• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.1
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• pp.74-78
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• 2024

We have studied the effects of Ag on the characteristics of Sn₄₈In₅₂Ag_x (wt%) low-melting solders for photovoltaic ribbons. The Sn₄₈In₅₂ (wt%) solder coexisted in the InSn₄ and In₃Sn alloys. Ag atoms added in the solder formed an AgIn₂ alloy by reacting with some part of In atoms, while they did not react with Sn atoms. The addition of Ag atoms in the Sn₄₈In₅₂Ag_x (wt%) solders showed useful results; an increase in peel strength and a decrease in melting temperature. The peel strength of the ribbon plated with the Sn₄₈In₅₂ (wt%) solder was 53.6 N/mm², and that of the Sn₄₈In₅₂Ag₁ (wt%) solder largely increased to 125.1 N/mm². In the meanwhile, the melting temperature of the Sn₄₈In₅₂ (wt%) solder was 119.2℃, and that of the Sn₄₈In₅₂Ag₁ (wt%) solder decreased to 114.0℃.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.351-357
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• 2005

Comparison of shear strength and shear energy of the 48Sn-52In solder bumps reflowed on Cu UBM were made with variations of reflow temperature from $150^{\circ}C$ to $250^{\circ}C$ and reflow time from 1 min to 20 min to establish an evaluation method for the mechanical reliability of solder bumps. Compared to the shear strength, the shear energy of the Sn-52In solder bumps was much more consistent with the solder reaction behavior and the fracture mode at the Sn-52In/Cu interface, indicating that the bump shear energy can be used as an effective tool to evaluate the mechanical integrity of solder/UBM interface.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.87-93
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• 2005

Interfacial reactions between 48Sn-52In solder and $0.1{\mu}m$ Ti/3 ${\mu}m$ Cu/Au under bump metallurgies(UBM) with various Au thickness of $0.1{\~}0.7{\mu}m$ have been investigated after solder reflow at $150^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ for 1 minute. Ball shear strength and shear energy of the Sn-52In solder bump on each UBM was also evaluated. With reflowing at $150^{\circ}C$ and $200^{\circ}C$, $Cu_6(Sn,In)_5$ and $AuIn_2$ intermetallic compounds were formed at UBW solder interface. However, UBM was consumed almost completely with reflowing at $250^{\circ}C$. While ball shear strength was not consistent with UBM/solder reactions, ball shear energy matched well with UBM/solder reactions.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.2
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• pp.186-190
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• 2023

We studied the various characteristics of Sn-In (wt%) Pb-free solders for photovoltaic ribbon application. The solders near the eutectic composition of Sn₄₈In₅₂ (wt%) existed in InSn₄ and In₃Sn alloy phases, and in In crystal phase, but not in Sn crystal phase. In addition, the InSn₄ phase (γ-alloy) existed separately from the In₃Sn (β-alloy) and the In phase confirmed by an SEM-EDS-mapping. The melting temperature of the eutectic solder of Sn₄₈In₅₂ (wt%) was 119.2℃, and when the Sn content decreased in reference to the eutectic composition, it slightly increased to 121.4℃, but when the Sn content increased, it remained almost constant at 119.1℃. The peel strength of the ribbon plated with the Sn₄₂In₅₈ (wt%) solder was 38.7 N/mm², and it tended to increase when the Sn content increased. The peel strength of the eutectic Sn₄₈In₅₂ (wt%) solder was 53.6 N/mm², and that of the Sn₅₁In₄₉ (wt%) solder was 61.6 N/mm² that was the highest.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.39-43
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• 2002

The eutectic solder Sn-37Pb and the lead free solder alloys with the compositions of Sn-0.7Cu, Sn-3.5Ag, Sn-3.5Ag-0.75Cu, Sn-2.0Ag-0.7Cu-3.0Bi were applied to the 48 BGA packages, and then it was discussed for the shear strength at the solder joints as the hardness and the composition of the small solder ball. As a result of experiments, the high degree of hardness with the displacement of 0.043 mm was obtained in Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of the lead free solder was higher than that of Sn-37Pb solder, and it can be obtained the maximum value of about 52% in Sn-2.0Ag-0.7Cu-3.0Bi.

