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저온 선형 PECVD를 이용한 OLED용 Encapsulation 특성 연구

  • Yun, Seung-Jin;Kim, Seong-Jin;Choe, Jeong-Su;Jo, Byeong-Seong;Jeong, Seok-Cheol
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.180-180
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    • 2016
  • 최근 디스플레이 시장의 주요 키워드는 flexible organic light emitting diode (OLED) 이다. OLED 소자의 수명을 결정하는 가장 큰 요인 중의 하나는 공기 중의 O2와 H2O에 의한 유기물의 열화이다. 따라서 공기 중의 O2나 H2O가 유기물에 쉽게 침투하는 것을 막는 것은 소자의 수명 향상을 위하여 필수적이라 할 수 있다[1-3]. SiNx 박막은 경질로 투과성이 우수하며, 화학적 불활성인 특성으로 이러한 Barrier 역할로 연구되어 산업분야에 다양하게 응용되고 있다[4]. SiNx 박막은 일반적으로 plasma enhanced chemical vapor deposition (PECVD) 기술을 이용하여 증착되는데 기존의 PECVD 기술을 이용한 SiNx 박막은 낮은 water vapor transmission rate (WVTR) 등의 문제점들로 인해 한계점이 들어났다. 본 연구에서는, flexible display의 thin film encapsulation (TFE) 공정에서의 적용을 알아보기 위해 $370{\times}470$ size를 증착할 수 있는 In-line 장비를 이용하였으며, 기존의 PECVD 기술의 문제점으로 지적되고 있는 낮은 WVTR을 해결하기 위하여 저온 (<$100^{\circ}C$) 선형 PECVD 기술을 이용하여 WVTR을 개선하고자 하였다. 공정가스로는 SiH4와 NH3를 사용하였으며, SiH4 Carrier 가스로 He을 추가적으로 사용하였다. 또한 공정 압력은 100mTorr를 유지하였다. 증착된 SiNx 박막의 물리적, 화학적 특성 분석을 위해 분광엘립소메타, field emission electron microscopy (FESEM), X-ray diffraction (XRD), Rutherford backscattering spectrometry (RBS) 등을 이용하여 측정하였으며, 박막에 투습되는 수분의 양은 MOCON사의 AQUATRAN 2(W)로 측정하였다. OLED 소자를 구현하기 위해서는 기본적으로 봉지층에 투습되는 양을 $10-6g/m2{\cdot}day$ 이하로 막아줘야 한다고 알려져 있으나, 기존의 PECVD 기술을 이용하여 제작된 SiNx 박막의 WVTR은 $10-2{\sim}10-3g/m2{\cdot}day$ 레벨의 WVTR 결과를 보이고 있다. 본 연구에서 사용된 저온 선형 PECVD 기술을 이용하여 제작된 SiNx 박막의 WVTR은 $5.0{\times}10-5g/m2{\cdot}day$ 이하의 개선된 결과를 확인 할 수 있었다. 또한 flexible display에 적용하기 위해 SiNx 박막의 두께를 최소화한 100nm의 두께에서도 WVTR은 $5.0{\times}10-5g/m2{\cdot}day$ 이하의 결과가 유지됨을 알 수 있었다.

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Investigation of TaNx diffusion barrier properties using Plasma-Enhanced ALD for copper interconnection

