• Transactions of Materials Processing
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• v.26 no.3
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• pp.162-167
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• 2017

The tensile surface residual stress in the multi-pass drawn wire deteriorates the mechanical properties of the wire. Therefore, the evaluation of the residual stress is very important. Especially, the axial residual stress on the wire surface is the highest. Therefore, the objective of this study was to propose an axial surface residual stress prediction model of the multi-pass drawn steel wire. In order to achieve this objective, an elastoplastic finite element (FE) analysis was carried out to investigate the effect of semi-die angle and reduction ratio of the axial surface residual stress. By using the results of the FE analysis, a surface residual stress prediction model was proposed. In order to verify the effectiveness of the prediction model, the predicted residual stress was compared to that of a wire drawing experiment.

• Journal of Welding and Joining
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• v.7 no.4
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• pp.46-55
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• 1989

Zirconia coatings are performed by the plasma spraying on the substrate of Al-Si alloy. In case of plasma sprayed ceramic coatings, it is important to control properly residual stress occurred during cooling process. Residual stress in coating layer varies with sprayed conditions and is influenced greatly by the coating layer thickness. Surface residual stress due to coating layer thickness is measured by X-ray diffraction method and the residual stress in coating layer is estimated by the deflection of coating layer when the restraint force in substrate was removed. When zirconia was coated on the substrate, tensile residual stress remains on zirconia coated surface layer. The tensile stress is increased to 0.35mm thickness and after 0.45mm thickness it is decreased abrouptly. A thick bond and composite coating reduce the zirconia surface stress and composite coating controls effectively the thick zirconia surface stress.

• Journal of the korean Society of Automotive Engineers
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• v.13 no.6
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• pp.109-118
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• 1991

In this study, it is intended to investigate the effect of the grinding conditions such as table feed, down feed, cross feed of residual stress distribution. And this distribution is investigated upon the grinding direction and the its orthogonal direction at ground layers. The material is used carbon steel (SM20C) which usually used to motor axis. And in order to be considered as Bernoulli-Euler beam, the dimension of the specimen is appropriately designed. According as corroiding the ground surface, the residual stress layers are removed and strain which occured on account of unbalance of internal stress is detected by rosette-gate. Through A/D converter and computer, these values are saved and evaluated residual stress by stress-strain relation formula. Finally, these results are diagrammatized with Auto Cad. The results obtained are as follows. As the depth from the ground surface increases in grinding direction and its orthogonal direction, tensile residual stress exists in the surface, and subsequently it becomes compressive residual stress as it goes downward. As the table feed, the cross feed and the down feed increase, maximum residual stress is transformed form the tensile to the compressive.

• Corrosion Science and Technology
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• v.6 no.4
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• pp.154-158
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• 2007

For the application of flexible printed circuit board (FPCB), electroplated copper is required to have low surface roughness and residual stress. In the paper, the effects of surface roughness and residual stress of electroplated copper as thick as $8{\mu}m$ were studied on organic additives such as inhibitor, leveler and accelerator. Polyimide film coated with sputtered copper was used as a substrate. Surface roughness and surface morphology were measured by 3D-laser surface analysis and FESEM, respectively. Residual stress was calculated by Stoney's equation after measuring radius curvature of specimen. The addition of additives except high concentration of accelerator in the electrolyte decreased surface roughness of electroplated copper film. Such a tendency was explained by the function of additives among which the inhibitor and the leveler inhibit electroplating on a whole surface and prolusions, respectively. The accelerator plays a role in accelerating the electroplating in valley parts. The inhibitors and the leveler increased residual stress, whereas the accelerator decreased it. It was thought to be related with entrapped additives on electroplated copper film rather than the preferred orientation of electroplated copper film. The reason why additives lead to residual stress remains for the future work.

• Transactions of Materials Processing
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• v.19 no.4
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• pp.224-229
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• 2010

During the multi-pass wire drawing process, wires suffer a great amount of plastic deformation that is through the cross-section. This generates tensile residual stress at surface of drawn wires. The generated residual stress on surface is one of the problems for quality of wires so that prediction and reduction of residual stresses is important to avoid unexpected fracture. Therefore, in this study, the effect of process variables such as semi-die angle, bearing length and reduction ratio on the residual stress was evaluated through Finite Element Analysis. Based on the results of the Analysis, a prediction model was established for predicting residual stress on the surface of high carbon steel(AISI1072, AISI1082). To identify the effectiveness of the proposed model, X-ray diffraction is used to measure the residual stresses on the surface. As the result of the comparison between calculated residual stresses and measured residual stresses, the model could be used to predict residual stresses in cold drawn wire.

