• Title/Summary/Keyword: Plated wire

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The Frictional Resistance Of Tin Ion-Plated Co-Cr Orthodontic Wire (TiN 피막처리된 Co-Cr계 교정용 선재의 마찰저항력)

  • Lee, Ho-Kyu;Kwon, Oh-Won;Kim, Kyo-Han
    • The korean journal of orthodontics
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    • v.28 no.1 s.66
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    • pp.123-133
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    • 1998
  • The effectiveness of TiN ion-plating was examined with TiN ion-plated Co-Cr wires(.016“, .016”x.022“) on three different types of bracket(TiN ion-plated metal bracket ceramic bracket and plastic bracket). Maximum static frictional forces and characteristic curves obtained from the frictional characteristic graph, were compared and surface roughness of wires and bracket slots before and after friction experiment was observed by SEM. The obtained results were as follows $\cdot$The frictional forces of TiN ion-plated wires were significantly lower than those of non ion-plated wires(p<0.05). $\cdot$On the effect of wire shape, the frictional forces of round wires were significantly lower than those of rectangular wires(p<0.05) $\cdot$As the result of the SEM observation on the wires and bracket slots after the friction experiment the surface of non ion-plated wires was rougher than that of TiN ion-plated ones. $\cdot$The difference between the static frictional forces and the kinetic frictional forces was not significant in case of the TiN ion-plated round ins, but the static frictional forces were a little higher than the kinetic frictional forces in the TiN ion-plated rectangular wires. $\cdot$The static frictional forces were much higher than the kinetic frictional forces in the case of non ion-plated wires.

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A comparative study of electroplating and electroless plating for diameter increase of orthodontic wire (교정용 선재의 직경 증가를 위한 전기도금법과 무전해도금법의 비교연구)

  • Kim, Jae-Nam;Cho, Jin-Hyoung;Sung, Young-Eun;Lee, Ki-Heon;Hwang, Hyeon-Shik
    • The korean journal of orthodontics
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    • v.36 no.2 s.115
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    • pp.145-152
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    • 2006
  • The purpose of this study was to evaluate electroless plating as a method of increasing the diameter of an orthodontic wire in comparison with eletroplating. After pretreatment plating of the 0.016 inch stainless steel orthodontic wire, electroless plating was performed at $90^{\circ}C$ until the diameter of the wire was increased to 0.018 inch. During the process of electroless plating, the diameter of the wire was measured every 5 minutes to examine the increasing ratio of the wire's diameter per time unit. And to examine the uniformity, the diameter at 3 points on the electroless-plated orthodontic wire was measured. An X-ray diffraction test for analyzing the nature of the plated metal and a 3-point bending test for analyzing the physical property were performed. The electroless-plated wire group showed a increased tendency for stiffness, yield strength, and ultimate strength than the electroplated wire group. And there was a statistically significant difference between the two groups for stiffness and ultimate strength. In the electroless-plated wire group, the increasing ratio of the diameter was $0.00461{\pm}0.00003mm/5min$ (0.00092 mm/min). In the electroplated wire group, it was $0.00821{\pm}0.00015mm/min$. The results of the uniformity test showed a tendency for uniformity in both the plating methods. The results of this study suggest that electroless plating of the wire is closer to the ready-made wire than electroplating wire in terms of the physical property. However, the length of plating time needs further consideration for the clinical application of electroless plating.

Manufacturing of 3N Grade Silica by Thermal Oxidation using the Recovered Silicon from the Diamond Wire Sawing Sludge (다이아몬드 와이어 쏘잉 슬러지로부터 회수(回收)한 실리콘의 열산화(熱酸化)에 의한 3N급(級) 실리카 제조(製造))

  • Jeong, Soon-Taek;Kim, Nam-Chul
    • Resources Recycling
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    • v.22 no.2
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    • pp.37-43
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    • 2013
  • Unlike the conventional slurry type wire sawing, the diamond wire sawing method adopts diamond plated wire as sawing media instead of slurry consisted of both silicon carbide and oil. Wafering with diamond plated wire leaves solid element of the sludge mostly made up of silicon, and it is not difficult to recover 95% or more of silicon by a simple separation process of oil from the sludge. In this study, silicon was recovered from the sludge by drying process and organic and metal impurities were removed by sintering process. As result 3N grade silica was obtained successfully by thermal processing utilized the fact that the recovered silicon readily combines with oxygen due to fine particle size.

