• 한국기계가공학회지
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• 제15권3호
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• pp.28-35
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• 2016

Forging operations are non-stationary processes occurring because of indirect pressure, generally, under conditions of three-dimensional stress and deformation. Furthermore, due to friction and the constraints of die geometry, deformation is not homogeneous. Material flow and deformation are largely determined by the shape of the tools. It is well known that net-shape forging can improve the mechanical strength of the final product as well as reduce material waste. Oxygen-free copper that is used for electrical and electronic components has excellent electrical and thermal conductivity. Oxygen-free copper parts have a low productivity in cutting process. Thus, the forging process is performed in order to improve the low productivity in cutting process. The forging of oxygen-free copper for electrode body parts was modeled using finite element simulation and forging experiments that were conducted for producing electrode body parts at room temperature. In order to reduce the cost of cutting products, the forging was performed in a closed cavity to obtain near-net or net-shape parts.

• 한국재료학회지
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• 제17권10호
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• pp.521-525
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• 2007

The microstructure and mechanical properties of an oxygen free copper processed by accumulative roll bonding(ARB) at low strain rate were studied. The copper sheets were highly strained up to an equivalent strain of ${\sim}6.4$ by ARB process at ambient temperature. The strain rate of the copper during the ARB was $2.6sec^{-1}$. The microstructure and mechanical properties of the ARB-processed copper were compared to those of the specimens processed by ARB at relatively high strain rate ($37sec^{-1}$). The microstructure and mechanical properties of the copper with ARB process was very similar to each other despite of some differences in recovery.

• Journal of Welding and Joining
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• 제23권1호
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• pp.77-85
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• 2005

The structures and mechanical properties of friction stirred welds of oxygen free copper(OFC) sheet were investigated. Defect-free welds were obtained in a relatively wide range of the welding conditions from 1000 to 2000 rpm, and welding speed from 500 to 2000 mm/min. The microstructure of the stirred zone(SZ) showed recrystallized grains, and the gram size varied largely with the welding conditions. The SZ hardness values including those of all the optimum welding conditions were slightly lower than that of the base metal, and increased with decreasing heat input. The tensile strength of the all-SZ increased with increasing the hardness values. The Hall-Fetch relationship was confirmed between the yield strength of the all-52 and the recrystallized grain size of the SZ.

• 한국재료학회지
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• 제15권9호
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• pp.555-559
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• 2005

An oxygen free copper severely-deformed by eight cycles (an equivalent strain of $\~6.4$) of accumulative roll-bonding (ARB) was annealed at various temperatures ranging from 100 to $300^{\circ}C$. The annealed copper was characterized by transmission electron microscopy (TEM) and tensile & hardness test. TEM observation revealed that the ultrafine grains developed by the ARB still remained up to $150^{\circ}C$, however above $200^{\circ}C$ they were replaced by equiaxed and coarse grains due to an occurrence of the static recrystallization. Tensile strength and hardness of the copper decreased slightly with the annealing temperature up to $150^{\circ}C$, however they dropped largely above $200^{\circ}C$. Annealing characteristics of the copper were compared with those of a commercially pure aluminum processed by ARB and subsequently annealed.

• 한국재료학회지
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• 제15권4호
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• pp.240-245
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• 2005

An oxygen free copper was severely deformed by accumulative roll-bonding (ARB) process for improvement of its mechanical properties. Two copper sheets 1 m thick, 30 mm wide and 300 m long are first degreased and wire-brushed for sound bonding. The sheets are then stacked to each other, and roll-bonded by about $50\%$ reduction rolling without lubrication at ambient temperature. The bonded sheet is then cut to the two pieces of same dimensions and the same procedure was repeated to the sheets up to eight cycles $(\varepsilon-6.4)$. TEM observation revealed that ultrafine grains were developed after the third cycle, and their size was slightly increased at higher cycles. Tensile strength of the copper increased with the strain at low strain levels, but it hardly increased from 3 cycles $(\varepsilon>2.4)$ due to occurrence of dynamic recovery, even if the imposed strain increased.

