• KSII Transactions on Internet and Information Systems (TIIS)
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• v.10 no.10
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• pp.4748-4765
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• 2016

We consider a virtualized cognitive radio (CR) network, where multiple virtual network operators (VNOs) who own different virtual cognitive base stations (VCBSs) share the same physical CBS (PCBS) which is owned by an infrastructure provider (InP), sharing the spectrum with the primary user (PU). The uplink scenario is considered where the secondary users (SUs) transmit to the VCBSs. The PU is protected by constraining the interference power from the SUs. Such constraint is applied by the InP through pricing the interference. A Stackelberg game is formulated to jointly maximize the revenue of the InP and the individual utilities of the VNOs, and then the Stackelberg equilibrium is investigated. Specifically, the optimal interference price and channel allocation for the VNOs to maximize the revenue of the InP and the optimal power allocation for the SUs to maximize the individual utilities of the VNOs are derived. In addition, a low‐complexity ±‐optimal solution is also proposed for obtaining the interference price and channel allocation for the VNOs. Simulations are provided to verify the proposed strategies. It is shown that the proposed strategies are effective in resource allocation and the ±‐optimal strategy achieves practically the same performance as the optimal strategy can achieve. It is also shown that the InP will not benefit from a large interference power limit, and selecting VNOs with higher unit rate utility gain to share the resources of the InP is beneficial to both the InP and the VNOs.

• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

• Bulletin of the Korean Chemical Society
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• v.20 no.6
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• pp.689-695
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• 1999

Supercritical fluid extraction (SFE), ultrasonic extraction (USE), and accelerated solvent extraction (ASE) were compared with the well known Soxhlet extraction for the extraction of polychlorinated biphenyls (PCBs) and polychlorinated dibenzo-p-dioxins(PCDDs) from the XAD-2 resin which was used to adsorb PCDDs in the atmosphere. XAD-2 resin spiked with five PCDDs was chosen as a sample. The optimum conditions for the extraction of PCDDs by SFE were turned out to be the use of CO2 modified with 10% toluene at 100 ℃ and 350 atm, with 5 min static extraction followed by 20 min dynamic extraction. SFE gave a good extraction rate with good reproducibility for PCDDs ranging from 68 to 98%. The ultrasonic extraction of PCDDs from XAD-2 was investigated and compared with other extractions. A probe type method was compared with a bath type. Two extraction solvents, toluene and acetone were compared with their mixture. The use of their mixture in probe type, with 9 minutes of extraction time, was found to be the optimum condition. The average recovery of the five PCDDs for USE was 82-93%. Accelerated solvent extraction (ASE) with a liquid solvent, a new technique for sample preparation, was performed under elevated temperatures and pressures. The effect of tem-perature on the efficiency of ASE was investigated. The extraction time for a 10 g sample was less than 15 min, when the organic solvent was n-hexaneacetone mixture (1 : 1, v/v). Using ASE, the average recoveries of five PCDDs ranged from 90 to 103%. SFE, USE, and ASE were faster and less laborious than Soxhlet extraction. The former three methods required less solvent than Soxhlet extraction. SFE required no concentration of the solvent extracts. SFE and ASE failed to perform simultaneous parallel extractions because of instrumental limitations.

• Resources Recycling
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• v.30 no.2
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• pp.24-30
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• 2021

Dismantling tests were performed to separate components from waste printed circuit boards (PCBs) using HCl solution with Sn4+. Then, the effects of agitation speed, reaction temperature, initial Sn4+ concentration, and HCl concentration on the dismantling of components were investigated. No significant effect on the dismantling speed was observed upon changing the agitation speed from 100 to 300 rpm. However, the dismantling rate increased with increasing reaction temperature, Sn4+ concentration, and HCl concentration. In the all-component dismantling tests, when the dismantling ratio increased to 100%, no solder was observed on the boards, and the Sn4+ concentration was ~1,500 mg/L. The dismantling ratio of the components from the PCB increased to 100% within 2 h when 1 mol/L HCl solution with 10,000 mg/L Sn4+ was used at an agitation speed and temperature of 200 rpm and 90 ℃, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.59-66
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• 2018