COMPARISON OF THE FRICTIONAL RESISTANCE BETWEEN NON-ION PLATED AND TiN ION PLATED TO THE ORTHODONTIC APPLIANCE (TiN피막 처리된 교정 장치물의 마찰 저항력에 관한 비교연구)

  • Jang, Si-Ho;Kwon, Oh-Won;Kim, Kyo-Han
    • The korean journal of orthodontics
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    • v.23 no.4 s.43
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    • pp.671-691
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    • 1993
  • To estimate the possibility in the application of TiN ion-plating to the orthodontic appliance, this study investigated frictional force and frictional coefficient between non-ionplated and TiN ion-plated to the orthodontic appliance. The obtained results were as follows : 1. For each group, the frictional force between metal bracket and arch wire in the wet condition was exhibited lower than that in the dry condition. 2. In the dry condition, the frictional force was lowest with fourth group, and it increased in the order of the 3rd, 1st, and 2nd group. Same situation happened in the wet condition. 3. Experimental results using ceramic & plastic bracket showed that group B was lower than group A, and group D was similar to group C. 4. The surface texture after experiment showed that the scratch due to a friction with bracket was observed in an arch wire of dry contition. Also the surface of bracket was rougher than before. 5. We observed that a specimen surface processed with the TiN ion plating was smoother than that of without the TiN ion plating. 6. The surface texture of a metal bracket and an arch wire in the wet condition was observed smoother than that in the dry condition. 7. In the dry condition, the friction coefficient of each specimen was very similar to each other, but in the wet condition, the friction coefficient of specimen processed with the TiN ion plating showed lower values.

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THE PHYSICAL PROPERTIES OF TIN ION-FLAYED CO-CR(ELGILOY) ORTHODONTIC WIRES (TiN 피막처리된 Co-Cr계 교정용 선재의 물성)

  • KIM, Jung-Min;KWON, Oh-Won;KIM, Kyo-Han
    • The korean journal of orthodontics
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    • v.28 no.3 s.68
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    • pp.371-377
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    • 1998
  • To estimate the possibility of clinical application of TiN ion-Plated Elgiloy(Co-Cr wire), measurements of tensile strength and hardness were made on the four tempers on each of the manufactured Elgiloy, the (heat-treated) Elgiloy for 30 minutes at $250^{\circ}C$ and the TiN ion-plated Elgiloy. For comparison, the tensile strength and hardness of Stainless Steel wires were also measured. The following are the results of the study: $\cdot$In the 4 tempers, tensile strength was the greatest in the TiN ion-plated group, followed by the heat-treated Elgiloy group and the manufactured Elgiloy group, but no statistical difference was noticed between heat-treated and manufactured Elgiloy groups(p>0.05). $\cdot$In each temper, tensile strength of ion-plated Elgiloy increased about $10kgf/mm^2$ in comparison with the values of the manufactured Elgiloy $\cdot$In yellow, green and red tempers except the blue, hardness was the greatest in ion-plated group. In the blue temper, there was no statistical difference between heat-treated and manufactured Elgiloy groups(p>0.05). $\cdot$In each temper, hardness of ion-plated Elgiloy increased about 50-90VHN in comparison with the values of the manufactured Elgiloy. $\cdot$The tensile strength of Stainless Steel wire was similar to that of the red temper of manufactured Elgiloy and the green temper of ion-plated Elgiloy.

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Ag-Cu Powders Prepared by Electrical Wire Explosion of Cu-plated Ag Wires (동도금한 은선재의 전기선폭발에 의해 제조한 Ag-Cu분말)

  • Kim, Won-Baek;Park, Je-Shin;Suh, Chang-Youl
    • Journal of Powder Materials
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    • v.14 no.5
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    • pp.320-326
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    • 2007
  • Ag-Cu alloy nano powders were fabricated by the electrical explosion of Cu-plated Ag wires. Ag wires of 0.2mm diameter was electroplated to final diameter of 0.220 mm and 0.307 mm which correspond to Ag-27Cu and Ag-68Cu alloy. The explosion product consisted of equilibrium phases of ${\alpha}-Ag$ and ${\beta}$-Cu. The particle size of Ag-Cu nano powders were 44 nm and 70 nm for 0.220 mm and 0.307 mm wires, respectively. The Ag-Cu nano powders contained less Cu than average value due to higher sublimation energy compared to that of Ag. As a result, micron-sized spherical particles formed from liquid droplets contained higher Cu content.