• 대한기계학회논문집A
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• 제33권4호
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• pp.425-429
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• 2009

The protection for copper tarnish was developed by surface treatment method and volatile corrosion inhibiting (VCI) technology. The performance of surface treatment and VCI material is also examined in simulated test environment. Benzotriazole (BTAH) solution that contained molybdate showed best performance than others. Usage of VCI materials with surface treatment was more effective. The protection film foamed on the surface of copper was investigated by auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS). Molybdate does not participate in the formation of the protective film but promotes the passivation effect. This facilitates the stabilization of the cuprous oxide film, and strengthens the adsorption of BTAH.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.922-925
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• 2002

Klystron which is micro wave amplifier tube are mainly used in fields of science such as accelerator, nuclear fusion, broadcasting, communication fields, and defense industry fields, tract. The quality of Klystron anode and cavity are determined by form accuracy and roughness of the worked surface. Therefore anode and cavity are restricted the from accuracy strictly and the surface roughness be under Rmax 0.03S. As a work material of anode and cavity, the oxygen-free copper, that is used for optical pares of aerospace and laser mirror is selected. An outside diameter of material is $\Phi$100 mm and an inside diameter is $\Phi$30~33 mm. In this study, to find the optimum ultra precision cuffing condition of oxygen-free copper with diamond turning machine, the surface roughness is examined for various diamond toot nose radius, main spindle speed, fred rate and depth of cut. As a result of experiment, we could machined the anode and cavity with a surface roughness within Ra 3.2 nm, a form accuracy within 0.01 $\mu\textrm{m}$.

• 대한금속재료학회지
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• 제48권1호
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• pp.77-84
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• 2010

Annealing characteristics of an oxygen free copper (OFC) processed by differential speed rolling (DSR) were investigated in detail. An OFC sample with a thickness of hum was rolled to 35% reduction at ambient temperature without lubrication, varying the differential speed ratio from 1.0:1 to 2.2:1, and then annealed for 0.5h at various temperatures from 100 to $400^{\circ}C$. Different recrystallization behavior was observed depending on the differential speed ratio, especially in the case of annealing at $200^{\circ}C$ Complete recrystallization occurred in the specimens annealed at temperatures above $250^{\circ}C$ regardless of the differential ratios. The hardness distribution in the thickness direction of the rolled OFC sheets varied depending on the differential speed ratios. These annealing characteristics were explained by the magnitude of shear strain introduced during rolling.

• 대한금속재료학회지
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• 제47권2호
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• pp.121-128
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• 2009

The strain, microstructure and mechanical properties through thickness of an oxygen free copper(OFC) processed by differential speed rolling(DSR) were investigated in detail. The OFC sample with thickness of 1 mm was rolled to 35% reduction at ambient temperature without lubrication changing the differential speed ratio from 1.0:1 to 2.2:1. The shear strain introduced by the conventional rolling showed positive values at positions of upper roll side and negative values at positions of lower roll side. However, it showed zero or positive values at all positions for the samples rolled by the DSR. The effects of strain distribution through thickness of the coper sheets on microstructure, texture and mechanical properties are discussed in the present study.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 1999년도 제1회 학술대회논문집(KIASC 1st conference 99)
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• pp.22-25
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• 1999

A well oriented Bi-2212 superconductor thick films were fabricated by screen printing with a Cu-free Bi-Sr-Ca-Cu-O powder on a copper plate and heat-treating at 820- $880^{\circ}C$for several minute in low oxygen pressure or are. At minute in low oxygen pressure of air. At , the printing layer partially melted by reaction between the Cu-free precursor by reaction between the Cu-free$870^{\circ}C$ precursor and CuO of the oxidizing copper plate. It is believed that the solid phase is Bi : Sr : Ca : Cu = 2 : 2 : 0 : 1. It is likely that the Bi-2212 superconducting phase is formed at Bi-2212 superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows.