• JSTS:Journal of Semiconductor Technology and Science
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• v.7 no.1
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• pp.11-19
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• 2007

This paper presents two novel compensation circuits for leakage current and power supply noise (PSN) in phase locked loop (PLL) using a nanometer CMOS technology. The leakage compensation circuit reduces the leakage current of the charge pump circuit which becomes more serious problem due to the thin gate oxide and small threshold voltage in nanometer CMOS technology and the PSN compensation circuit decreases the effect of power supply variation on the output frequency of VCO. The PLL design is based on a 32nm predictive CMOS technology and uses a 0.9V power supply voltage. The simulation results show that the proposed PLL achieves a 88% jitter reduction at 440MHz output frequency compared to the PLL without leakage compensator and its output frequency drift is little to 20% power supply voltage variations. The PLL has an output frequency range of $40M{\sim}725MHz$ with a multiplication range of 11023, and the RMS and peak-to-peak jitter are 5ps and 42.7ps, respectively.

• ETRI Journal
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• v.32 no.3
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• pp.457-459
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• 2010

A low-power down-sampling mixer in a low-power digital 65 nm CMOS technology is presented. The mixer consumes only 830 ${\mu}W$ at 1.2 V supply voltage by combining an NMOS and a PMOS mixer with cascade transistors at the output. The measured gain is (19 ${\pm}$1 dB) at frequencies between 100 MHz and 3 GHz. An IIP3 of -5.9 dBm is achieved.

• Transactions on Electrical and Electronic Materials
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• v.11 no.3
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• pp.93-105
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• 2010

Complementary metal-oxide-semiconductor (CMOS) technology scaling has been a main key for continuous progress in silicon-based semiconductor industry over the past three decades. However, as the technology scaling enters nanometer regime, CMOS devices are facing many serious problems such as increased leakage currents, difficulty on increase of on-current, large parameter variations, low reliability and yield, increase in manufacturing cost, and etc. To sustain the historical improvements, various innovations in CMOS materials and device structures have been researched and introduced. In parallel with those researches, various new nanoelectronic devices, so called "Beyond CMOS Devices," are actively being investigated and researched to supplement or possibly replace ultimately scaled conventional CMOS devices. While those nanoelectronic devices offer ultra-high density system integration, they are still in a premature stage having many critical issues such as high variations and deteriorated reliability. The practical realization of those promising technologies requires extensive researches from device to system architecture level. In this paper, the current researches and challenges on nanoelectronics are reviewed and critical tasks are summarized from device level to circuit design/CAD domain to better prepare for the forthcoming technologies.

• JSTS:Journal of Semiconductor Technology and Science
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• v.7 no.4
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• pp.241-246
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• 2007

This paper presents two novel compensation circuits for leakage current and power supply noise (PSN) in phase locked loop (PLL) using a nanometer CMOS technology. The leakage compensation circuit reduces the leakage current of the charge pump circuit and the PSN compensation circuit decreases the effect of power supply variation on the output frequency of VCO. The PLL design is based on a 32nm predictive CMOS technology and uses a 0.9 V power supply voltage. The simulation results show that the proposed PLL achieves 88% jitter reduction at 440 MHz output frequency compared to the PLL without leakage compensator and its output frequency drift is little to 20% power supply voltage variations. The PLL has an output frequency range of 40 $M{\sim}725$ MHz with a multiplication range of 1-1023, and the RMS and peak-to-peak jitter are 5psec and 42.7 psec, respectively.

• Electronics and Telecommunications Trends
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• v.33 no.6
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• pp.34-40
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• 2018

Traditionally, many researchers have conducted research on terahertz technology utilizing optical devices such as lasers. However, nanometer-scale electronic devices using silicon or III-V compound semiconductors have received significant attention regarding the development of a terahertz system owing to the rapid scaling down of devices. This enables an operating frequency of up to approximately 0.5 THz for silicon, and approximately 1 THz for III-V devices. This article reviews the recent trends of terahertz monolithic integrated circuits based on several electronic devices such as CMOS, SiGe BiCMOS, and InP HBT/HEMT, and a particular quantum device, an RTD.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.11
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• pp.1-7
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• 2008