In this paper, we analyzed the usefulness of single-structured printed circuit board (PCB) modeling by using numerical analysis to model the PCB structure applied to a package for semiconductor purposes and applying modeling assuming a single structure. PCBs with circuit layer of 3rd and 4th were used for analysis. In addition, measurements were made on actual products to obtain material characteristics of a single structure PCB. The analysis results showed that if the PCB was modeled in a single structure compared to a multi-layered structure, the warpage analysis results resulting from modeling the PCB structure would increase and there would be a significant difference. In addition, as the circuit layer of the PCB increased, the mechanical properties of the PCB, the elastic coefficient and inertia moment of the PCB increased, decreasing the package's warpage.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.12
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• pp.1-6
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• 2018

This study examined the quality improvement of printed circuit boards (PCBs) in relation to the power consumption for radar. The radar examined is currently in production and being used by the military. The PCB converts 28 V DC to 5 V DC but frequently malfunctions. Therefore, cause analysis was carried out. As a result, the power consumed by a certain communication IC was very high, and the heat generated by the high power consumption caused damage to the surrounding parts. Accordingly, it was changed to an improved communication IC that meets all the radar system specifications. System tests were carried out for the changed communication IC to check the impact on the system, and environmental tests were performed, which proved that the performance required by the radar system is satisfactory. As a result of this improvement, there has been no history of failure in this PCB so far. Therefore, the quality of this PCB has been improved.

• Journal of Auto-vehicle Safety Association
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• v.13 no.2
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• pp.30-34
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• 2021

Electrical failures and reliability problems of electronic components by ionic migration between adjacent device terminals have become an issue in automotive electronics. Especially unlike galvanic corrosion, ionic migration is occurred at high temperature and high humidity under applied electric field condition. Until now, although extensive studies of the ionic migrations dealing with PCBs, electrodes, and solders were reported, there is no study on the effect of insulation polymers and metallic fillers for ionic migration. In this research, therefore, ionic migration induced by the types and contents of polymers and metallic fillers, and variety conditions of temperature, humidity, and applied voltage was studied in detail. Ester and amide types of liquid crystal polymer (LCP) and poly (phthalamide) (PPA) were used as base polymers, respectively and compounded with the metallic fillers of Copper iodide (CuI), Zinc stearate (Zn-st), or Calcium stearate (Ca-st) in various compositions. The compounding polymers were fabricated in IPC-B-24 of SIR test coupon according to ISO 9455-17 with Cu electrodes for ionic migration test. While there is no change in LCP-based samples, ionic migration in PPA compounding sample with a high water absorption property was accelerated in the presence of 0.25 wt% or above of CuI at the environmental conditions of 85℃, 85% RH and 48V. The dendritic short-circuit growth of Cu caused by ionic migration between the electrodes on the surface of compounded polymers was systematically observed and analyzed by using optical microscopy and SEM (EDX).

• Journal of Physiology & Pathology in Korean Medicine
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• v.16 no.1
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• pp.172-180
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• 2002

Polychlorinated biphenyls(PCBs) are large scale industrial chemicals which are using in diverse applications. The goal of this study was to determine if exposure to 2,2',5,5'-tetrachlorobiphenyl (PCB 52) leads to an increase in the production of active oxidants, and subsequently promotes apoptosis of neuronal SK-N-MC cells. Reactive oxygen species (ROS) formation was examined in SK-N-MC cells after treatment of PCB 52 by concentrations and incubation times, respectively. It showed that the rate of ROS production in the cells was increased in a does-dependent manner to 45 min, followed by a return towards control levels after 120 min treatment. We also examined the association of PCB-induced apoptosis with the modulation of biomakers of oxidative damage to lipids (malondialdehyde [MDA]) in SK-N-MC cells. Increased MDA was observed in a dose-dependent manner in groups treated with 10, 15, and 20 figJ me of PCB 52 for 24 h. After treatment of PCB 52, the cells did not show any significant change in the rate of Cu/Zn-superoxide dismutase (Cu/Zn-SOD) activity. Whereas, the cells had a two-fold greater rate of change in catalase activity at 20 ㎍/㎖ of PCB 52 for 24 h when compared to control group. Korean Ginseng is one of the most important crude drugs which has been used as a traditional Oriental medicine. We next investigated protective effect of extracts of ginseng on cytotoxicity induced by PCB 52 in SK-N-MC cells. Pretreatment of SK-N-MC cells with 25-200 μg/ml of ginseng were reduced cell death in a dose-dependent manner in PCB 52-treated cells. To examine the sensitivity of beta-catenin to ginseng, the protective effect of a range of ginseng concentrations was examined in SK-N-MC cells treated with PCB 52. The result demonstrated that ginseng efficiently blocked PCB 52 inducible beta-catenin proteolysis in a concentration dependent manner. The ROS formation was also measured in the presences of extract of ginseng and superoxide dismutase (inhibitor of oxygen free radical production). The both SOD (400 U/ml) and ginseng (200 μg/ml) significantly inhibited RDS generation in PCB 52-treated group.