• Design & Manufacturing
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• v.11 no.2
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• pp.51-56
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• 2017

Nitinol, a shape memory alloy (SMA), is manufactured from titanium and nickel and it used in various fields such as electrical applications, micro sensors. It is also recommended as a material in medical for implant because it has excellent organic compatibility. Nitinol is intended to be inserted into the human body, products require a high-quality surface and low residual stress. To overcome this problems, explore electrolyte polishing (EP) is being explored that may be appropriate for use with nitinol. EP is a particularly useful machining method because, as a non contact machining method, it produces neither machining heat nor internal stress in the machined materials. Sandpaper polishing is also useful machining method because, as a contact machining method, it can easily good surface roughness in the machined materials. The electrolyte polishing (EP) process has an effect of improving the surface roughness as well as the film polishing process, but has a characteristic that the residual stress is hardly generated because the work hardened layer is not formed on the processed surface. The sandpaper polishing process has the effect of improving the surface roughness but the residual stress remains in the surface. We experimented with three conditions of polishing process. First condition is the conventional polishing. Second condition is the electrochemical polishing(EP). And Last condition is a mixing process with the conventional polishing and the EP. Surface roughness and residual stress of the nitinol before a polishing process were $0.474{\mu}mRa$, -45.38MPa. Surface roughness and residual stress of the nitinol after mixing process of the conventional polishing and the EP were $1.071{\mu}mRa$, -143.157MPa. Surface roughness and residual stress of the nitinol after conventional polishing were $0.385{\mu}mRa$ and -205.15MPa. Surface roughness and residual stress of sandpaper and EP nitinol were $1.071{\mu}mRa$, -143.157MPa. The result shows that the EP process is a residual stress free process that eliminates the residual stress on the surface while eliminating the deformed layer remaining on the surface through composite surface machining rather than single surface machining. The EP process can be used for biomaterials such as nitinol and be applied to polishing of wafers and various fields.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.134-137
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• 2008

The effects of residual stress and surface defects on the mechanical properties of the high carbon steel filament used for the automotive tire have been experimentally investigated. The samples were fabricated with annealing temperature. The residual stress was measured by focused ion beam and strain mapping software which has advantages, such as data with high accuracy and fast data acquisition time. Mechanical properties, such as tensile strength and fatigue resistance, were gradually increased up to $200^{\circ}C$ and then slightly decreased. From the measurement of residual stress and level of surface defect, it was revealed that the critical factor was varied with different temperature region. That is, the fatigue resistance increased due to decreasing the residual stress and decreased due to increasing the size and distribution of surface defect.

• Interaction and multiscale mechanics
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• v.4 no.2
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• pp.85-105
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• 2011

The influence of surface elasticity and surface residual stress on the elastic field of an isotropic nanoscale elastic layer of finite thickness bonded to a rigid material base is considered by employing the Gurtin-Murdoch continuum theory of elastic material surfaces. The fundamental solutions corresponding to buried vertical and horizontal line loads are obtained by using Fourier integral transform techniques. Selected numerical results are presented for the cases of a finite elastic layer and a semi-infinite elastic medium to portray the influence of surface elasticity and residual surface stress on the bulk stress field. It is found that the bulk stress field depends significantly on both surface elastic constants and residual surface stress. The consideration of out-of-plane terms of the surface stress yields significantly different solutions compared to previous studies. The solutions presented in this study can be used to examine a variety of practical problems involving nanoscale/soft material systems and to develop boundary integral equations methods for such systems.

• Journal of the Semiconductor & Display Technology
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• v.3 no.2
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• pp.35-40
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• 2004

The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film / substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 $\mu\textrm{m}$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI...

• Journal of Korean Society of Steel Construction
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• v.8 no.3 s.28
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• pp.3-11
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• 1996

To investigate the effect of fatigue crack growth due to the surface residual stress, it is measured the residual stress distribution by x-ray diffraction at the crack tip each constant crack growth in the notch specimens, and quantitively assessed the effect of crack closure caused to the distribution of compressive stress at the crack tip from evaluating crack openning stress using the finite element analysis. It is concluded that the degree of the residual stress distribution at the crack tip is decreased with increasing the crack length. From the fact that it is similar to the crack openning stress ratio, it is found that the compressive residual stress distribution and size is related to the crack closure effect and surface residual stress field with propagating crack in the notch specimens depends on the stress intensity factor range at the crack tip.