• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2002.07a
• /
• pp.292-295
• /
• 2002

In this work, transient characteristics of NPT(Non Punch Through)-IGBT(Insulated Gate Bipolar Transistor) have been studied with different temperatures analytically. Power losses are caused by heat generated in MIT-IGBT for steady state and transient state conditions. We therefore have focused on the analysis of excess carrier concentration and excess charge injected into N-drift layer with different temperatures and have obtained anode voltage drop during turn-off with lifetime of 2.4[${\mu}$s].

• Proceedings of the KIEE Conference
• /
• 1997.07d
• /
• pp.1621-1623
• /
• 1997

The breakdown voltage of SOI RESURF (REduce SURface Field) diode using a SIPOS (Semi Insulating POlycrystalline Silicon) layer is verified in terms of n-drift layer length and surface oxide thickness by device simulator MEDICI, and compared with conventional SOI RESURF diode. Increasing the n-drift layer length, the breakdown voltage of SOI RESURF diode using the SIPOS layer have increased and saturated at $8{\mu}m$. And it has decreased with increasing the surface oxide thickness.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.10
• /
• pp.767-770
• /
• 2010

In this work, we investigated the static characteristics of 4H-SiC vertical metal-oxidesemiconductor field effect transistors (VMOSFETs) by adjusting the doping level of n-epilayer and the effect of a current spreading layer (CSL), which was inserted below the p-base region with highly doped n+ state ($5{\times}10^{17}cm^{-3}$). The structure of SiC VMOSFET was designed by using a 2-dimensional device simulator (ATLAS, Silvaco Inc.). By varying the n-epilayer doping concentration from $1{\times}10^{16}cm^{-3}$ to $1{\times}10^{17}cm^{-3}$, we investigated the static characteristics of SiC VMOSFETs such as blocking voltages and on-resistances. We found that CSL helps distribute the electron flow more uniformly, minimizing current crowding at the top of the drift region and reducing the drift layer resistance. For that reason, silicon carbide VMOSFET structures of highly intensified blocking voltages with good figures of merit can be achieved by adjusting CSL and doping level of n-epilayer.

• ETRI Journal
• /
• v.36 no.5
• /
• pp.829-834
• /
• 2014

In this paper, a lateral power metal-oxide-semiconductor field-effect transistor with ultra-low specific on-resistance is proposed to be applied to a high-voltage (up to 200 V) integrated chip. The proposed structure has two characteristics. Firstly, a high level of drift doping concentration can be kept because a tilt-implanted p-drift layer assists in the full depletion of the n-drift region. Secondly, charge imbalance is avoided by an extended trench gate, which suppresses the trench corner effect occurring in the n-drift region and helps achieve a high breakdown voltage (BV). Compared to a conventional trench gate, the simulation result shows a 37.5% decrease in $R_{on.sp}$ and a 16% improvement in BV.

• Transactions on Semiconductor Engineering
• /
• v.1 no.1
• /
• pp.9-13
• /
• 2023

An AlGaN/GaN heterojunction-based hydrogen sensor with SnO₂ nanoparticles/Pd catalyst layer was fabricated for room-temperature hydrogen detection. The fabricated sensor exhibited unstable drift in standby current when it was operated at room temperature. The instability in the sensing signal was dramatically improved when the sensor was operated under UV illumination.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.22-23
• /
• 2008

The conventional IGBT has two problems to make the device taking high performance. The one is high on state voltage drop associated with JFET region, the other is low breakdown voltage associated with concentrating the electric field on the junction of between p base and n drift. This paper is about the structure to effectively improve both the lower on state voltage drop and the higher breakdown voltage than the conventional IGBT. For the fabrication of the circular trench IGBT with the circular trench layer, it is necessary to perform the only one wet oxidation step for the circular trench layer. Analysis on both the on state voltage drop and the Breakdown voltage show the improved values compared to the conventional IGBT structure. Because the circular trench layer disperses electric field from p base and n drift junction to circular trench, the breakdown voltage increase. The on state voltage drop decrease due to reduction of JFET region and direction change of current path which pass through reversed layer channel.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.11
• /
• pp.981-986
• /
• 2008

The conventional IGBT has two problems to make the device taking high performance. The one is high on state voltage drop associated with JFET region, the other is low breakdown voltage associated with concentrating the electric field on the junction of between p base and n drift. This paper is about the structure to effectively improve both the lower on state voltage drop and the higher breakdown voltage than the conventional IGBT. For the fabrication of the circular trench IGBT with the circular trench layer, it is necessary to perform the only one wet oxidation step for the circular trench layer. Analysis on both the on state voltage drop and the breakdown voltage show the improved values compared to the conventional IGBT structure. Because the circular trench layer disperses electric field from the junction of between p base and n drift to circular trench, the breakdown voltage increase. The on state voltage drop decrease due to reduction of JFET region and direction changed of current path which pass through reversed layer channel. The electrical characteristics were studied by MEDICI simulation results.

• Journal of Magnetics
• /
• v.15 no.4
• /
• pp.149-154
• /
• 2010

Synthetic antiferromagnets (SAFs) are used as free layer structures for various magnetic devices utilizing spintransfer torque (STT). Therefore, it is important to understand current-induced excitation of SAFs. By means of drift-diffusion and macrospin models, we studied the current-induced excitation of a SAF-free layer structure (NiFe/Ru/NiFe). The simulation results were compared with the previous experimental results [N. Smith et al., Phys. Rev. Lett. 101, 247205 (2008)]. We confirmed that a nonzero STT through the Ru layer is essential for explaining the experimental results.

• Journal of Korean Port Research
• /
• v.9 no.1
• /
• pp.57-63
• /
• 1995

In this paper we examine the mass transport within the boundary layer near the sea bottom. The fluid domain is seperated into inner and outer region of boundary layers. In outer region, the wave field is assumed to be inviscid and irrotational. When the incident waves enter the arrays of circular cylinders, the scattering of water waves by an array of N bottom mounted vertical circular cylinders is solved using the method proposed by Linton & Evans under the potential theory. In inner region, the Navier-Stokes equation must be satisfied with boundary conditions at the boundary later and bottom is to be represented by the sum of the Eulerian mean drift and the Stokes' drift.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.17 no.12
• /
• pp.1264-1270
• /
• 2004

A fast switching thyristor with a superior trade-off property between the on-state voltage drop and the turn-off time could be fabricated by the proton irradiation method. After making symmetric thyristor dies with a voltage rating of 1,600 V from 350 $\mu$m thickness of 60 $\Omega$ㆍcm NTD-Si wafer and 200 $\mu$m width of n-base drift layer, the local carrier lifetime control by the proton irradiation was performed with help of the HI-13 tandem accelerator in China. The thyristor samples irradiated with 4.7 MeV proton beam showed a superior trade-off relationship of $V_{TM}$ = 1.55 V and $t_{q}$ = 15 $\mu$s attributed to a very narrow layer of short carrier lifetime(～1 $\mu$s) in the middle of its n-base drift region. To explain the small increase of $V_{TM}$ , we will introduce the effect of carrier compensation at the low carrier lifetime region by the diffusion current.ffusion current.t.