• Proceedings of the Korean Geotechical Society Conference
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• 2003.03a
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• pp.521-528
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• 2003

In this study, a newly modified soil nailing technology called as the NDB(New Down and Board) soil nailing system is introduced. To improve the trafficability, workability, and economical efficiency, SMC(Sheet Molding Compound) board is adopted instead of using the concrete block facing. The SMC board has a distinct advantage of showing a fine view by directly coating with any kind of environmental photos. Composite material properties of the SMC board and cement grout are distinguished features of the NDB soil nailing system. In the present study, both laboratory tests(bending and punching failure tests) and field pull-out tests are carried out to analyze the behavior characteristics of the NDB soil nailing system, including the stress and strain distribution.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2021.11a
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• pp.116-117
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• 2021

In general, when a building fire occurs, the heat flow rises by buoyancy, which affects the temperature rise of the ceiling. In addition, when the ceiling ignites, the fire spreads rapidly due to horizontal spread and radiant heat. According to the fire investigation, most of the large fires have a common characteristic that the fire spreads to the ceiling and causes many casualties. Therefore, it is considered that it is necessary to review the fire risk of ceiling materials used in buildings to prevent the spread of fire to the ceiling. Therefore, in this study, combustion characteristics such as the amount of heat released and ignition time of each SMC, DMC, and gypsum board were checked using a Cone Calorimeter, and the ignition temperature was calculated by substituting them into the fire theory. As a result, the ignition temperature of SMC was 449K, that of DMC was 1492K, and that of gypsum board was 677K.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.36-39
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• 1997

In this paper, we described an approach to design of precision optical system for visual inspection of solder joint defects of SMC(surface mount components) on PCBs(Printed Circuit Board). The illumination system, consisting of three tiered LED lamps and one main camera and four side view camera, is implemented to generated iso-contour on the solder joint according to gradient of the soldered surface. We analyze LED design parameter such as incident angle, diameter of LED ring, and so on to acquire uniform illumination.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.5
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• pp.124-133
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• 2003

We propose an application of the Object-Oriented design methodology to develop operational flight program(OFP) for stores management computer(SMC) which manages and controls stores inventory, stores activation, launch for missiles, and release of the conventional weapons. For the development of SMC, a military version of PowerPC 603e is used as a central processing unit board and VxWorks real-time operating system is used. The Tornado software development environment(SDE) and the programming language Ada95 are used for OFP development. We design three layerd in the OFP for the independency of the software modules. An avionics system computer(ASC) simulator and a test bench are developed for the SMC integration test and verification test. And the tests are rigorously and successfully conducted.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.8
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• pp.710-718
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• 2000

In this paper we described an approach to automation of visual inspection of solder joint defects of SMC(Surface Mounted Components) on PCBs(Printed Circuit Board) by using neural network and fuzzy rule-based classification method. Inherently the surface of the solder joints is curved tiny and specular reflective it induces difficulty of taking good image of the solder joints. And the shape of the solder joints tends to greatly vary with the soldering condition and the shapes are not identical to each other even though the solder joints belong to a set of the same soldering quality. This problem makes it difficult to classify the solder joints according to their qualities. Neural network and fuzzy rule-based classification method is proposed to effi-ciently make human-like classification criteria of the solder joint shapes. The performance of the proposed approach is tested on numerous samples of commercial computer PCB boards and compared with the results of the human inspector performance and the conventional Kohonen network.