• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.10
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• pp.1881-1887
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• 2009

This paper discusses the effects of ECC (Earth Continuity Conductor) for reducing the level of induced sheath overvoltages at the single point bonded section of combined transmission lines which are mixed underground power cable with overhead line in one T/L. In previous papers, the characteristics of ECC on only underground power cable systems were sufficiently analyzed. However, the result of only underground power cable systems are totally different from that of combined transmission lines because ECC is commonly grounded with overhead grounding wire at mesh of cable head. Therefore, in this paper, the installation effects of ECC have been variously analyzed considering the three kinds of fault positions, cable formation of duct and trefoil, spacing between phase conductor and ECC, and the change of overhead transmission line section length on 154kV combined transmission line. Finally, simulation results show that ECC can effectively reduce the induced sheath voltage.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.9
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• pp.1689-1694
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• 2009

In a previous paper, the characteristics of ECC (earth continuity conductor) have been analysed for reducing the level of induced sheath voltage considering the dimension and position of ECC, the spacing between ECC and three phase cables, and the use of two ECC conductors at the single point boned section of underground power cable system. From these results, the study conditions for optimal installation has been selected such as installation section, conductor size and etc. In this paper, 5 cases which are set by possible installation conditions are tested based on previous research results. Finally, the optimal installation method of ECC is selected on underground power cable systems.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• Proceedings of the KIEE Conference
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• 2008.11a
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• pp.110-112
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• 2008

This paper describes the effects of earth continuity conductor for reducing the level of induced sheath overvoltage at the single point bonded section of combined transmission systems. Firstly, 3 kinds of fault section are considered, and also faulty phases and the distance between phase conductor and earth continuity conductor are changed for the various analysis.

• Steel and Composite Structures
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• v.23 no.6
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• pp.727-736
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• 2017

The application of carbon fiber reinforced polymer (CFRP) in steel structures primarily includes two categories, i.e., the bond-critical application and the contact-critical application. Debonding failure and buckling failure are the main failure modes for these two applications. Conventional electrometric techniques may not provide precise results because of the limitations associated with single-point contact measurements. A nondestructive full-field measurement technique is a valuable alternative to conventional methods. In this study, the digital image correlation (DIC) technique was adopted to investigate the bond behavior and buckling behavior of CFRP-steel composite members. The CFRP-to-steel bonded joint and the CFRP-strengthened square hollow section (SHS) steel column were tested to verify the suitability of the DIC technique. The stereo-DIC technique was utilized to measure continuous deformation. The bond-slip relationship of the CFRP-to-steel interface was derived using the DIC data. Additionally, a multi-camera DIC system consisting of four stereo-DIC subsystems was proposed and applied to the compressive test of CFRP-strengthened SHS steel column. The precise buckling location and CFRP delamination of the CFRP-strengthened SHS steel column were identified. The experimental results confirm that the stereo-DIC technique can provide effective measurements for investigating the behaviors of CFRP-steel composite members.