• Journal of the Korean Vacuum Society
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• v.6 no.S1
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• pp.122-126
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• 1997

the Cu/polyimide system is known to be the best candidate for a multilevel interconnection system due to the low resistance of Cu and to the low dielectric constant of polyimide respectively. Ion beam mixing of Cu(40nm)/polyimide was carried out at room temperature with 80 keV Ar+ and N2+ form $1.5\times$1015 to 15$\times$1015 ions/cm2. The quantitative adhesion strength was measured by a standard scratch test. X-ray photoelectron spectroscopy and x-ray emission spectrocopy are employed to investigate the chemical bonds and the interlayer compound formation of the films Cu/Al/polyimide showed more adhesion strength than Cu/polyimide after ion beam mixing and N2+ ions are more effective in the adhesion enhancement than Ar+ with the same sample geometry. The XES results shows the formation of interlayer compound of CuAl2O4 which can reflect more adhesive Cu/Al/polyimide which has not been reported previously. The latter results is understood by the fact that N2+ ions produce more pyridinelike moiety, amide group and tertiary amine moiety whcih are known as adhesion promotors.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.39-47
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• 2003

Cr thin films were deposited on photosensitive polyimide substrates by RF bias sputtering and DC sputtering and the interfaces between Cr thin film and polyimide were observed using TEM. When the polyimide surface was in-situ RF plasma cleaned at the RF power density of 0.13-2.12 $W/cm^2$, increasing of RF power density changed the morphology of polyimide surfaces from round dig to sharp shape, and surface roughness increased by anisotropic etching. The intermixed layer-like interfaces between Cr and polyimide were observed in the RF bias sputtered specimens. This interface seems to be formed due to the RF cleaning effect; the polyimide surface was RF plasma cleaned while RF power was increased to the setting point before Cr deposition.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.7 no.3
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• pp.494-503
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• 1997

We investigated the initial stages of formation of the Cu/polyimide interface using another two methods by X-ray photoelectron spectroscopy. : One, in-situ measurement with increasing of Cu deposition thickness onto polyimide(PI), the other, measurement with decreasing of Cu thickness of Cu/pI film by $Ar^+$ ion etching. From these results, we find that the chemical reactions exist in Cu/PI interface. However, the measured chemical reactions were different according to experimental method.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.105-108
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• 2002

Polyimide-epoxysilane (coupling agent) composites were reacted with oligomeric PDMS, a condensation product of difunctional silane, by a sol-gel process and were then dried into films. And then, the surface, mechanical, and electric properties were measured. The study showed that PDMS existed in the polyimlde matrix by the use of FT-IR. In the mechanical properties, the maximum elongation and toughness was increased in the polyimide with silane-groups. But the maximum tensile strength was slightly decreased. And the intensive dispersion of the silane-groups on the surface of polyimide was ascertained through XPS measurement. In the electric properties, AC break down voltage was increased by increasing the amount of difunctional silane. This experiment showed that PDMS added polyimide had better mechanical and electric properties than classical materials.

• Journal of Environmental Science International
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• v.12 no.4
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• pp.481-485
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• 2003

Two types of polyimide/silica composite films were prepared using sol-gel method through hydrolysis and polycondensation of tetraethoxysilane (TEOS) with the polyamic acid (PAA) and end-capped PAA solution. Samples were characterized by the means of differential thermogravimetry, X-ray diffractometry, scanning electron microscopy, universal test, impedance analyzer, chemical resistance test, etc. All of the PAA/silanol solutions heat-treated at 300$^{\circ}C$ for 6h were transformed to polyimide/silica composites. It has been demonstrated that the properties of polyimide/silica composites were affected by the amount of silica addition and the bend type existed between polyimide and silica.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.153-155
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• 2009

In this study, we fabricated the $Cu(In,Ga)Se_2$ (CIGS) thin-film solar cells by using a polyimide substrate. The CIGS thin-film was deposited on Mo coated polyimide substrate by a 3-stage co-evaporation technique. Because the polyimide shows thermal transformation at about $400^{\circ}C$, the substrate temperature of co-evaporation process was set to below $400^{\circ}C$. Corresponding solar cell showed a conversion efficiency of 7.08 % with $V_{OC}$ of 0.58 V, $J_{SC}$ of 24.99 $mA/cm^2$ and FF of 0.49.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.87-96
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• 2000

The properties of polyimide for interlayer dielectric applications are investigated during plasma etching of aluminum on it. Chlorine-based plasma generally used for aluminum etching results in an increase in the (dielectric constant of polyimide, while $SF_6$ plasma exhibits a high polyimide etch rate and a reducing effect of the dielectric constant. The leakage current of polyimide is significantly suppressed after plasma exposure. An optimal combination of Al etch with $Cl_6$ plasma and polyimide etch with $SF_6$ plasma is expected to be a good tool for realizing multilevel metallization structures.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.04a
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• pp.81-83
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• 2003

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on polyimide surfaces using thin plastic substrates. It was found that monodomain alignment of LNC is obtained with rubbing alignment method on polyimide surfaces using thin plastic substrates. The generated NLC pretilt angles are about $3^{\circ}$ by the rubbing alignment method on thin plastic substrates, However, the pretilt angle measured at about $1.7^{\circ}$ lower on the glass substrate than by thin plastic substrate. It is considered that this alignment may be attributed to roughness of micro groove substrate. The tilt angle increases with increasing baking temperature for making polyimide layer using glass substrate. It was concluded that pretilt angle in the polyimide surface is attributable to the increasing of imide rato.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.271-272
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• 2005

We studied liquid crystal (LC) alignment with ion beam (IB) on polyimide and electro-optical characteristics of twisted nematic (TN)-liquid crystal display (LCD) on the polyimide surface using obliquely ion beam exposure. A good uniform alignment of the nematic liquid crystal (NLC) alignment with the ion beam exposure on the polyimide surface was observed. In addition, it can be achieved the good EO properties, and residual DC property of the ion-beam-aligned TN-LCD on polyimide surface.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.5
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• pp.340-346
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• 1998

In this study, we intended to investigate aging effect of polyimide prepared by VDPD(vapor deposition polymerized method). The prepared polymide was treated by the oxygen and argon gas plasma. And we evaluated the polyimide treated by plasma from contact angle, surface leakage current, FT-IR and SEM. We know that the structure of polyimide at surface are changed to amide structure by plasma treating. It seems that strong energy of plasma causes breaking the molecular chin of the polyimide. And surface roughness increases with plasma treating time increased and sequentially the wettability and leakage current increases.