• Title/Summary/Keyword: Sapphire

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Sapphire Ribbon Single Crystal Growth by EFG Method (EFG법에 의한 Sapphire Ribbon 단결정 성장)

  • 박신서;류두형;정재우;최종건;오근호;손선기;변영재;전형탁
    • Journal of the Korean Ceramic Society
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    • v.27 no.6
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    • pp.783-789
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    • 1990
  • Shaped crystal growth apparatus were made for sapphire ribbon single crystal growth. Sapphire ribbon single crystal are grown by EFG(Edge-defined Film-fed Growth) methdo for use as watch-glass and SOS(Silicon-On-Sapphire) devices. Sapphire ribbon crystals were grown to be 40min wide, 1.8mm thick, 96mm long. Therelationshiops between growth striation and surface roughness, with various growth rates, were investigated and compared. It was found that sapphire ribbon crystal is suitable for watch-glass by measuring the transmittance in the visible light region.

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Sapphire orientation dependence of the crystallization of ZnO thin films (사파이어 기판의 방향에 따른 ZnO 박막의 결정화 거동)

  • 조태식
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.1036-1038
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    • 2001
  • The sapphire orientation dependence of the crystallization of ZnO thin films has been studied using real-time synchrotron x-ray scattering. The amorphous ZnO thin films with a 2400-${\AA}$-thick were grown on sapphire(110) and sapphire(001) substrates by radio frequency magnetron sputtering at room temperature. The amorphous ZnO films were crystallization into epitaxial ZnO(002) grains both on the sapphire(110) and on the sapphire(001) substrates. The epitaxial quality, such as mosaic distribution and crystal domain size, of the ZnO grains on the sapphire(110) is high, similar to that of the ZnO grains on the sapphire(001). With increasing the annealing temperature to 600$^{\circ}C$, the mosaic distribution and the crystal domain size of ZnO(002) grains in the film normal direction was improved and decreased, respectively.

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Etching properties of sapphire substrate using $CH_4$/Ar inductively coupled plasma ($CH_4$/Ar 유도 결합 플라즈마를 이용한 Sapphire 기판의 식각 특성)

  • Um, Doo-Seung;Kim, Gwan-Ha;Kim, Dong-Pyo;Yang, Xue;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.102-102
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    • 2008
  • Sapphire (${\alpha}-Al_2O_3$) has been used as the substrate of opto-electronic device because of characteristics of thermal stability, comparatively low cost, large diameter, optical transparency and chemical compatibility. However, there is difficulty in the etching and patterning due to the physical stability of sapphire and the selectivity with sapphire and mask materials [1,2]. Therefore, sapphire has been studied on the various fields and need to be studied, continuously. In this study, the etching properties of sapphire substrate were investigated with various $CH_4$/Ar gas combination, radio frequency (RF) power, DC-bias voltage and process pressure. The characteristics of the plasma were estimated for mechanism using optical emission spectroscopy (OES). The chemical compounds on the surface of sapphire substrate were investigated using energy dispersive X-ray (EDX). The chemical reaction on the surface of the etched sapphire substrate was observed by X-ray photoelectron spectroscopy (XPS). Scanning electron microscopy (SEM) was used to investigate the vertical and slope profiles.

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A Study on the Micro-lapping process of Sapphire Wafers for optoelectronic devices (광반도체용 사파이어웨이퍼 기계연마특성 연구)

  • 황성원;신귀수;김근주;서남섭
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.2
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    • pp.218-223
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    • 2004
  • The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by Micro-lapping process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of crystalline sapphire wafer at surface has a full width at half maximum of 250 arcsec. This value at the surface sapphire wafer surfaces indicated 0.12${mu}m$ sizes. Surfaces of sapphire wafers were mechanically affected by residual stress and surface default. As a result, the value of surface roughness of sapphire wafers measured by AFM(Atom Force Microscope) was 2.1nm.

A Study on the Micro-lapping process of Sapphire Wafers for optoelectronic devices (광반도체용 사파이어웨이퍼 기계연마특성 연구)

  • 황성원;김근주;서남섭
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.82-85
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    • 2003
  • The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by Micro-lapping process. The sapphire crystalline wafers were characterized by DCXD(Double Crystal X-ray Diffraction). The sample quality of crystalline sapphire wafer at surface has a FWHM(Full Width at Half Maximum) of 250 arcsec. This value at the sapphire wafer surfaces indicated 0.12${\mu}{\textrm}{m}$ sizes. Surfaces of sapphire wafers were mechanically affected by residual stress and surface default. Also Surfaces roughness of sapphire wafers were measured 2.1 by AFM(Atom Force Microscope).