• Asian-Australasian Journal of Animal Sciences
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• v.14 no.3
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• pp.402-413
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• 2001

Food safety is a term broadly applied to food quality that may adversely affect human health. These include zoonotic diseases and acute and chronic effects of ingesting natural and human-made xenobiotics. There are two major areas of concern over the presence of residues of antibiotics in animal-derived foodstuffs with regard to human health. The first is allergic reactions. Some antibiotics, such as penicillins can evoke allergic reactions even though small amounts of them are ingested or exposed by parenteral routes. The second is development of antibiotic resistance in gut bacteria of human. Recently multi-resistant pneumococcal, glycopeptide-resistant enterococci and gram negative bacteria with extended-spectrum $\beta$-lactamases have spread all over the world, and are now a serious therapeutic problem in human. Although it is evident that drugs are required in the efficient production of meat, milk and eggs, their indiscriminate use should never be substituted for hygienic management of farm. Drug should be used only when they are required. In addition to veterinary drugs, environmental contaminants that were contaminated in feed, water and air can make residues in animal products. Mycotoxins, heavy metals, pesticides, herbicides and other chemicals derived from industries can be harmful both to animal and human health. Most of organic contaminants, such as dioxin, PCBs and DDT, and metals are persistent in environment and biological organisms and can be accumulated in fat and hard tissues. Some of them are suspected to have endocrine disrupting, carcinogenic, teratogenic, immunodepressive and nervous effects. The governmental agencies concerned make efforts to prevent residue problems; approval of drugs including withdrawal times of each preparation of drugs, establishment of tolerances, guidelines regarding drug use and sanitation enforcement of livestock products. National residue program is conducted to audit the status of the chemical residues in foods. Recently HACCP has been introduced to promote food safety from farm to table by reducing hazardous biological, chemical and physical factors. Animal Production Food Safety Program, Quality Assurance Programs, Food Animal Residue Avoidance Databank are para- or non-governmental activities ensuring food safety. This topic will cover classification and usage or sources of chemical residues, their adverse effects, and chemical residue status of some countries. Issues are expanded to residue detection methodologies, toxicological and pharmacokinetic backgrounds of MRL and withdrawal time establishments, and the importance of non-governmental activities with regard to reducing chemical residues in food.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.45-54
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• 2020

Recently, market demands of miniaturization, high interconnection density, and fine pitch of PCBs continuously keep increasing. Therefore, SLP (substrate like PCB) technology using a modified semi additive process (MSAP) has attracted great attention. In particular, SLP technology is essential for the development of high-capacity batteries and 5G technology for smartphones. In this study, the reliability of the microvia of hybrid SLP, which is made of conventional HDI (high density interconnect) and MSAP technologies, was investigated by experimental and numerical analysis. Through thermal cycling reliability test using IST (interconnect stress test) and finite element numerical analysis, the effects of various parameters such as prepreg properties, thickness, number of layers, microvia size, and misalignment on microvia reliability were investigated for optimal design of SLP. As thermal expansion coefficient (CTE) of prepreg decreased, the reliability of microvia increased. The thinner the prepreg thickness, the higher the reliability. Increasing the size of the microvia hole and the pad will alleviate stress and improve reliability. On the other hand, as the number of prepreg layers increased, the reliability of microvia decreased. Also, the larger the misalignment, the lower the reliability. In particular, among these parameters, CTE of prepreg material has the greatest impact on the microvia reliability. The results of numerical stress analysis were in good agreement with the experimental results. As the stress of the microvia decreased, the reliability of the microvia increased. These experimental and numerical results will provide a useful guideline for design and fabrication of SLP substrate.