• Journal of the Semiconductor & Display Technology
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• v.5 no.4 s.17
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• pp.29-34
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• 2006

In order to design an OLED(Organic Luminescent Emitting Device) evaporation system, geometric simulation of film thickness distribution profile is required. For the OLED evaporation process, thin film thickness uniformity is of great practical importance. In this paper, a geometric modeling algorithm is introduced for process simulation of the OLED evaporating process. The physical fact of the evaporating process is modeled mathematically. Based on the developed method, the thickness of the thin-film layer can be successfully controlled.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1444-1447
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• 2004

For the OLED evaporation process, thin film thickness uniformity is of great practical importance. In order to achieve the better thickness uniformity, geometric simulation of film thickness distribution profile is required. In this paper, a geometric modeling algorithm is introduced for process simulation of full-color OLED evaporating system. The physical fact of the evaporation process is modeled mathematically. Based on the developed method, the uniformity of the organic layer thickness can be successfully controlled.

• Journal of the Semiconductor & Display Technology
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• v.7 no.1
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• pp.35-40
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• 2008

In OLED vacuum evaporation process, the essential requirements include good uniformity of the film thickness over a glass substrate. And, it is commercially significant to improve the consuming efficiency of material of the evaporant which is deposited on the substrate because of high price of organic materials. In this paper, to achieve the better thickness uniformity and the better organic material consuming rate, a process optimization algorithm was developed by understanding vacuum evaporation process parameters that affect the material consuming efficiency and the uniformity of film thickness. Based on the method developed in this study, the vacuum evaporation process of OLED was successfully controlled. The developed method allowed the manufacture of high quality OLED displays with cheaper fabrication cost.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.487-490
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• 2004

In order to simulate OLED evaporation process, modeling of directional distribution of the vaporized organic materials, film thickness distribution profile and pattern-mask shadow effect are required In accordance with many literatures; all of them except shadow effect modeling are studied and developed. In this paper, modeling algorithm of evaporation shadow is presented for process simulation of full-color OLED evaporating system. In OLED evaporating process the offset position of the point cell-source against the substrate rotation axis and the usage of the patterned mask are the principal causes for evaporation shadow. For geometric simulation of shadow using z-map, the film thickness profile, which is condensed on a glass substrate, is converted to the z-map data. In practical evaporation process, the glass substrate is rotated. This physical fact is solved and modeled mathematically for z-map simulation. After simulating the evaporation process, the z-map data can present the shadow-effected film thickness profile. Z-map is an efficient method in that the cross-sectional presentations of the film thickness profile and thickness distribution evaluation are easily and rapidly achieved.

• Journal of Institute of Control, Robotics and Systems
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• v.22 no.7
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• pp.557-561
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• 2016

Recently, in the manufacturing process of flat panel displays, mass production methods of inline system has been emerged. In particular the next generation OLED display manufacturing process, horizontal inline evaporation process has been tried. It is important for the success of OLED inline evaporation process to develop a magnetic levitation transport system capable of transferring a carrier equipped with a mother glass with high accuracy without any physical contact along the rail under vacuum condition. In the case of existing wheel-based transfer system, it is not suitable for OLED evaporation process requiring high cleanliness. On the other hand, the magnetic levitation transport system has an advantage that it does not generate any dust and it is possible to achieve high-precision control because there are not non-linear factors such as friction force. In this paper, we introduce the high-precision magnetic levitation transport system, which is currently under development, for OLED evaporation process.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.37-42
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• 2009

The performance of an OLED(organic luminescent emitting device) fabrication system strongly depends on the design of the evaporation cell-source. Trends in display sizes have hauled the enlargement of mother glass substrates. The enlargement of substrates requires the improvement and the enlargement of the effusion cell-source for OLED evaporation process. The deposited layers should be as uniform as possible, and therefore it is important to know the effusion profile of the molecules emitted from the cell-source. Conventional 2D DSMC algorithm cannot be used for simulating the new concept cell-source design, such as a linear source. This work concerns the development of 3D DSMC (direct simulation Monte Carlo) analysis for simulating the behavior of the evaporation cell-sources. In this paper, the 3D DSMC algorithm was developed and the film thickness profiles were obtained by the numerical analysis.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.11
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• pp.956-960
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• 2009

The characteristics of organic films can be affected by the temperature of evaporation source because the temperature of evaporation source has an effect on substrate temperature during OLED fabrication process using the thermal evaporation. To investigate the characteristics of OLED devices fabricated by using thermally damaged organic films, I-V-L and half life-time in OLED devices fabricated with various substrate temperatures were measured. During emission layer(EML) evaporation, OLED devices with a structure of ITO(100 nm)/ELM200(50 nm)/NPB(30 nm)/$Alq_3$(55 nm)/LiF(0.7 nm)/Al(100 nm) were fabricated at various substrate temperatures(room temperature, $30^{\circ}C$, $40^{\circ}C$, and $50^{\circ}C$). The characteristics of current density and luminance versus applied voltage in OLED devices fabricated shows that many electrical currents flowed and high brightness appeared at low voltage, but that the lifetime of OLED devices dropped suddenly. This phenomenon explained that the crystallization of $Alq_3$ thin film appeared owing to the substrate heating during evaporation.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.987-989
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• 2006

1.52" $130(RGB){\times}130$ full color PM OLED device with $70\;{\mu}m{\times}210\;{\mu}m$ of sub-pixel pitch was fabricated using shadow mask method for metal cathode deposition. Instead of conventional patterning process to form cathode separator via photolithography, regularly patterned shadow mask was applied to deposit metal cathode in this OLED display. Metal cathode was patterned via 2-step evaporation using shadow mask with shape of rectangular stripe and its alignment margin is $2.5\;{\mu}m$. Technical advantages of this method include reduction of process time according to skipping over photolithographic process for cathode separator and minimizing pixel shrinkage caused by PR cathode separator as well as improving lifetime of OLED device.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1689-1691
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• 2006

DuPont Displays has developed a new solution printing fabrication process for OLED displays, using small molecule OLED materials. The new manufacturing process is more cost-effective and scalable than evaporation of materials through physical masks, and addresses issues associated with ink jet printing. A new material (DB) has been developed for use as a hole-injection layer in OLEDs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.264-266
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• 2005

Manufacture of OLED device used thermal evaporation method. However thermal evaporation method has many defect as thermal damage of substrate, difficult of dopant rate control and low utilization of organic materials. so we suggest PLD(Pulsed Laser Deposition) method that solution of these problems. PLD method has many advantage as without thermal damage, easy indicate of deposition rate per one pulse and good utilization of organic materials. In this paper we apply the PLD method for manufacture of device so we present high efficiency device manufacture using PLD method that has good deposition uniformity, surface rough and deposition rate.