• 반도체디스플레이기술학회지
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• 제9권3호
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• pp.47-51
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• 2010

This paper presents a wafer pre-alignment system which is improved using the image of the entire wafer area. In the previous method, image acquisition for wafer takes about 80% of total pre-alignment time. The proposed system uses only one image of entire wafer area via a high-resolution CMOS camera, and so image acquisition accounts for nearly 1% of total process time. The larger FOV(field of view) to use the image of the entire wafer area worsen camera lens distortion. A camera calibration using high order polynomials is used for accurate lens distortion correction. And template matching is used to find a correct notch's position. The performance of the proposed system was demonstrated by experiments of wafer center alignment and notch alignment.

• 반도체디스플레이기술학회지
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• 제9권1호
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• pp.11-16
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• 2010

Wafer Pre-Alignment is to find the center and the orientation of a wafer and to move the wafer to the desired position and orientation. In this paper, an area camera based pre-aligning method is presented that captures 8 wafer images regularly during 360 degrees rotation. From the images, wafer edge positions are extracted and used to estimate the wafer's center and orientation using least squares circle fitting. These data are utilized for the proper alignment of the wafer. For accurate alignments, camera calibration methods using high order polynomials are used for converting pixel coordinates into real-world coordinates. A complete pre-alignment system was constructed using mechanical and optical components and tested. Experimental results show that alignment of wafer center and orientation can be done with the standard deviation of 0.002 mm and 0.028 degree, respectively.

• 유공압시스템학회논문집
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• 제8권3호
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• pp.14-20
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• 2011

This study aims at aligning multiple wafers to reduce wafer handling time in wafer processes. We designed a multilevel structure for a prealigner which can handle multiple wafer simultaneously in a system. The system consists of gripping parts, kinematic parts, vacuum chucks, pneumatic units, hall sensors and a DSP controller. Aligning procedure has two steps: mechanical gripping and notch finding. In the first step, a wafer is aligned in XY directions using 4-point mechanical contact. The rotational error can be found by detecting a signal in a notch using hall sensors. A dual prealigner was designed for 300mm wafers and constructed for a performance test. The accuracy was monitored by checking the movement of a notch in a machine vision. The result shows that the dual prealigner has enough performance as commercial products.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2009년도 추계학술대회
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• pp.410-413
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• 2009

웨이퍼 Pre-Alignment는 반도체 공정에서 장비에 웨이퍼를 놓기 전에 웨이퍼의 중심 및 방향을 정확하게 정렬할 필요가 있는데, 이를 위해서 일정한 수준 이하로 중심과 방향을 찾아 Alignment 하는 방법을 말한다. 본 논문에서는 웨이퍼를 Alignment 하기 위해 기존의 Mechanical한 방법이 아닌 Area 카메라를 통한 비접촉식 방법을 이용하였다. 이 방법은 웨이퍼를 45도씩 8번씩, 한 바퀴를 회전하여 이미지를 획득한 뒤, 이미지의 웨이퍼의 에지값 들을 이용하여 Least Square Circle Fitting을 이용하여 웨이퍼의 중심과 방향을 정확하게 측정하여 Alignment를 한다.

• 제어로봇시스템학회논문지
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• 제8권9호
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• pp.812-817
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• 2002

This paper presents a development of high accuracy aligner and describes a method to find the orientation of a substantially circular disk shaped wafer with at least one flat region on an edge thereof. In the developed system, the wafer is spun one 360 degree turn on a chuck and the edge position is measured by a linear array to obtain a set of data points at various wafer orientation. The rotation axis may differ from wafer center by an unknown eccentricity. The flat angle is found by fitting a cosine curve to the actual data to obtain a deviation. The maximum deviation is then corrected for errors due to a finite number of data points and wafer eccentricity by calculating an adjustment angle from data points on the wafer fiat. After determining the flat angle the wafer is spun to the desired orientation. The wafer eccentricity can be calculated from four of the data points located away from the flat edge region. and the wafer is then centered.

• 대한물리치료과학회지
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• 제6권2호
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• pp.1041-1062
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• 1999

This study is to stimulate the model of which top notch muscle stimuli physical therapy has been made on the basis of GCM. GCM has been studied on the hypermobility & hypomobility pattern on the part of spine & extremity, and the body characteristics of four body types, which is the tilting of seal scapular & ilium. The purpose of this study is to analysize the type of GCM which has been focused on the spine & extremity for the patients having dysfunctions of neuromuscular system, being analysized the movement. The result of this study is as following; 1) The First hypothesis: The hypermobility & hypomobility pattern assorted by the tilting of scapular & ilium, as does the former study analysize was claimed that it would be in line with the pattern for hypermobility hypomobility and physical characteristics according to each body type at the percentage of at least 60(p<.001). 2) The 2nd hypothesis : Stimuli therapy of muscle dealing with physical characteristics and joint hypermobility hypomobility has the important role in restoring the deformity and keeping anatomical postural plumb alignment also it would a highly effects on correcting the body even though the stimuli area was limited to four areas and it was lack of time compared with those applied by general physical therapy(p<.001). As above the result, the top-notch type for physical therapy based on hypermobility hypomobility pattern by 4 body types which has been studied on tilting of scapular & ilium is more specificed and specialized than those of general physical therapy technologies. So this study will be believed to dedicate to restoration ideal anatomical postural plumb alignment based on spinal Manipulation and the concept of whole person as well as to being simple and effective to apply.

