• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.972-973
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• 2007

Relationships between field effect mobility and grain size on pentacene thin-film transistors with $polyimide/SiO_2$ gate dielectrics have been studied. 6 kinds of polyimide were used as surface treatment gate dielectric layer. Grain size of the pentacene thin film were between 5 and $30\;{\mu}m$ and depended on the polyimide. The field effect mobility were also depended on the polyimide and the those values were from 0.027 to $0.69\;cm^2/(Vs)$. The field effect mobility tends to increase with increasing the grain size. Precursor type polyimide containing polyamic acid show better mobility of $0.69\;cm^2/(Vs)$ than soluble type polyimide. Bias stress characteristics in air are discussed in the basis of the grain size.

• Bulletin of the Korean Chemical Society
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• v.28 no.2
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• pp.188-192
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• 2007

In this work, the effects of chemical treatment of polyimide films were studied by FT-IR, X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM) and contact angles. The adhesion characteristics of the films were also investigated in the peel strengths of polyimide/aluminum films. The increases of surface functional groups of KOH-treated polyimide films were greatly correlated with the polar component of surface free energy. The peel strength of polyimides to metal substrate was also greatly enhanced by increasing the KOH treatment time, which can be attributed to the formation of polar functional groups on the polyimide surfaces, resulting in enhancement of the work of adhesion between polymer film and metal plate.

• Laser Solutions
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• v.11 no.2
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• pp.20-25
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• 2008

Polyimide is one of the useful materials in industry. The surface treatment of polyimide by a femtosecond laser can help accurate and fine fabrication of microstructure. And it can change the transmittance and reflectance of polyimide, too. We put femtosecond laser pulses on polyimide for rectangular or square type surface treaments and observe the change of transmittance and reflectance. Pulsewidth is 172 fs, laser power changes for fabrication are from 5 mW to 20 mW, and transmittance and reflectance are measured under 20m W, 300m W, and 920 mW. Pulse patterning is stable and almost no unwanted surface damage is shown. As power increases, working depth increases but working line width does not increase significantly. As speed changes, they also have same results. It shows the efficiency of a femtosecond laser is good and thermal damage is small for polyimide.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1216-1218
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• 1997

Hydrolysis of BTDA-ODA: MPDA, PMDA-ODA, PIQ polyimides were investigated by FT-IR. The results showed that hydrolysis depends on structure of polyimide and that polyimide obtains hydrolytic stability by curing. Polyimide-aluminum interfaces were characterized by RAIR. It was concluded that imidization of the polyamic acid to polyimde was inhibited by interaction of acid groups with substrate to form aluminum carboxylate.

• Elastomers and Composites
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• v.58 no.1
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• pp.26-31
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• 2023

Aromatic diamine containing ortho catenation and methyl group was synthesized from 4-methyl catechol and 4-nitrobenzoyl chloride. Subsequently, a poly(amic acid) was prepared by reacting 4-methyl-1,2-phenylene bis(4-aminobenzoate) with 4,4'-hexafluoroisopropylidenediphthalic anhydride (6FDA). The resulting poly(amic acid) was transformed into a polyimide through chemical imidization. The polyimide formed was soluble in N-methyl-2-pyrrolidone (NMP) and could be cast into a flexible, transparent film. Furthermore, the polyimide exhibited a 5% weight loss at 380 ℃ in the nitrogen atmosphere.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.1169-1172
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• 2004

Polyimides are blended with photoreactive polymers in order to improve the thermal stability of molecular orientation of photoreactive groups induced by polarized UV irradiation. The polyimide/photopolymer blends can be applied for the photo-induced liquid crystal alignment layers. However, the polyimides are also decomposed by UV irradiation and this may have the negative effect on the orientation of liquid crystals. In order to elucidate the influence of polyimide on the molecular orientation of liquid crystal, non-photoreactive naphthalenic polyimide (1,4,5,8-naphthalene tetracarboxylic dianhydride} was selected for the blend alignment layers. We prepared the blends of photo-reactive coumarin polymers and naphthalenic polyimide, and investigated the orientation of liquid crystals. Thermal stability of the orientation of liquid crystals was enhanced due to the thermally stable polyimide. However, there was no other side-effect of polyimide on the orientation of liquid crystals and this might be attributed to the non-photo-reactivity of naphtahlenic polyimide.

