• Resources Recycling
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• v.21 no.3
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• pp.56-64
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• 2012

It is generally well known that PCB (Printed Circuit Board) is an electric component assembled by various metals mixed with plastics and ceramics. Accordingly, it is very important to extract metallic components from used PCBs from the point of view of recycling of used resources as well as an environmental protection. In this paper, patents and paper on the recycling technologies of PCB were analyzed. The range of search was limited in the open patents of USA (US), European Union (EP), Japan (JP), Korea (KR) and SCI journals from 1980 to 2011. Patents and journals were collected using key-words searching and filtered by filtering criteria. The trends of the patents and journals was analyzed by the years, countries, companies, and technologies.

• Proceedings of the Korean Society of Soil and Groundwater Environment Conference
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• 1996.11a
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• pp.39-49
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• 1996

Hundreds of contaminated sites have been generated due to the past mismagement of toxic substances, the lack of adequate environmental controls and ignorance of the potential environmental impacts of general activities in Canada. The general public, industry and governments have been addressing the contaminated sites with a number of cleanup responses. Environmental protection and remediation have become top priorities for the public and private sectors alike in Canada. Between the late 1980s and the early 1990s, the Canadian Environmental Protection Act and Canada's Green Plan were followed by provincial and territorial laws and policies to regulate contaminated sites. The National Contaminated Site Remediation Program(NCSRP) was initiated in 1989. It has been administered through bilateral agreements between the federal and participating provincial/territorial governments. They have committed a total of $250 million toward orphan site cleanup and technology development/demonstration over a five year period. The federal government has committed an additional $25 million to assess contaminated sites on federal crown land. Over 40 orphan high-risk contaminated sites, over 230 federal sites and over 35 technology development/demonstration projects have been addressed. The Canadian Council of Ministers of the Environment has developed a series of guidance documents to ensure a consistent and successful implementation of the Program. The management/regulation scheme of contaminated sites generally consists of： 1) identifying and investigating sites, 2) determining site contamination, 3) recognizing responsibility and liability, 4) assessing priority for remediation, 5) activation, evaluation and implementing remediation options, and 6) documenting remediation completion. The NCSRP supported the successful development/demonstration of a wide range of innovative remedial technologies. They are related to stabilization/solidification, thermal washing/flushing, advanced oxidation, sonics, and groundwater contaminated with hydrocarbons, PAHS, PCBs, heavy metals, and other hazardous pollutants in a variety of site environments.

• Journal of Korea Soil Environment Society
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• v.4 no.2
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• pp.185-192
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• 1999

To assess the soil quality of Chonan City, soil analyses were conducted according to the 14 different sampling sites. The soil pH of the agricultural area near the expressway was lower than that of the other farming area, which indicated that this acidification was probably attributed to the acid rain caused by the traffic exhaust gas such as SOx and NOx. Acidification was more severe in the dry farming area than in the rice paddy area. All concentration of 6 different heavy metals (As, Cu, Cd, $Cr^{6+}$, Hg, Pb) and organic contaminants (cyanide, organic-p, PCBs, phenols) were found to be lower than the standard of soil pollution. The concentration of BTEX also lower than the standard of soil pollution. An assessment using the SPI (Soil Pollution Index). which was developed to estimate an overall soil quality, was performed. Each SPC (Soil Pollution Score) were evaluated with the results of the data from this study. The soil quality of most area of Chonan City was determined to Class 1 , which indicated that the soil was healthy.

• Proceedings of the Korean Society of Soil and Groundwater Environment Conference
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• 2005.04a
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• pp.28-30
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• 2005

Because of high population diversity in soil microbial communities, it is difficult to accurately assess the capability of biodegradation of toxicant by microbes in soil and sediment. Identifying biodegradative microorganisms is an important step in designing and analyzing soil bioremediation. To remove non-important noise information, it is necessary to selectively enrich genomes of biodegradative microorganisms fromnon-biodegradative populations. For this purpose, a stable isotope probing (SIP) technique was applied in selectively harvesting the genomes of biphenyl-utilizing bacteria from soil microbial communities. Since many biphenyl-using microorganisms are responsible for aerobic PCB degradation In soil and sediments, biphenyl-utilizing bacteria were chosen as the target organisms. In soil microcosms, 13C-biphenyl was added as a selective carbon source for biphenyl users, According to $13C-CO_2$ analysis by GC-MS, 13C-biphenyl mineralization was detected after a 7-day of incubation. The heavy portion of DNA(13C-DNA) was separated from the light portion of DNA (12C-DNA) using equilibrium density gradient ultracentrifuge. Bacterial community structure in the 13C-DNAsample was analyzed by t-RFLP (terminal restriction fragment length polymorphism) method. The t-RFLP result demonstates that the use of SIP efficiently and selectively enriched the genomes of biphenyl degrading bacteria from non-degradative microbes. Furthermore, the bacterial diversity of biphenyl degrading populations was small enough for environmental genomes tools (metagenomics and DNA microarrays) to be used to detect functional (biphenyl degradation) genes from soil microbial communities, which may provide a significant progress in assessing microbial capability of PCB bioremediation in soil and groundwater.