• 한국항행학회논문지
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• 제13권3호
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• pp.412-418
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• 2009

본 논문에서는 노치형 웨이퍼 20~25개를 일련번호가 같은 위치에 자동으로 정렬이 되도록 하여 반도체 공정 전, 후 감지기에 의해 웨이퍼의 공정상태 파악을 용이하게 하는 시스템 개발 및 정확하게 노치를 정렬하는 보정 알고리즘, 스테핑 모터 제어 알고리즘을 제안하였다. 웨이퍼 회전 시 표면 재질이 적당한 마찰 계수를 가지며 웨이퍼의 회전으로 파티클(Particle)이 발생하지 않는 소재를 사용하여 발생을 최소화 시킬 수 있었다. 또한 미끄럼 방지를 위한 기구설계 기술을 개발하였고, 수학적 검증을 통한 성능평가를 실시하였다. 본 연구 개발 시스템은 반도체 공정 진행 중 웨이퍼의 오염 방지로 반도체 수율을 향상 시킬 수 있으며, 향후 450mm 이상의 대형 웨이퍼 생성 시에도 탄력적으로 적용 할 수 있다.

• 대한의용생체공학회:의공학회지
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• 제17권4호
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• pp.449-458
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• 1996

Most of the conventional electrocardiowaphs foil to detect signals other than P-QRS-T due to the limited SNR and bandwidth. High-resolution electrocardiography(HRECG) provides better SNR and wider bandwidth for the detection of micro-potentials with higher frequency components such as vontricular late potentials(LP). We have developed a HRECG using uncorrected XYZ lead for the detection of LPs. The overall gain of the amplifier is 4000 and the bandwidth is 0.5-300Hz without using 60Hz notch filter. Three 16-bit A/D converters sample X, Y, and Z signals simultaneously with a sampling frequency of 2000Hz. Sampled data are transmitted to a PC via a DMA-controlled, optically-coupled serial communication channel. In order to further reduce the noise, we implemented a signal averaging algorithm that averaged many instances of aligned beats. The beat alignment was carried out through the use of a template matching technique that finds a location maximizing cross-correlation with a given beat tem- plate. Beat alignment error was reduced to $\pm$0.25ms. FIR high-pass filter with cut-off frequency of 40Hz was applied to remove the low frequency components of the averaged X, Y, and Z signals. QRS onset and end point were determined from the vector magnitude of the sigrlaIL and some parameters needed to detect the existence of LP were estimated. The entire system was designed for the easy application of the future research topics including the optimal lead system, filter design, new parameter extraction, etc. In the developed HRECG, without signal averaging, the noise level was less than 5$\mu$V$_rms RTI$. With signal averaging of at least 100 beats, the noise level was reduced to 0.5$\mu$V$_rms RTI$, which is low enough to detect LPs. The developed HRECG will provide a new advanced functionality to interpretive ECG analyzers.

• 대한치과보철학회지
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• 제61권1호
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• pp.18-25
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• 2023

본 증례는 65세 남환으로, 10년 전 편도암으로 하악골이단술을 시행한 환자에서 중립대를 활용한 상하악 총의치 수복 증례이다. 본 환자는 무치악 기간이 짧아 치초제의 흡수가 거의 없으며, 혀의 운동기능에도 이상이 없었지만, 수술 이후의 변화로 인해 하악의 후구치 삼각융기가 상악의 구상절흔보다 안쪽에 위치해 있으며 하악의 구치부 치조제는 상대적으로 설측으로 돌아간 구조를 보였다. 만약 통상적으로 해부학적 지표를 참고하여 치아를 배열한다면, 혀의 기능 공간을 침범하게 되며, 이는 의치의 안정성을 저하시킬 것이다. 이런 경우 중립대 개념을 적용한 의치의 제작은 좋은 참고점이 될 수 있을 것이다. 연성 이장재를 사용하여 중립대를 인기하였으며, 이를 인덱스로 제작하여 치아배열을 시행하였다. 중립대의 가장 큰 장점은 의치의 안정을 얻는 것에 있다. 본 환자의 경우 하악 좌측 구치부가 혀 공간을 침범하지 않도록 구치 치아의 설측배열 한계를 얻기 위해 중립대 기법을 적용하였다. 특히, 치조제의 흡수로 의치의 안정성을 얻기 어려운 난증례 환자의 경우 이러한 방법을 사용한다면 의치의 안정성 면에서 더욱 좋은 결과를 얻을 수 있을 것이라 보기에 본 증례를 보고하는 바이다.