• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.25-28
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• 2000

In this study, Transient Characteristics of the Punch-Through Insulated Gate Bipolar Transistor (PT-IGBT) has been studied. On the contraty to Non-Punch Through Insulated Gate Bipolar Transistor(NPT-IGBT), PT-IGBT has buffer layer It has a simple drive circuit controlled by the gate voltage of the MOSFET and the low on-state resistance of the bipolar junction transistor. In this paper, the transient characteristics with temperature of the PT-IGBT has been analyzed analytically. PT-IGBT is made to reduce switching power loss. Excess Minority carrier distribution inactive base region and base charge, the rate of voltage with time is expressed analytically to include buffer layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.1
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• pp.23-28
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• 2008

In this paper, transient characteristics of the Punch Through Insulated Gate Bipolar Transistor (PT-IGBT) have been studied. On the contrary to Non-Punch Through Insulated Gate Bipolar Transistor(NPT-IGBT), it has a buffer layer and reduces switching power loss. It has a simple drive circuit controlled by the gate voltage of the MOSFET and low on-state resistance of the bipolar junction transistor. The transient characteristics of the PT-IGBT have been analyzed analytically. Excess minority carrier and charge distribution in active base region, the rate of anode voltage with time are expressed analytically by adding the influence of buffer layer. The experimental data is obtained from manufacturer. The theoretical predictions of the analysis have been compared with the experimental data obtained from the measurement of a device(600 V, 15 A) and show good agreement.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.374-377
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• 2003

In this paper, turn on characteristics of (Punch-Through Insulated Gate Bipolar Transistor) PT-IGBT has been studied. Based on the transient power loss, turn on charges first base to collector capacitance. Furthermore we present the charge variation in the base including n+ buffer layer to express the transient turn-on characteristics of the device.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.14-15
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• 2007

Proton irradiation technology was used for improvement of switching characteristics of the PT-IGBT. The proton irradiation was carried out at 5.56 MeV energy from the back side of processed wafers and at 2.39 MeV energy from the front side of the wafers. The on-state and off-state I-V characteristics and switching properties of the device were analyzed and compared with those of un-irradiated device and e-beam irradiated device which was conventional method for minority carrier lifetime reduction. The proton irradiated device by 5.56 MeV energy was superior to e-beam irradiated device for the on-state and off-state I-V characteristics, nevertheless turn-off time of proton irradiated device was superior to that of the e-beam irradiated device.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.22-23
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• 2006

Proton irradiation technology was used for improvement of switching characteristics of the PT-IGBT. Proton irradiation was carried out at 5.56 MeV energy with $1{\times}10^{12}/cm^2$ doze from the back side of the wafer. Characterization of the device was performed by I-V, breakdown voltage, threshold voltage, and turn-off delay time measurement. For irradiated device by 5.56 MeV energy, the breakdown voltage and the threshold voltage were 730 V and 6.5~6.6 V, respectively. The turn-off time has been reduced to 170 ns, which was original $6\;{\mu}s$ for the un-irradiated device.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.12
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• pp.1073-1077
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• 2006

Proton irradiation technology was used for improvement of switching characteristics of the PT-IGBT. Proton irradiation was carried out at 5.56 MeV energy with $1{\times}10^{12}/cm^2$ doze from the back side of the wafer. The I-V, breakdown voltage, and turn-off delay time of the device were analyzed and compared with those of un-irradiated device and e-beam irradiated device which was conventional method for minority carrier lifetime reduction. For proton irradiated device, the breakdown voltage and the on-state voltage were 733 V and 1.85 V which were originally 749 V and 1.25 V, respectively. The turn-off time has been reduced to 170 ns, which was originally $6{\mu}s$ for the un-irradiated device. The proton irradiated device was superior to e-beam irradiated device for the breakdown voltage and the on-state voltage which were 698 V and 1.95 V, respectively, nevertheless turn-off time of proton irradiated device was reduced to about 60 % compared to that of the e-beam irradiated device.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1299-1300
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• 2006

