• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.05a
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• pp.61-62
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• 1998

• Journal of the Korean institute of surface engineering
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• v.45 no.1
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• pp.8-14
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• 2012

The effects of the alkali surface modification process on the adhesion strength between electroless-plated Cu and polyimide films were investigated. The polyimide surfaces were effectively modified by alkali surface treatments from the hydrophobic to the hydrophilic states, and it was confirmed by the results of the contact angle measurement. The surface roughness increased by alkali surface treatments and the adhesion strength was proportional to the surface roughness. The adhesion strength of Cu/polyimide interface treated by KOH + EDA (Ethylenediamine) was 874 gf/cm which is better than that treated by KOH and KOH + $KMnO_4$. The results of XPS spectra revealed that the alkali treatment formed oxygen functional groups such as carboxyl and amide groups on the polyimide films which is closely related to the interfacial bonding mechanism between electroless-plated Cu and polyimide films. It could be suggested that the species and contents of functional group on polyimide films, surface roughness and contact angle were related with the adhesion strength of Cu/polyimide in combination.

• Polymer(Korea)
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• v.25 no.2
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• pp.160-167
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• 2001

The various compositions of polyimide (PI)/polyamideimide (PAI) composites were prepared by heat treatment of the solvent cast PI precursors/PAI blends. The optical micrographs showed that a good compatibility was observed between poly(amic acid) (PAA) and PAI, but in the case of PAME/PAI mixtures, a phase separation apparently occurred due to the absence of ionic and/or H-bonding forces. Regardless of PI precursors, the similar tensile properties were observed. The tensile modulus of the composites were higher than that of the neat polyimide. The X-ray diffraction patterns of the composites showed that the chain rearrangement of PI was increased due to the plasticizing effect of PAI, which has lower glass transition temperature than that of PI, during thermal imidization process.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.1
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• pp.38-44
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• 2005

Pyrolyzed polyimide is explored in terms of MEMS material. This paper describes chemical, electrical, mechanical properties of pyrolyzed polyimide (PIX-1400) thin film as MEMS material. When polyimide thin film was pyrolyzed at $800^{\circ}C$ for 60 minutes in $N_{2}$ ambient, the residual ratio of pyrolyzed film thickness measured with a surface profiler is about 49 %, and the resistivity is about $2.17{\times}10^{-2}\;{Omega}cm$. From the result of the load-deflection test, the estimated Young's modulus and initial average stress of pyrolyzed polyimide are 67 GPa and 30 MPa, respectively. As one demonstration of MEMS structures of pyrolyzed polyimide, the fabrication method of the microbridge structure is proposed for a micro heater and a resonator.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.1167-1168
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• 2004

Polarized ultraviolet irradiation techniques have been developed recently to produce alignment of liquid crystals (LC). Because of the excellent thermal stability and the alignment ablility of polyimides, polyimides has attracted considerable research interest for the photoinduced alignment layer. Hasegawa and Taira confirmed homogeneous alignment of LC by the decompostion of a polyimide induced by lineraly ultra-violet polarized light. It was reported that ultraviolet visible absorption spectra of a polyimide alignment film showed a remarkable change upon irradiation. In this study, we synthesized phthalic polyimide and a naphthalenic polyimide in order to investigate the effect of the polyimide structure. Some difference in terms of the photo-induced molecular orientaion of liquid crystals were observed with the polyimide structure.

• Polymer(Korea)
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• v.24 no.2
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• pp.194-200
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• 2000

The diffusion coefficients in polyimide/N-methyl-2-pyrrolidone (NMP) systems were proposed using tile Vrentas-Duda's hole free volume theory. Several free volume parameters included in the diffusion coefficients were obtained from the fundamental physical properties of polyimide and NMP and group contribution theory, and the pre-exponential diffusion coefficient, D$_{0}$ was also determined from the dynamic swelling behavior of polyimide in NMP solution. The experimental swelling behavior of polyimide films in NMP was well described by the theoretical one using the proposed diffusion coefficient.t.

• Tribology and Lubricants
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• v.12 no.3
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• pp.55-62
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• 1996

Present study was undertaken to investigate the effects of composition ratio and temperature on the friction and wear of PTFE-polyimide composites under the atmosphere of nitrogen gas. The load range was 0.62-3.46 MPa, and the temperature range was room temperature and 200$^{\circ}$C. To mention some of the notable results, friction coefficient of PTFE 100% varied relatively little within the given load and temperature ranges. Polyimide 100% showed the lowest friction coefficient of 0.06 at 200$^{\circ}$C among all the experiments. PTFE 80%-polyimide 20% showed the lowest wear factors on the whole. Friction coefficient of PTFE 20%-polyimide 80% varied from the highest 0.35 to the lowest 0.09 among all the materials at room temperature, and showed almost the same lowest values with polyimide 100% at 200$^{\circ}$C. Suggestion of friction and wear mechanisms of the materials was tried to explain the observed phenomena including above mentioned results.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1509-1511
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• 2001

In this study, etching characteristics of polyimide(Pl) film with $O_2/CF_4$ gas mixing ratio was studied using inductively coupled plasma (ICP). The etch rate and selectivity were evaluated to chamber pressure and gas mixing ratio. High etch rate (over 8000$\AA$/min) and vertical profile were acquired in $CF_4$/($CF_4+O_2$) of 0.2. The selectivities of polyimide to PR and polyimide to $SiO_2$ were 1.15, 5.85, respectively. The profiles of polyimide film etched in $CF_4/O_2$ were measured by a scanning electron microscope (SEM) with using an aluminum hard mask pattern. The chemical states on the polyimide film surface were measured by x-ray photoelectron spectroscopy (XPS).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.1086-1089
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• 2003

We investigated the electro-optical (EO) performances of the super twisted nematic liquid crystal display (STN-LCD) on the polyimide (PI) surface using polymer film. Monodomain alignment of the plastic STN-LCD can be observed. A stable voltage-transmittance (V-T) curve of the plastic STN-LCD was observed on the polyimide (PI) surfaces using polymer film. Also, a faster response time for the plastic STN-LCD on the polyimide (PI) surfaces using polymer film can be achieved. Therefore, the EO performances of the plastic STN-LCD on the polyimide (PI) surfaces using polymer film is almost the same as that of the glass STN-LCD on a polyimide (PI) surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.337-340
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• 2001

The control of high pretilt angle far nematic liquid crystal (NLC) with negative dielectric anisotropy on the rubbed blending polyimide (homeotropic and homogeneous alignment) surface were studied. High NLC pretilt angle generated on the blending polyimide (homeotropic polyimide and SE-7492 surface was measured and the NLC pretilt angle increases with blending ratio and rubbing strength. However, the NLC pretilt angle generated on the blending polyimide (homeotropic polyimide and SE-150 surface was not varied. The high pretilt angle the NLC using blending polyimide surface can be acheived.