• Elastomers and Composites
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• v.52 no.4
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• pp.287-294
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• 2017

Nanocomposites based on $SnO_2-Mn$ were synthesized by the reaction of tin (II) chloride dihydrate and manganese (II) chloride tetrahydrate at a molar ratio of 10:1 in the presence of ammonium hydroxide at $80^{\circ}C$. The $SnO_2-Mn$ nanocomposites were stirred with fullerene [$C_{60}$] in a mass ratio of 2:1 in tetrahydrofuran to prepare $SnO_2-Mn-C_{60}$ nanocomposites; these nanocomposites were obtained upon heating the mixture of $SnO_2-Mn$ nanocomposites and fullerene [$C_{60}$] in an electric furnace at $700^{\circ}C$ for 2 h. The synthesized $SnO_2-Mn-C_{60}$ nanocomposites were confirmed through various characterization methods such as X-ray diffraction and scanning electron microscopy. The photocatalytic activities of the $SnO_2-Mn-C_{60}$ nanocomposites were demonstrated by the degradation of the organic dyes BG, MB, MO, and RhB under 254 nm irradiation and evaluated using UV-Vis spectrophotometry.

• Korean Journal of Veterinary Service
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• v.14 no.2
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• pp.148-153
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• 1991

To investigate epidemological sitution of bovine viral diarrhea infection, serological survey in cattle being raised in Young Dong province were conducted. Bovine sera collected ramdomly from August 1990 to December 1990 were tested for bovine viral diarrhea virus serum neutralizing antibody titers. The results were as follows 1. BVDV SN antibody levels were considerably varies and positive rate was 58(108 heads out of 186) 2. BVDV SN antibodies to breeds of cattle was various and positive rates showed that diary cattle, beef, native cattle(Korean) were 67.52%, 59.38%, 27.00％ respectively followed in that order. 3. In the regional prevalence of BVD SN antibodies in cattle, Alpine(92％) was the highest, Young Dong south(59%) middle(44%), and North 30% followed in that order 4. In the age relatated prevalence of BVD SN antibodies, the younger than 6 month old group was the highest 65.7%, and older than 25 month old group was also at 62.2％. Then, 7 to 12 moth old group and 13 to 24 month old group showed to 58.5%, 52.1％ respectively. 5. The geometric mean titer (log2) of 108 cattle serum samples showing positive BVD SN antibodies was 4.3. 6. In the geometric mean titer(log2) according to age, younger than 6 month old group (5.2) was the highest, then 7 to 12 month old group 2.8(SD=1.94 standard deviation) was lowliest.

• Proceedings of the KWS Conference
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• 1995.10a
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• pp.110-112
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• 1995

Initial solder joint strengths of various solder pastes, such as Sn-Pb(63-37wt%), Sn-In(52-48wt%), Sn-In-Ag(77.5-20-2.5wt%), and Sn-Ag(96.5-3.5wt%) has been studied. A system that can control the solder joint interface temperature during bonding process was also desined and implemented to improve solder joint integrity.

• The Bulletin of The Korean Astronomical Society
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• v.44 no.2
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• pp.52.2-52.2
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• 2019

In the last decades, the use of type Ia supernovae (SN) as standard candles has allowed us to understand the geometry of the Universe as they help to measure the expansion rate of the Universe, especially in combination with other cosmological probes such as the study of cosmic microwave background radiation anisotropies or the study of the imprint of baryonic acoustic oscillations on the galaxy clustering. Cosmological parameter constraints obtained with type Ia SN are mainly affected by intrinsic systematic errors. But there are other systematic effects related with the correlation of the observed brightness of Supernova and the large-scale structure of the Universe such as the effect of peculiar velocities and gravitational lensing. The former is relevant for SN at low redshifts while the latter starts being relevant for SN at higher redshifts. Gravitational lensing depends on how much matter is along the trajectory of each SN light beam. In order to account for this effect, we consider a statistical approach by defining the probability distribution (PDF) that a given supernova brightness is magnified by a given amount, for a particular redshift. We will show that different theoretical approaches to define the matter density along the light trajectory hugely affect the shape and width of the PDF. This may have catastrophic effects on cosmology fits using Supernova lensing as planned for surveys such as the Dark Energy Survey or future surveys such the Large Synoptic Survey Telescope.

• Journal of Welding and Joining
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• v.20 no.6
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• pp.59-59
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.