Floating p-well 전압 감지를 이용한 시간 지연 회로를 적용하여 punch-though형 절연 게이트 바이폴라 트랜지스터 (PT-IGBT)의 최적화된 보호 회로를 제안하였다. Floating P-well 축전기와 게이트 저항은 정상 스위칭 동작시 단락 회로 감지 동작 (false detection of fault)을 차단하며, floating p-well 전압은 단락회로 상황시 풀-다운 (pull-down) MOSFET의 문턱 전압 이상으로 상승되어 풀-다운 MOSFET을 턴-온(turn-on) 시킴으로서 IGBT의 게이트 전압을 감소시킨다. 이에 따라 IGBT의 컬렉터 전류는 자연스럽게 감소된다. 실험 결과를 통해, 단락회로 상황에서 최적화된 IGBT의 보호회로가 소프트-셧다운 (soft-shutdown) 특성을 보이는 것을 확인할 수 있다.

• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.165-167
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• 2001

Emitter injection efficiency of p+/n-buffer Junction with Gaussian impurity distribution is presented. This model takes into account the variation of the carrier lifetime with injection level which allows a unified interpretation of the injection efficiency for all injection level. The injected carrier density and injection efficiency of the anode are calculated as a function of the current density with the low level lifetime as a parameter for different thicknesses of the anode. The analytical results agree well with simulation.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.99-100
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• 2006

절연 게이트 바이폴라 트랜지스터 (Insuialed atc Bipolar Transistor : IGBT)는 높은 전류구동 능력과 높은 입력 임피던스 특성으로 인해 대전력 스위칭 소자로 널리 응용되고 있다. 특히, 대용량 모터 구동을 위해 응용되는 경우, 모터의 부하 특성상, 모터의 단락에 의한 단락 회로 (Short-circuit fault) 현상을 비롯한 클램핑 다이오드의 파손으로 인한 unclamped 유도성 부하 스위칭 (UIS) 상황에서 견딜 수 있도록 설계되어야 한다. 이를 위해, 이전 연구를 통해 Floating p-well을 600V급 IGBT에 도입함으로써 UIS 상황에서 IGBT가 견딜 수 있는 에너지(항복 에너지)륵 증가시키고 Floating p-weil 전압을 감지함으로써 단락 회로 상황에서 IGBT가 보호될 수 있도록 보호회로를 제안하고 검증하였다. 그러나 이 보호회로는 수평형 금속 산화막 반도체 전계 효과 트랜지스터 (Latcral MOSFET)로 제작됨으로써 보호회로 기능을 수행하기 위해서는 넓은 면적을 요구하였다. 또한, 정상적인 동작 상황에서 오류를 감지 (오류 감지: False detection)하는 동작으로 인해 추가적인 filter를 요구함으로써 보호회로 동작 속도를 감소시켰다. 이러한 단점을 해결하기 위해, 수평형 절연 게이트 바이폴라 트랜지스터 (Lateral IGBT : LIGBT)를 보호회로에 적용함으로써 LIGBT의 높은 전류 구동능력을 이용하여 기존 보호회로 면적의 30% 수준의 보호회로를 구현하였다. 또한, 구현된 보호회로는 오류 감지 현상을 제거함으로써 보호회로의 동작 속도를 개선하였다. 제안된 보호회로와 1200V급 IGBT는 7장의 마스크를 이용한 표준 수평형 IGBT 공정을 이용하여 제작되었으며, 특히, 전자빔 조사를 이하여 턴오프 속도를 개선함으로써 고속 스위칭에 적합하도록 최적화 되었다.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1847-1849
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• 2005

Unclamped Inductive Switching (UIS) 능력을 향상시키기 위하여 Floating p- well을 적용한 IGBT의 단락 회로 상태에서 과전압을 감지하는 새로운 보호회로를 제안하고 제작하였다. 실험 결과 제안된 회로는 fault 상황에서 fault 신호를 감지하고 즉시 게이트 전압을 낮추어 컬렉터 전류를 감소시켰다. 또한 Hard Switching Fault (HSF)와 Fault Under Load (FUL) 상황에서의 측정 및 2차원 Mixed-Mode 시뮬레이션을 통해 제안된 회로와 소자의 동작을 확인하였다.