• Proceedings of the KSEEG Conference
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• 2002.04a
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• pp.8-10
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• 2002

POPs in sediments and soil in the PRD are comparable to or much higher than those reported in other regions. Some sites may be classified as POPs- polluted with high ecological risks. Large-scale land transform in the process of regional urbanization may facilitate the transfer of POPs in the soil to the sedimentary system by enhancing the soil run-off. Urban atmospheric PCBs in PRD are found to be less than some of the North American or European urbans, but PAHs are significantly higher. The center of the PRD has been the major source area of PAHs and organochlorine pesticides in the PRD. The northern part of the PRD serves as a regional sink for the air particulates and affiliated POPs.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.35 no.4A
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• pp.408-416
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• 2010

A dumbbell-type CPW transmission-line structure has been proposed to improve the return loss of the transmission line between a driver IC and flip-chip-bonding VCSEL(Vertical Cavity Surface Emitting Laser) in a hybrid opto-electric circuit board(OECB). The proposed structure used a pair of dummy ground solder balls on the ground lines for flip-chip bonding of the VCSEL and designed the dumbbell-type CPW transmission line to improve reflection characteristics. The simulated results revealed that the return loss of the dumbbell-type CPW transmission line was 13-dB lower than the conventional CPW transmission line. A 4-dB improvement in the return loss was obtained using the dummy ground solder balls on the ground lines. The variation rate of the reflection characteristic with the variation of terminal impedances of the transmission line (at the output terminal of the driver IC and the input terminal of the VCSEL) is about ${\pm}2.5\;dB$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.12
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• pp.73-81
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• 2011

As high speed digital systems continue to use components with faster edge rate and clock speeds, transmission of the digital information, it can bring about many troubles. The increasing requirement for controlled impedance PCBs becomes both a critical success factor and a design challenge to implement a system. Especially, the noise sources in high frequency digital systems include the noise in power supply, ground and packaging, and they destroy the fidelity of signals. Therefore PCB design with impendence matching is needed to improve fidelity of signal in H/W. In this paper, we have developed an impedance control and analysis tool for multi-layer PCB design, and simulates the tracks controlled impedance with the test coupon. So, it can save the design time and support the economical PCB design.

• Resources Recycling
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• v.17 no.3
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• pp.48-55
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• 2008

Leaching of copper and silver from mobile phone PCBs(printed circuit boards) with nitric acid was performed to investigate the effects of nitric acid concentrations, leaching temperatures, agitation speeds, and pulp densities on the leaching behaviors of Cu and Ag. The leaching rate considerably increased with increasing acid concentration and temperature. The leaching ratios of Cu and Ag were found to be 96.4% and 96.5%, respectively, under the optimum condition; at $80^{\circ}C$ with 2mol/L $HNO_3$ and 120g/L in pulp density within 39minutes. The kinetic parameters were determined based on the shrinking core model with reaction control corresponding to small particles. The activation energies for the leaching of copper and silver were found to be 45.5kJ/mol and 60.5kJ/mol at $35{\sim}80^{\circ}C$ with 2mol/L $HNO_3$, respectively.

• Korean Chemical Engineering Research
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• v.45 no.4
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• pp.319-327
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• 2007

Incineration has been regarded as the best developed technology available for organically hazardous waste. However, permitting and siting incinerators to treat hazardous waste such as a waste containing PCBs is very difficult due to the public concerns associated with toxic air emissions. Recently, a lot of alternatives to an incineration have been developed and these technologies have the potential of alleviating public concerns by decreasing emissions of hazardous materials such as dioxins and furans. This paper reviews currently available alternative incineration technologies for various hazardous waste streams. Various categories of non-thermal and thermal alternative incineration technologies have been evaluated in terms of their process operating condition, applicability of a waste stream and their emission of secondary waste. Detailed descriptions of operating principles of several technologies are also provided.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.