• Proceedings of the Optical Society of Korea Conference
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• 1991.07a
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• pp.41-46
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• 1991

A block quantized binary phase hologram is introduced for optical interconnection and encoded with a simulated alogorithm to achieve high diffraction efficiency and superession of unwanted spots. The block quantized binary phase holograms encoded with the algorithm are fabricated with electron beam lithography and chemical etching. the fabricated holograms showed excellent perfoemances for optical interconnection.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.13-18
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• 2012

By the need for high-speed data transmission in PCB, the studies on the optical PCB has been conducted with optical interconnection and its packaging technology. Particularly, the polymer-based optical interconnection has been extensively studied with the advantages such as cost-effective and ease of process. For high-efficiency and passive alignment, the studies were performed using the 45 degree mirrors, MT connector, and etc. In this work, integrated PLC device and fiber alignment array block was fabricated by using imprint technology to solve the alignment and array problem of optical device and the optical fiber. The fabricated integrated block for optical interconnection of PLC device has achieved higher precision of decreasing the dimensional error of the patterns by optimization of process and its insertion loss has an average value of 4.03dB, lower than criteria specified by international standard. In addition, a optical waveguide with built-in lens has been proposed for high-efficiency and passive alignment. By simulation, it was confirmed that the proposed structure has higher coupling efficiency than conventional no-lens structure and has the broad tolerance for the spatial offset of optical waveguide.

• Proceedings of the IEEK Conference
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• 2001.06a
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• pp.375-378
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• 2001

A 640Gb/s very advanced ATM switching system using 0.25um CMOS VLSI, 40 layer ceramic MCM and 10Gb/s, 8 wavelength 8$\times$8 optical WDM interconnection has been fabricated. To break though the interconnection bottleneck, optical WDM interconnection is used. It has 20Gb/s 8 wavelength 8$\times$8 interconnection capability. It realizes 640Gb/s interconnections within a very small size. Preliminary tests show that 800b1s ATM switch MCM and optical WDM interconnection technologies can be applied to future high speed broadband networks

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.5
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• pp.60-70
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• 1995

As a Basic study to implement a wide-band photonic switching sysetm, we proposed a scheme of free-space-division-multiplexed photonic switching based on a holographic interconnectio method and carried out simple experiments on it. First, we recorded holgraphic interconnection element array for nonblocking optical interconnections. Just a single stage of the array realizes full optical interconnections between NN${\times}$NN input prots and NN${\times}$NN output ports in 3-D space. Next, in reading of the array for optical internnections, we showed that the zeroth-order diffacted beam could be eliminated in the output port by introducing a right angle prism. The elimination of the zeroth-order diffracted beam reduces optical noise in the output ports and provides conveniences of interconnection control in our scheme. Finally, from the experiments on ON-OFF switching of the optical interconnection paths one by one using a spatial (display of the liquid crystal telecision), we showed the feasibility of photonic wsitching based on the holographic interconnection method. We also estimated approximately the maximum interconnectio scale that can be realized without difficulty with current optical devices.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.12
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• pp.1376-1381
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• 2012

Optical devices are used extensively in the field of information network. Increasing demand for optical device, optical interconnection has been a important issue for commercialization. However many problems exist in the interconnection between optical device and optical fiber, and in the case of the multi-channel, problems of the optical alignment and optical array arise. For solving the alignment and array problem of optical device and the optical fiber, we fabricated fiber alignment and array by using imprint technology. Achieved higher precision of optical fiber alignment and array due to fabricating using imprint technology. The silicon stamp with different depth was fabricated using the conventional photolithography. Using the silicon stamp, a nickel stamp was fabricated by electroforming process. We conducted imprint process using the nickel stamp with different depth. The optical alignment and array by fabricating the patterns of optical device and fiber alignment and array using imprint process, and achieved higher precision of decreasing the dimensional error of the patterns by optimization of process. The fabricated optical interconnection of PLC device was measured 3.9 dB and 4.2 dB, lower than criteria specified by international standard.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.1-5
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• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

• Journal of the Optical Society of Korea
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• v.1 no.1
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• pp.52-59
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• 1997

In this paper, we propose a system design for a parallel3-dimensional optical interconnection network utilizing variable grating mode liquid crystal devices (VGM LCD's) which are optical transducers capable of performing intensity-to-spatial-frequency conversion. The proposed system performs real-time, reconfigurable, but blocking and nonbroadcasting 3-dimensional optical interconnections. The operating principles of the 3-D optical interconnection network are described, and some of the fundamental limitations are addressed. The system presented in this paper can be directly used as a configuration of switching elements for the 2-D optical perfect-shuffle dynamic interconnection network, as well as for a B-ISDN photonic switching system.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.12
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• pp.16-22
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• 1994

In this paper, transmitter and receiver modules for free space optical interconnection are implemented and characterized. In the transmitter module, bias circuitry which inject current into the direct modulated laser diode is fabricated and in the receiver module, p-i-n diode is integrated with an MMIC amplifying stage. Laser diode has a direct-modulated bandwidth of 2 GHz at 1.4 Ith bias while p-i-n diode and amplifying stage has a bandwidth of 1.3 GHz and 1.5 GHz, repectively. Optical interconnection has a bandwidth of 1.3 GHz and linearly transmit modulated voltage signal up to 1.5 Vp-p. Measured loss of optical interconnection is 5dB which is composed of optoelectronic conversion loss of 15 dB, electrical impedance mismatch loss of 6.7 dB in transmitter module and gain of 18 dB in receiver module. Seperation between transmitter and receiver can be extended up to 50 cm by using a lens.

• ETRI Journal
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• v.39 no.5
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• pp.632-642
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• 2017

Digital all-optical parallel computing is an important research direction and spans conventional devices and convergent nano-optics deployments. Optical bus-based interconnects provide interesting aspects such as relative information communication speed-up or slow-down between optical signals. This aspect is harnessed in the newly proposed All-Optical Linear Array with a Reconfigurable Pipelined Bus System (OLARPBS) model. However, the physical realization of such communication interconnects needs to be considered. This paper considers spatial layouts of processing elements along with the optical bus light paths that are necessary to realize the corresponding interconnection requirements. A metric in terms of the degree of required physical constraint is developed to characterize the variety of possible solutions. Simple algorithms that determine spatial layouts are given. It is shown that certain communication interconnection structures have associated intrinsic topologies.

• Journal of the Optical Society of Korea
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• v.7 no.1
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• pp.1-6
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• 2003

Integration and miniaturization at the systems level are key requirements for photonics applications. Here, we describe the concept of planar integration of free-space optical systems and its use as an optical interconnection technology. Two specific applications will be considered, a parallel chip-to-chip interconnect and an optical clock distribution network.