, and fatigue crack growth rates of horizontal and inclined crack are compared.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.44 no.1
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• pp.85-93
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• 2007

This paper presents new LVDS I/O circuits with a high noise margin for use in highly parallel I/O environments. The proposed LVDS I/O includes transmitter and receiver parts. The transmitter circuits consist of a differential phase splitter and a output stage with common mode feedback(CMFB). The differential phase splitter generates a pair of differential signals which have a balanced duty cycle and $180^{\circ}$ phase difference over a wide supply voltage variation due to SSO(simultaneous switching output) noises. The CMFB output stage produces the required constant output current and maintains the required VCM(common mode voltage) within ${\pm}$0.1V tolerance without external circuits in a SSO environment. The proposed receiver circuits in this paper utilizes a three-stage structure(single-ended differential amp., common source amp., output stage) to accurately receive high-speed signals. The receiver part employs a very wide common mode input range differential amplifier(VCDA). As a result, the receiver improves the immunities for the common mode noise and for the supply voltage difference, represented by Vgdp, between the transmitter and receiver sides. Also, the receiver produces a rail-to-rail, full swing output voltage with a balanced duty cycle(50% ${\pm}$ 3%) without external circuits in a SSO environment, which enables correct data recovery. The proposed LVDS I/O circuits have been designed and simulated with 0.18um TSMC library using H-SPICE.