• Title/Summary/Keyword: Molding Stability

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A study on the Molding Stability of Hydro-mechanical High Speed Injection Molding for Thin-Walled(0.3mm) LGP (초박형(0.3t) 도광판 적용을 위한 유압식 고속사출성형의 성형 안정성 연구)

  • Kim, J.S.;Oh, J.G.;Jeong, C.;An, H.J.;Hwang, C.J.;Kim, J.D.;Yoon, K.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • pp.422-425
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    • 2008
  • Recently, electronic products and related parts are required to have thin thickness because of small form factor. To go with the trend, LGP(light guide plate) of LCD BLU(Liquid Crystal Display Back light unit: It is one of kernel parts of LCD) for cell phone has the thickness of 0.3 mm and the battery case of cell phone has 0.25 mm. Accordingly, high speed injection molding is required to make products which have thin thickness. High speed injection molding means that the resin is injected into the cavity at higher than normal speed avoiding short shot. In the case of hydro-mechanical high speed injection machine, it requires the design for hydraulic unit to make high injection speed and the design for control unit to control hydraulic unit. In the present paper, we concentrated on the molding stability of hydro-mechanical high speed injection machine to make an LGP of 0.3 mm thickness.

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Molding Stability of Hydro-Mechanical High Speed Injection Molding for Thin-Wall(0.3mm) LGP (박판(0.3mm) 도광판 성형을 위한 유압식 고속사출성형의 성형 안정성 연구)

  • Hwang, C.J.;Kim, J.S.;Oh, J.G.;Jeong, C.;An, H.J.;Heo, Y.M.;Kim, J.D.;Yoon, K.H.
    • Transactions of Materials Processing
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    • v.17 no.8
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    • pp.657-661
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    • 2008
  • Recently, products of electronic industry and related parts are required to have the thickness thinner and thinner to reduce the part weight. To go with this trend, LGP(light guide plate) of LCD-BLU(Liquid Crystal Display-Back Light Unit: It is one of kernel parts of LCD) for cell phone has the thickness of ${\sim}0.3mm$ and the battery case of cell phone has ${\sim}0.25mm$. Accordingly, high speed injection molding is required to mold products which have thinner parts. To achieve high speed injection and proper control of hydraulic unit, various design was applied to conventional injection unit. In the present paper, we concentrated on the molding stability of hydro-mechanical high speed injection machine to make an LGP of 0.3mm thickness.

Evaluation on the Effect of Beads for Adhesive Improvement of CFRP and Aluminum (이종소재인 CFRP와 알루미늄의 접착력 향상을 위한 Bead의 영향 평가)

  • Shin, Dong-Woo;Kim, Jin-Jae;Lee, Jong-Hyuk;Kwon, Il-Jun;Park, Sung-Min
    • Composites Research
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    • v.30 no.4
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    • pp.254-260
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    • 2017
  • In this paper, we investigated the application method and properties of 0.1 mm, 0.2 mm and 0.3 mm beads, which can secure a certain thickness due to the molding stability of joint surfaces of different materials (aluminum and composite). In order to verify this, the influence was evaluated according to the thickness of the adhesive in the Double lap test and the FEM simulation. As a result, it was confirmed that as the content of the bead of the adhesive increased more than 1%, the strength of the adhesion increased and the elongation decreased. We confirmed as the size of the bead became larger, the rigidity became lower and the elongation increased.

Design and fabrication of molds moved wall thickness for biochip considering molding stability (성형안정성을 고려한 바이오칩용 측벽 이동형 금형설계 및 제작)

  • Go, Young-Bae;Kim, Jong-Sun;Min, In-Gi;Yu, Jae-Won;Kim, Jong-Duck;Yoon, Kyung-Hwan;Lee, Sung-Ho;Kim, Kyung-Min;Kim, Byung-Il;Hwang, Chul-Jin
    • Journal of the Korea Society of Die & Mold Engineering
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    • v.2 no.2
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    • pp.25-28
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    • 2008
  • Micro fabrication of biochip such like lab-on-a-chip becomes increasingly important. In this study, we designed and manufactured of new molds which were main factors for forming process in order to mass produce of biochip using forming process. Forming analysis of biochip was performed by Moldflow software. Results of this study are able to design and manufacture the mold which can be easy to eject the workpiece by using the slide mechanism for biochip.

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