Fabrication of coated conductor stacked multi-filamentary wire (적층형 초전도 다심 선재 제조)

  • Yun, K.S.;Ha, H.S.;Oh, S.S.;Moon, S.H.;Kim, C.J.
    • Progress in Superconductivity and Cryogenics
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    • v.14 no.1
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    • pp.4-7
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    • 2012
  • Coated conductors have been developed to increase piece length and critical current for electric power applications. Otherwise, Many efforts were carried out to reduce AC loss of coated conductor for AC applications. Twisting and cabling processes are effective to reduce AC loss but, these processes can not be applied for tape shaped coated conductor. It is inevitable to have thin rectangular shape because coated conductor is fabricated by thin film deposition process on metal substrate. In this study, round shape superconducting wire was first fabricated using coated conductors. First of all, Ag coated conductor was used. coated conductor was slitted to several wires with narrow width below 1mm. 12ea slitted wires were parallel stacked on top of another until making up the square cross-section. The bundle of coated conductors was heat treated to stick on each other by diffusion bonding and then copper plated to make round shape wire. Critical current of round wire was measured 185A at 77K, self field.

Effects of TiN and ZrN Coating on Surface Characteristics of Orthodontic Wire (교정용 와이어의 표면특성에 미치는 TiN 및 ZrN 코팅영향)

  • Kim, W.G.;Kim, D.Y.;Choe, H.C.
    • Journal of the Korean institute of surface engineering
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    • v.41 no.4
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    • pp.147-155
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    • 2008
  • The dental orthodontic wire provides a good combination of strength, corrosion resistance and moderate cost. The purpose of this study was to investigate the effects of TiN and ZrN coating on corrosion resistance and physical property of orthodontic wire using various instruments. Wires(round type and rectangular type) were used, respectively, for experiment. Ion plating was carried out for wire using Ti and Zr coating materials with nitrogen gas. Ion plated surface of each specimen was observed with field emission scanning electron microscopy(FE-SEM), energy dispersive X-ray spectroscopy(EDS), atomic force microscopy(AFM), vickers hardness tester, and electrochemical tester. The surface of TiN and ZrN coated wire was more smooth than that of other kinds of non-coated wire. TiN and ZrN coated surface showed higher hardness than that of non-coated surface. The corrosion potential of the TiN coated wire was comparatively high. The current density of TiN coated wire was smaller than that of non-coated wire in 0.9% NaCl solution. Pit nucleated at scratch of wire. The pitting corrosion resistance $|E_{pit}-E_{rep}|$ increased in the order of ZrN coated(300 mV), TiN coated(120 mV) and non-coated wire(0 mV).

The Fabrication of Al-Cu Alloy Nano Powders by a New Method Combining Electrodeposition and Electrical Wire Explosion (전기도금법과 전기선폭발법을 이용한 Al-Cu 합금 나노분말제조)

  • Park Je-Shin;Suh Chang-Youl;Chang Han-Kwon;Lee Jae-Chun;Kim Won-Baek
    • Journal of Powder Materials
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    • v.13 no.3 s.56
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    • pp.187-191
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    • 2006
  • Al-Cu alloy nano powders were produced by the electrical explosion of Cu-plated Al wires. The composition and phase of the alloy could be controlled by varying the thickness of Cu deposit on Al wire. When the Cu layer was thin, Al solid solution and $CuAl_2$ were the major phases. As the Cu layer becomes thicker, Al diminished while $Al_4Cu_9$ phase prevailed instead. The average particle size of Al-Cu nano powders became slightly smaller from 63 nm to 44 nm as Cu layer becomes thicker. The oxygen content of Al-Cu powder decreased linearly with Cu content. It is well demonstrated that the electrodeposition combined with wire explosion could be simple and economical means to prepare variety of alloy and intermetallic nano powders.

Progression of Surface Treatment Technology at Leadframe (리드프레임 표면처리 기술의 진화)

  • Park, Se-Cheol
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2012.05a
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    • pp.135-135
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    • 2012
  • 세계 환경유해물질 규제에 대응하여 반도체 substrate의 Pb-free solution의 일환으로 등장한 PPF (Pre-Plated Frame)는 패키지공정 조립성은 물론, 자동차 반도체와 같은 고 신뢰성 및 low cost 요구를 만족하기 위해 초박막 고품질의 도금층과 Sub-micro scale의 rough treatment 와 같은 미세 표면제어 기술, 그리고 Au wire로부터 Cu wire 로의 전환에 대응하는 최적화된 도금층 구조로 발전하고 있다. 이러한 기술적인 진화를 거듭해온 이 기술은 다양한 반도체 substrate에 광범위하게 사용될 수 있기 때문에 향후 PPF기술의 활용저변은 더욱 확대될 전망이다.

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