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Analysis of the Effect of the Substrate Removal and Chip-Mount Type on Light Output Characteristics in InGaN/Sapphire LEDs (InGaN/Sapphire LED에서 기판 제거 유무와 칩 마운트 타입이 광출력 특성에 미치는 영향)

  • Hong, Dae-Woon;Yoo, Jae-Keun;Kim, Jong-Man;Yoon, Myeong-Jung;Lee, Song-Jae
    • Korean Journal of Optics and Photonics
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    • v.19 no.5
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    • pp.381-385
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    • 2008
  • We have analyzed the effect of the substrate removal and packaging schemes on light output characteristics in InGaN/Sapphire LEDs. The removal of the sapphire substrate helps to dissipate the heat generated in the junction, but the advantage comes only with the detrimental effect of degrading the photon extraction efficiency. If the substrate-removed chip is attached to a metallic mount with good thermal conductivity, the maximum driving current is increased drastically, producing significantly increased light output and therefore compensating the photon extraction efficiency degradation. On a dielectric mount with a relatively poor thermal conductivity, however, it produces smaller light output, over most input current range, than the regular type of chips with the sapphire substrate remaining. Thus, for low power applications, the regular chips may be preferred over the substrate-removed chips, regardless of the chip mounts employed.

Comparison of flux and natural sapphire after heat-treatment (열처리 후 플럭스 사파이어와 천연 사파이어의 비교 분석)

  • Kim, Ki-In;Ahn, Yong-Kil;Seo, Jin-Gyo;Park, Jong-Wan
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.19 no.3
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    • pp.152-158
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    • 2009
  • Various fabrication methods have been used to synthesize sapphire which has qualities of jewelry well beyond the industrial class. Among them, the flux sapphire of Chatham Company which has as high value as jewelry was selected in order to compare natural and synthetic sapphire. First, the WD-XRF (Wavelength dispersive x-ray fluorescence spectrometer) was used to analyze the chemical composition of natural and synthetic sapphire. Although natural sapphire had very diverse chemical compositions, flux sapphire had small quantities of Mo, Pt and Pb elements in addition to the similar chemical ingredients to natural one. Pt is decisive proof of flux sapphire. Next, by investigating spectroscopic characteristics using UV-VIS Spectrophotometer after heat treatment at high temperatures of $1300^{\circ}C$ and $1500^{\circ}C$, the variation of 690 nm absorbance related to $Cr^{3+}$ was detected in the natural sapphire while those of the 690 nm absorbance (related to $Cr^{3+}$) as well as absorbance of 376 nm and 388 nm ($Fe^{3+}$) were seen in the flux sapphire. It was found that the difference in the absorbance variation of flux sapphire is greater than that of natural sapphire after heat treatment. The chemical composition and spectrum analysis were utilized to compare the natural sapphire and the flux synthetic sapphire.

Analysis of Sapphire Microdrilling by a Nano Second Visible Laser Pulse (나노초 가시광 레이저 펄스를 이용한 사파이어 미세천공 공정의 해석)

  • O, Bu-Guk;Jeong, Yeong-Dae;Kim, Nam-Seong;Kim, Dong-Sik
    • Laser Solutions
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    • v.12 no.1
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    • pp.7-13
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    • 2009
  • Engineering ceramics as sapphire are widely used in industry owing to their superior mechanical and corrosion properties. However, micromachining of sapphire is a considerable challenge due to its transparency. Recently, direct ablation of sapphire has been demonstrated with a visible laser pulse at sufficiently high laser intensity. In this work, the theoretical model for pulsed laser ablation of sapphire is suggested and numerical analysis is carried out using the model. Sapphire ablation begins with plasma generation by the laser interaction with surface defects, impurities and contaminations in the initial stage of machining. Subsequent absorption of the visible laser beam can be explained by three mechanisms: metalization of sapphire surface due to the EUV radiation from the hot plasma, increments of surface roughness and temperature-dependent absorption coefficient. Comparison of the computation results with experimental observation indicates that the proposed model of sapphire is reasonable.

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Effect of ion implanted sapphire substrates for GaN (GaN 성장을 위한 이온 주입된 사파이어 기판의 효과)

  • 이재석;진정근;강민구;노대호;성윤모;변동진
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.11a
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    • pp.170-170
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    • 2003
  • We have implanted on sapphire substrate with various ions and investigated the properties of GaN epilayers grown on implanted sapphire substrate by metal organic chemical vapor deposition (MOCVD). Sapphire is typical substrate for GaN epilayers. However, there are many problems such as lattice mismatch and thermal coefficient difference between sapphire substrate and GaN. The ion implanted substrate's surface had decreased internal tree energies during the growth of the GaN epilayer, md the misfit strain was relieved through the formation of an AlN phase on the ions implanted sapphire(0001) substrates. [1] The crystal and optical properties of GaN epilayer grown in ions implanted sapphire(0001) substrate were improved.

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A Study on the chemical-mechanical polishing process of Sapphire Wafers for GaN thin film growth. (사파이어웨이퍼의 기계-화학적인 연마 가공특성에 관한 연구)

  • Nam, Jung-Hwan;Hwang, Sung-Won;Shin, Gwi-Su;Kim, Keun-Joo;Suh, Nam-Sup
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05b
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    • pp.31-34
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    • 2003
  • The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by chemical and mechanical polishing(CMP) process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of sapphire crystalline wafer at surfaces has a full width at half maximum 89 arcses. The surfaces of sapphire wafers were mechanically affected by residual stress and surface default. Sapphire wafers's waveness has higher abrasion rate in the edge of the wafer than its center due to Newton's Ring interference.

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