  • Han, Dong-Seok;Mun, Dae-Yong;Gwon, Tae-Seok;Kim, Ung-Seon;Hwang, Chang-Muk;Park, Jong-Wan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.178-178
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    • 2010
  • With the scaling down of ULSI(Ultra Large Scale Integration) circuit of CMOS(Complementary Metal Oxide Semiconductor)based electronic devices, the electronic devices become more faster and smaller size that are promising field of semiconductor market. However, very narrow line width has some disadvantages. For example, because of narrow line width, deposition of conformal and thin barrier is difficult. Besides, proportion of barrier width is large, thus resistance is high. Conventional PVD(Physical Vapor Deposition) thin films are not able to gain a good quality and conformal layer. Hence, in order to get over these side effects, deposition of thin layer used of ALD(Atomic Layer Deposition) is important factor. Furthermore, it is essential that copper atomic diffusion into dielectric layer such as silicon oxide and hafnium oxide. If copper line is not surrounded by diffusion barrier, it cause the leakage current and devices degradation. There are some possible methods for improving the these secondary effects. In this study, TaNx, is used of Tertiarybutylimido tris (ethylamethlamino) tantalum (TBITEMAT), was deposited on the 24nm sized trench silicon oxide/silicon bi-layer substrate with good step coverage and high quality film using plasma enhanced atomic layer deposition (PEALD). And then copper was deposited on TaNx barrier using same deposition method. The thickness of TaNx was 4~5 nm. TaNx film was deposited the condition of under $300^{\circ}C$ and copper deposition temperature was under $120^{\circ}C$, and feeding time of TaNx and copper were 5 seconds and 5 seconds, relatively. Purge time of TaNx and copper films were 10 seconds and 6 seconds, relatively. XRD, TEM, AFM, I-V measurement(for testing leakage current and stability) were used to analyze this work. With this work, thin barrier layer(4~5nm) with deposited PEALD has good step coverage and good thermal stability. So the barrier properties of PEALD TaNx film are desirable for copper interconnection.

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Improvement of Learning Behavior of Mice by an Antiacetylcholinesterase and Neuroprotective Agent NX42, a Laminariales-Alga Extract (Acetylcholinesterase 억제 및 신경세포 보호 활성을 갖는 다시마목 해조 추출물 NX42의 마우스 학습능력 향상 효과)

  • Lee, Bong-Ho;Stein, Steven M.
    • Korean Journal of Food Science and Technology
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    • v.36 no.6
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    • pp.974-978
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    • 2004
  • Brown-alga-derived natural agent NX42, mainly composed of algal polysaccharides and phlorotannins, showed mild but dose-dependent inhibition of acetylcholinesterase with $IC_{50}=600-700\;{\mu}g/mL$. Phlorotannin-rich fraction of NX42 showed substantial increase of the activity by more than one order of magnitude ($IC_{50}=54\;{\mu}g/mL$) and significant protection of SK-N-SH cells from oxidative stress by $H_2O_2$. Learning trials of mice for 5 consecutive days revealed electric-shock treatment during learning period significantly retarded learning process, whereas NX42-treated mice showed significant resistance against leaning deficiency possibly mainly due to anticholinesterase and neuroprotective activities of phlorotannin.

결정질 태양전지 Local Back Contact 구조 후면에서의 B-H 결합에 의한 태양전지 특성 저하에 대한 연구

  • Song, Gyu-Wan;Yu, Gyeong-Yeol;Lee, Jun-Sin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.420-420
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    • 2011
  • 결정질 태양전지에서 고효율 달성을 위한 LBC(Local Back Contact) 구조의 중요성이 강조되고 있다. LBC 구조에서 후면 passivation 형성을 위한 SiNX layer를 PECVD로 형성 시, 실리콘 bulk 내로 H+ 원자가 침투하여 Boron과 결합하게 되면 Boron이 bulk 내에서 dopant로 작용을 하지 못하게 되어, 후면에서 p-층을 형성하고, 이는 VOC의 저하를 야기 시킨다. 본 연구에서는 LBC 구조에서 후면 passivation 시 bluk 내 B-H결합으로 인한 태양전지 특성 저하 문제를 해결하기 위해, SiNX를 증착하기 전에 얇은 산화막 barrier를 성장시켜 Bulk 내에 H+ 침투를 최소화 하였다. PECVD를 이용한 N2O 플라즈마 처리, HNO3 Wet Chemical Oxidation의 방법을 통해 substrate와 SiNX 사이에 얇은 oxide 층을 형성하였으며, 각각의 조건에 대해 lifetime 측정을 실시하였다. 그 결과 SiON/SiNx를 이용한 막의 lifetime이 $94.5{\mu}s$로 가장 우수하였고, Reference에 비해 25.4% 증가함을 확인할 수 있었다. 그러나 HNO3/SiNx에서는 30.6%, SiON에서는 84.3% 감소함을 확인하였다. Voc 측정 결과 또한 SiON/SiNx를 이용한 막이 670mV로 가장 우수함을 확인할 수 있었다. 본 연구를 통해 LBC구조에서 후면에 얇게 SiON/SiNx막을 형성함으로서 H+이온의 침투를 저지하여 후면 B-H결합을 막아 태양전지 특성 저하를 감소시키는 것을 확인할 수 있었다.

