• Journal of the Semiconductor & Display Technology
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• v.19 no.3
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• pp.12-18
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• 2020

In semiconductor manufacturing, defect detection is critical to maintain high yield. Currently, computer vision systems used in semiconductor photo lithography still have adopt to digital image processing algorithm, which often occur inspection faults due to sensitivity to external environment. Thus, we intend to handle this problem by means of using Mask R-CNN instead of digital image processing algorithm. Additionally, Mask R-CNN can be trained with image dataset pre-processed by means of the specific designed digital image filter to extract the enhanced feature map of Convolutional Neural Network (CNN). Our approach converged advantage of digital image processing and instance segmentation with deep learning yields more efficient semiconductor photo lithography inspection system than conventional system.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.12
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• pp.1072-1080
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• 2013

In a the present day, many vision inspection techniques are used in productive industrial areas. In particular, in the semiconductor industry the vision inspection system for wafers is a very important system. Also, inspection techniques for semiconductor wafer production are required to ensure high precision and fast inspection. In order to achieve these objectives, parallel processing of the inspection algorithm is essentially needed. In this paper, we propose the GPU (Graphical Processing Unit)-based parallel processing algorithm for the fast inspection of semiconductor wafers. The proposed algorithm is implemented on GPU boards made by NVIDIA Company. The defect detection performance of the proposed algorithm implemented on the GPU is the same as if by a single CPU, but the execution time of the proposed method is about 210 times faster than the one with a single CPU.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.59-65
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• 2023

Edge detection in image processing and computer vision is one of the most fundamental operations. Canny edge detection algorithm has excellent performance and is currently widely used. However, it is difficult to process the algorithm in real-time because the algorithm is complex. In this study, the equations required in the algorithm were simplified to facilitate hardware implementation, and the calculation speed was increased by using a parallel structure. In particular, the size and management of local buffers were selected in consideration of parallel processing and filter size so that data could be processed without bottlenecks. It was designed in verilog and implemented in FPGA to verify operation and performance.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2008.05a
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• pp.41-41
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1991.11a
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• pp.87-94
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• 1991

This Paper is to aim the microdefect evaluation of semiconductor Package into a quantitative from NDI's image processing of ultrasonic wave. Accordingly, for the detection of delamination between the Joining condition of boundary microdefect of semiconductor packaga the result from sampling original image, histogramming, binary image or image processing of multinumerloal value is such as the follows. ([) The least limitation from the microdefect detection of the semiconductor package by surveying high ultrasonic wave seems to be about 0.8 $\mu\textrm{m}$ in degree. (2) A result of applying the image processing of multinumerical value to the semiconductor package it was possible to devide the Category into the effectiveness.

• Proceedings of the Korea Information Processing Society Conference
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• 2022.11a
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• pp.934-936
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• 2022

현재 사회적인(COVID-19) 영향으로 메타버스에 대한 수요가 급증하였지만, 메타버스 플랫폼 진입을 지원하는 XR(AR/VR) 장비의 높은 가격대와 전문성 요구로 폭넓은 수요층을 포괄하기 어려운 상황이다. 본 논문에서는 이러한 수요층의 어려움을 개선하고자 웹 캠이나 스마트폰 카메라로 생성된 개인의 사진 이미지를 StyleGAN 딥러닝 기술과 접목시켜 캐릭터를 생성해 Mediapipe를 활용하여 모션 측정 및 제어를 처리하는 서비스를 제안하여 메타버스 시장의 대중화에 기여하고자 한다.

• Journal of Korean Institute of Industrial Engineers
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• v.40 no.2
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• pp.215-222
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• 2014

This paper provides a real-time loading strategy for batch processing machines in which a number of jobs are simultaneously processed as a batch. The batch processing machines can be seen in both manufacturing industries (e.g., semiconductor, automobile and metal working) and service industries (transportation vehicles, mail shipment and theme park). This paper focuses on batch processing machines in semiconductor manufacturing. We present a look-ahead loading strategy for tardiness minimization where future arrivals and due dates are taken into consideration. Simulation tests are performed on the presented strategy and some existing loading heuristics under various production settings with different traffic intensities and forecasting errors. Experimental results show that our strategy provides the performance of good quality.

• International Journal of Internet, Broadcasting and Communication
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• v.9 no.2
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• pp.20-26
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• 2017

Process control is crucial in many industries, especially in semiconductor manufacturing. In such large-volume multistage manufacturing systems, a product has to go through a very large number of processing steps with reentrant) before being completed. This manufacturing system has many machines of different types for processing a high mix of products. Each process step has specific quality standards and most of them have nonlinear dynamics due to physical and/or chemical reactions. Moreover, many of the processing steps suffer from drift or disturbance. To assure high stability and yield, on-line quality monitoring of the wafers is required. In this paper we develop a real-time fault detection system on semiconductor manufacturing process. Proposed system is superior to other incremental fault detection system and shows similar performance compared to batch way.

• 제어로봇시스템학회:학술대회논문집
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• 1995.10a
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• pp.79-82
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• 1995

The problem of temperature control for rapid thermal processing (RTP) in semiconductor manufacturing is discussed in this paper. Among sub=micron technologies for VLSI devices, reducing the junction depth of doped region is of great importance. This paper investigates existing methods for manufacturing wafers, focusing on the RPT which is considered to be good for formation of shallow junctions and performs the wafer fabrication operation in a single chamber of annealing, oxidation, chemical vapor deposition, etc., within a few minutes. In RTP for semiconductor manufacturing, accurate and uniform control of the wafer temperature is essential. In this paper, a robustr controller is designed using a recently developed optimization technique. The controller designed is then tested via computer simulation and compared with the other results.