In this work, a two dimensional, self-consistent Poisson-$Schr{\ddot{o}}dinger$ solver has been implemented to study C-V characteristics in nanometer scale MuGFETs with considering quantum effects. The quantum-mechanical effects on gate-channel capacitance for different device dimension and gate configurations of nanometer scale MuGFETs have been analyzed. It has been found that 4he gate-channel capacitance per unit gate area is increased as the device dimension decreases. For different gate configurations, the gate-channel capacitance is decreased with increase of effective gate number. Those resu1ts have been explained by the distribution profile of electron concentration in the silicon surface and inversion capacitance. The length of inversion-layer centroid has been calculated from inversion capacitance with device dimension and gate configurations.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.2
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• pp.95-103
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• 2011

This paper proposes a 6b 1.2 GS/s 47.8 mW 0.17 $mm^2$ 65 nm CMOS ADC for high-rate wireless personal area network systems. The proposed ADC employs a source follower-free flash architecture with a wide input range of 1.0 $V_{p-p}$ at a 1.2 V supply voltage to minimize power consumption and high comparator offset effects in a nanometer CMOS technology. The track-and-hold circuits without source followers, the differential difference amplifiers with active loads in pre-amps, and the output averaging layout scheme properly handle a wide-range input signal with low distortion. The interpolation scheme halves the required number of pre-amps while three-stage cascaded latches implement a skew-free GS/s operation. The two-step bubble correction logic removes a maximum of three consecutive bubble code errors. The prototype ADC in a 65 nm CMOS demonstrates a measured DNL and INL within 0.77 LSB and 0.98 LSB, respectively. The ADC shows a maximum SNDR of 33.2 dB and a maximum SFDR of 44.7 dB at 1.2 GS/s. The ADC with an active die area of 0.17 $mm^2$ consumes 47.8 mW at 1.2 V and 1.2 GS/s.

• Journal of Korea Society of Industrial Information Systems
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• v.16 no.5
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• pp.1-8
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• 2011

This paper proposes a new input pattern generator for minimal leakage power in the nanometer CMOS technology considering all the leakage current components (sub-threshold leakage, gate tunneling leakage, band-to-band tunneling leakage). Using the accurate macro-model, a heuristic algorithm is developed to generate a input pattern for the minimum leakage. The algorithm applies to ISCAS85 benchmark circuits, and the results are compared with the results of Hspice. The simulation result shows that our method's accuracy is within a 5% difference of the Hspice simulation results. In addition, the simulation time of our method is far faster than that of the Hspice simulation.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.2
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• pp.112-118
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• 2015

Conventional synchronous circuits cannot keep the circuit performance, and cannot even guarantee correct operations under the influence of PVT variations and aging effects in the nanometer regime. Therefore, in this paper, a DI (delay insensitive) design based NCL (Null Convention Logic) design methodology with a very simple design structure has been used to design digital systems, which is one of well-known asynchronous design methods robust to various variations and does not require any timing analysis. Because circuit-level structures of conventional NCL gates have weakness of low speed, high area overhead or high wire complexity, this paper proposes a new lNCL gates designed at the transistor level for high-speed, low area overhead, and low wire complexity. The proposed NCL gate libraries have been compared to the conventional NCL gates in terms of circuit delay, area and power consumption using a asynchronous multiplier implemented in dongbu 0.11um CMOS technology.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.3
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• pp.159-167
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• 2005

Quantization effects (QEs), which manifests when the device dimensions are comparable to the de Brogile wavelength, are becoming common physical phenomena in the present micro-/nanometer technology era. While most novel devices take advantage of QEs to achieve fast switching speed, miniature size and extremely small power consumption, the mainstream CMOS devices (with the exception of EEPROMs) are generally suffering in performance from these effects. In this paper, an analytical model accounting for the QEs and poly-depletion effects (PDEs) at the silicon (Si)/dielectric interface describing the capacitance-voltage (C-V) and current-voltage (I-V) characteristics of MOS devices with thin oxides is developed. It is also applicable to multi-layer gate-stack structures, since a general procedure is used for calculating the quantum inversion charge density. Using this inversion charge density, device characteristics are obtained. Also solutions for C-V can be quickly obtained without computational burden of solving over a physical grid. We conclude with comparison of the results obtained with our model and those obtained by self-consistent solution of the $Schr{\ddot{o}}dinger$ and Poisson equations and simulations reported previously in the literature. A good agreement was observed between them.