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Deposition and Characterization of $HfO_2/SiNx$ Stack-Gate Dielectrics Using MOCVD (MOCVD를 이용한 $HfO_2/SiNx$ 게이트 절연막의 증착 및 물성)

  • Lee Taeho;Oh Jaemin;Ahn Jinho
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.2 s.31
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    • pp.29-35
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    • 2004
  • Hafnium-oxide gate dielectric films deposited by a metal organic chemical vapor deposition technique on a $N_2-plasma$ treated SiNx and a hydrogen-terminated Si substrate have been investigated. In the case of $HfO_2$ film deposited on a hydrogen-terminated Si substrate, suppressed crystallization with effective carbon impurity reduction was obtained at $450^{\circ}C$. X-ray photoelectron spectroscopy indicated that the interface layer was Hf-silicate rather than phase separated Hf-silicide and silicon oxide structure. Capacitance-voltage measurements show equivalent oxide thickness of about 2.6nm for a 5.0 nm $HfO_2/Si$ single layer capacitor and of about 2.7 nm for a 5.7 nm $HfO_2/SiNx/Si$ stack capacitor. TEM shows that the interface of the stack capacitor is stable up to $900^{\circ}C$ for 30 sec.

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A Study on SAW Properties of Bilayer Thin Film Structure Composed of ZnO and Dielectric Thin Films (ZnO 박막과 유전체 박막으로 구성된 이중구조의 물성 및 표면 탄성파 특성)

  • 이용의;김형준
    • Korean Journal of Crystallography
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    • v.6 no.2
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    • pp.134-140
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    • 1995
  • SAW properties of SiNx/ZnO bilayer thin film structure were analyzed. ZnO thin films were deposited by rf magnetron sputter using O2 gas as an oxidizer. Structure of ZnO thin films was affected by Ar/O2 ratio. At the gas ratio of Ar/O2=67/33, the standard deviation of X-ray rocking curve of (002) preferred ZnO thin film was 2.17 degree. This value is sufficient to use ZnO thin films as an acoustic element. SAW velocity of glass/SiNx(7000Å)/Al/ZnO(5μm) structure was max. 2.2% faster than that of ZnO/glass.

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PECVD를 이용한 SiNx 증착 조건에 따른 수소 패시베이션 개선 효과

  • Jo, Guk-Hyeon;Jang, Hyo-Sik
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.200.1-200.1
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    • 2013
  • 실리콘 태양전지 표면에는 구조적인 결함에 의해 소수 캐리어의 재결합이 일어난다. 재결합에 의해 캐리어의 반송자 수명은 줄어들게 되고, 태양전지의 효율은 감소하게 된다. 이를 줄이기 위해 태양전지 전 후면에 패시베이션을 하게 되는데, 이번 연구는 단결정 실리콘 태양전지 전면에 SiNx막을 증착함으로 수소 패시베이션이 반송자 수명에 미치는 영향에 대하여 연구하였다. 공정을 위해 $156{\times}156mm^2$, 200 ${\mu}m$, 0.5-3.0 ${\Omega}{\cdot}cm$ and p-type 단결정 실리콘 웨이퍼를 사용하였고, SiNx막을 올리기 전에 KOH 8.5% 용액으로 SDR을 실행하였다. RF-PECVD 장비로 SiNx 막을 증착하였고 증착 온도는 $200{\sim}400^{\circ}C$, 반응기 내부의 압력을 200~1,000 mtorr, SiH4/NH3/N2 각각의 가스 비율 조절, 그리고 플라즈마 RF power 변화시킴에 따라 증착된 SiNx막의 균일도 및 특성을 분석하였다. 반사광 측정 장비인 Reflectometer장비로 막의 두께와 굴절률, 반사율을 측정하였고, 반송자 수명을 측정하여 태양전지의 표면결함을 최대한 패시베이션 시켜주는 조건에 대한 연구를 수행하였다.