• Polymer(Korea)
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• v.26 no.3
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• pp.375-380
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• 2002

Diamines (p-phenylenediamine , m-phenylenediamine , and n-hexamethylenediamine) were intercalated into sodium montmorillonite for the further reaction with the anhydride end groups of polyamic acid. The anhydride terminated polyamic acid was synthesized using a mole ratio of 4,4'-oxydianilline : 1,2,4,5-benzene tetracarboxylic dianhydride = 1.50 : 1.53. The modified montmorillonite was reacted with polyamic acid terminated with anhydride group in N-methyl-2-pyrrolidone (polyamic acid/clay nanocomposite). After imidization, thin films of the polyimide/clay nanocomposite were prepared. From the results of XRD and TEM, we found that mono layered silicates were dispersed in polyimide matrix and those resultants were exfoliated nanocomposites. Mechanical properties of exfoliated polyimide nanocomposite were better than both those of pure polyimide and those of intercalated polyimide nanocomposite.

• Korean Journal of Materials Research
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• v.17 no.2
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• pp.61-67
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• 2007

The magnetron reactive sputtering was adopted to deposit CuO buffer layers on the polyimide surfaces for increasing the adhesion strength between Cu thin films and polyimide, varying $O_2$ gas flow rate from 1 to 5 sccm. The CuO oxide was formed through all the $O_2$ gas flow rates of 1 to 5 sccm, showing the highest value at the 3 sccm $O_2$ gas flow rate. The XPS analysis revealed that the $Cu_2O$ oxide was also formed with a significant ratio during the reactive sputtering. The adhesion strength is mainly dependent on the amount of CuO in the buffer layers, which can react with C-O-C or C-N bonds on the polyimide surfaces. The adhesion strength of the multi-layered Cu/buffer layer/polyimide specimen decreased linearly as the heating temperature increased to $300^{\circ}C$, even though there showd no significant change in the chemical state at the polyimide interface. This result is attributed to the decrease in surface roughness of deposited copper oxide on the polyimide, when it is heated.

• Korean Journal of Materials Research
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• v.17 no.4
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• pp.215-221
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• 2007

The effect of $CF_4$ plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from $180^{\circ}$ peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. $CF_4$ plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to $CF_4$ plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in ink jet printed Ag/polyimide systems.

• Tribology and Lubricants
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• v.11 no.4
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• pp.28-34
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• 1995

PTFE has good mechanical and chemical stability at wide temperature range, and more over, shows a low value of friction coefficient. On the other hand, it shows cold flow and high wear rate. However, these short comings can be overcome by adding various fillers. In this experiment, PTFE and polyimide powder were mixed into composite and its tribological characteristics was investigated. 100% polyimide was also tested for comparison. The countefface material was a stainless steel (SUS304). Friction and wear tester of ring-on-block type was used at room temperature and under atmosphere. After the wear test, the worn surfaces were examined by optical microscope. The test results show that PTFE-polyimide composite generates. the wear transfer film on both sides of the friction surfaces, and, the friction coefficient and the wear rates are relatively low. 100% polyimide generated little wear transfer films, showed high friction and wear rates, and also showed some problems of vibration and noise. It even damaged the stainless steel countefface. It was concluded that 100% polyimide does not generate transfer film well because its shear resistanbe is high and it stickslips, thus, friction coefficients and wear rates are high. In case of PTFE-polyimide composite, on the other hand, transfer film containing sufficient PTFE adheres and remains on both wear surfaces well enough because PTFE has low shear resistance. Polyimide particles in the composite were proved to be able to bear normal load and does not show stick-slip because they are covered with transfer film containing much PTFE.