• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.21-26
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• 2004

This research presents a modeling and a manufacturing method of insert type milling cutters such as face cutter, flat endmill and ball endmill. The methods introduced in this paper adopts the multi-tasking 5-axis machining that is increasing machining accuracy of holder and position accuracy of bolting points. So this can be used in the basic document of the total package program that involves modeling and manufacturing module in various insert cutters.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.857-863
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• 2014

In this work, we introduce various bonding technologies for 3D package and suggest Insert-Bump bonding (ISB) process newly to stack multi-layer chips successively. Microstructure of Insert-Bump bonding (ISB) specimens is investigated with respect to bonding parameters. Through experiments, we study on find optimal bonding conditions such as bonding temperature and bonding pressure and also evaluate in the case of fluxing and no-fluxing condition. Although no-fluxing bonding process is applied to ISB bonding process, good bonding interface at $270^{\circ}C$ is formed due to the effect of oxide layer breakage.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.3
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• pp.9-17
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• 2000

The use of ceramic inserts in steel forging tools offers significant technical and economic advantages over other materi-als of manufacture. These potential benefits can however only be realised by optimal design of the tools so that the ceramic insert are not subjected to stresses that led to their premature failure. In this paper the data on loading of the tools is determined from a commercial forging simulation package as the contact stress distribution on the die-workpiece interface and as temperature distributions in the die. This data can be processed as load input data for a finite-element die-stress analysis. Process simulation and stress analysis are thus combined during the design and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic detections generated in shrink fitting the die inserts and that caused by the stresses generated in the forging process. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads. Simulation results have been validated as a result of experimental investigation. Laboratory tests on ceramic insert dies have verified the superior performance of the Zirconia and Silicon Nitride ceramic insert in order to prolong maintenance life.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.1
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• pp.32-37
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• 2002

The use of hexagonal ceramic inserts for copper extrusion dies offers significant technical and economic advantages over other forms of manufacture. In this paper the data on the loading of the tools is determined from a commercial FEM package as the contact stress distribution on the die-workpiece interface and as temperature distributions in the die. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the design and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.72-77
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• 2001

The use of hexagonal ceramic inserts for copper extrusion dies offers significant technical and economic advantages over other forms of manufacture. In this paper the data on the loading of the tools is determined from a commercial FEM package as the contact stress distribution on the die-workpiece interface and as temperature distributions in the die. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the design, and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads.

• Transactions of Materials Processing
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• v.14 no.8 s.80
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• pp.675-680
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• 2005

This study was aimed at the design of the dies for the automobile part for the engine oil leakage prevention using the computer simulation to shorten the period of production, on the basis of the process planning which was designed by the field experts. In the computer simulation,'eesy-2-form' of 2D FEM simulation package and 'eesy-DieOpt' have been used, which are the commercial process analysis and die design program. Through the simulation of 'eesy-2-form', we could know the propriety of the forming process, the inner pressure of the die and the suitable fitting pressure between the insert and the sleeve which was not showing any positive tangential stresses in the insert. Through the simulation of 'eesy-DieOpt', we could know the number of the stress ring, the diameter ratios, the stresses of the die, the shrink fitting tolerance and temperature in the condition of the already determined maximum outer die diameter of the multi-stage former. The validity of the die design using the computer simulation was analyzed by the experiments and the results were satisfactory. As the results of this study, the new and easy die design system for cold forging has been developed.

• Journal of Welding and Joining
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• v.31 no.6
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• pp.77-83
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• 2013

3D packaging technology using TSV (Through Silicon Via)has been studied in the recent years to achieve higher performance, lower power consumption and smaller package size because electrical line is shorter electrical resistivity than any other packaging technology. To stack TSV chips vertically, reliable and robust bonding technology is required because mechanical stress and thermal stress cause fracture during the bonding process. Cu pillar/solder ${\mu}$-bump bonding process is usually to interconnect TSV chips vertically although it has weak shape to mechanical stress and thermal stress. In this study, we suggest Insert-Bump (ISB) bonding process newly to stack TSV chips. Through experiments, we tried to find optimal bonding conditions such as bonding temperature and bonding pressure. After ISB bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test.

• International Journal of Precision Engineering and Manufacturing
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• v.7 no.1
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• pp.3-8
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• 2006

This paper deals with an automated computer-aided process planning and die design system by which designer can determine operation sequences even if they have a little experience in process planning and die design for axisymmetric products. An attempt is made to link programs incorporating a number of expert design rules with the process variables obtained by commercial FEM softwares, DEFORM and ANSYS, to form a useful package. The system can provide a flexible process based on either the reduction in the number of forming sequences by combining the possible two processes in sequence, or the reduction of deviation of the distribution on the level of the required forming loads by controlling the forming ratios. Especially in die design module optimal design technique and horizontal split of die insert were investigated for determining appropriate dimensions of components of multi-former die set. Results obtained, using the modules, enable the design and manufacture of a die set for a multi-former to be more efficiently performed.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.8
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• pp.1621-1628
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• 2003

Packaging structures to block the propagation of higher­order modes in the shielded microstrip lines are designed. Packaging for microwave circuits is necessary, basically, to isolate and protect circuits from outside environments both physically and electrically. The drawback of packaging is the possibility of higher­order mode propagation, similar to waveguide modes, as the operating frequency increases. One of Possible choices for the higher­order mode suppression is to insert diaphragms to the housing structure. The shielding effects of diaphragms are analyzed using an FEM code. Several parameters such as dispersion, mode conversion, and higher­order mode transmission and reflection are analyzed. The effect of higher­order mode suppression is eminent as the depth or width of a diaphragm is increased in the air region of the microstrip line. It is shown that inductive diaphragm structure can lower ${S_21}$ for the second­order mode incidence by 30㏈, comparing with the conventional capacitive diaphragm structure. Packaging structure analyzed in this paper can be applied usefully to the design of the microwave system in a package such as transmit/receive modules.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.1
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• pp.18-24
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• 2010

Efforts to obtain more efficient coupling of light from a laser diode to a single mode fiber have continued for various applications such as links for optical fiber communication systems. In TO-can package, configuration of optimized aspherical lens is bi-aspheric and its diameter is 2.4mm. We designed and fabricated aspherical coupling lens by means of glass molding technique under consideration of glass shrinkage. By controlling the aspherical profile error and surface roughness which were below 90nm and 10nm, respectively, we obtained the low coupling loss, 5.40dB, which was able to use for coupling a single mode fiber to laser diode.