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Corrosion Behavior of High Pressure Die Cast Al-Ni and Al-Ni-Ca Alloys in 3.5% NaCl Solution

  • Arthanari, Srinivasan;Jang, Jae Cheol;Shin, Kwang Seon
    • Corrosion Science and Technology
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    • v.16 no.3
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    • pp.100-108
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    • 2017
  • In this investigation corrosion behavior of newly developed high-pressure die cast Al-Ni (N15) and Al-Ni-Ca (NX1503) alloys was studied in 3.5% NaCl solution. The electrochemical corrosion behavior was evaluated using open circuit potential (OCP) measurement, potentiodynamic polarization, and electrochemical impedance spectroscopy (EIS) techniques. Potentiodynamic polarization results validated that NX1503 alloy exhibited lower corrosion current density ($i_{corr}$) value ($5.969{\mu}A/cm^2$) compared to N15 ($7.387{\mu}A/cm^2$). EIS-Bode plots revealed a higher impedance (${\mid}Z{\mid}$) value and maximum phase angle value for NX1503 than N15 alloy. Equivalent circuit curve fitting analysis revealed that surface layer ($R_1$) and charge transfer resistance ($R_{ct}$) values of NX1503 alloy was higher compared to N15 alloy. Immersion corrosion studies were also conducted for alloys using fishing line specimen arrangement to simultaneously measure corrosion rates from weight loss ($P_W$) and hydrogen volume ($P_H$) after 72 hours and NX1503 alloy had lower corrosion rate compared to N15 alloy. The addition of Ca to N15 alloy significantly reduced the Al3Ni intermetallic phase and further grain refinement may be attributed for reduction in the corrosion rate.

Melittin induces autophagy to alleviate chronic renal failure in 5/6-nephrectomized rats and angiotensin II-induced damage in podocytes

  • Yufan Zhang;Huaping Xu;Hongwei Qiao;Ya Zhao;Minmin Jiang
    • Nutrition Research and Practice
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    • v.18 no.2
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    • pp.210-222
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    • 2024
  • BACKGROUND/OBJECTIVES: Chronic renal failure (CRF) is a complex pathological condition that lacks a cure. Certain Chinese medicines, such as melittin, a major component in bee venom, have shown efficacy in treating CRF patients. On the other hand, the mechanisms underlying the therapeutic effects of melittin are unclear. MATERIALS/METHODS: A 5/6 nephrectomy model (5/6 Nx) of renal failure was established on rats for in vivo assays, and mouse podocyte clone 5 (MPC5) mouse podocyte cells were treated with angiotensin II (AngII) to establish an in vitro podocyte damage model. The 24-h urine protein, serum creatinine, and blood urea nitrogen levels were evaluated after one, 2, and 4 weeks. Hematoxylin and eosin staining, Masson staining, and periodic acid-Schiff staining were used to examine the pathological changes in kidney tissues. A cell counting kit 8 assay was used to assess the cell viability. Reverse transcription polymerase chain reaction and Western blot were used to assess the mRNA and protein levels in the cells, respectively. RESULTS: In the rat 5/6 Nx, melittin reduced the 24-h urinary protein excretion and the serum creatinine and blood urea nitrogen levels. Furthermore, the renal pathology was improved in the melittin-treated 5/6 Nx rats. Melittin promoted podocin, nephrin, Beclin 1, and the LC3II/LC3I ratio and inhibited phosphorylated mammalian target of rapamycin (mTOR)/mTOR in 5/6 Nx-induced rats and AngII-induced MPC5 mouse podocyte cells. Moreover, inhibiting autophagy with 3-MA weakened the effects of melittin on podocin, nephrin, and the LC3II/LC3I ratio in podocytes. CONCLUSION: Melittin may offer protection against kidney injury, probably by regulating podocyte autophagy. These results provide the theoretical basis for applying melittin in CRF therapy.