• 한국산학기술학회논문지
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• 제16권5호
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• pp.2993-2999
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• 2015

강 제조 회사들은 연속주조금형의 표면을 보호하기 위해 Ni-B 또는 Ni-Co 합금 도금을 적용하고 있으며, 도금 층에 균열이 생기게 하는 황을 함유한 사카린 윤활제를 사용하고 있다. 균열 및 인장 응력을 유발하는 것은 Ni-S 화합물로 여겨진다. Ni-Mn-B 삼원합금은 Ni-S 화합물이 형성되기 이전에 Mn-S 화합물을 형성하여 균열을 억제하기 위해서 개발되었으나, Ni-Mn-B 합금 도금에 관한 국내나 해외 기준이 없다. 그리하여 새로이 개발된 Ni-Mn-B 도금을 평가하기 위한 신뢰성 평가기준을 개정하려한다. 가속수명시험을 개발하기 위해 FMEA(고장형태 영향분석)가 사용되어 도금의 주요 파괴 원인을 분석하였다. Ni-Mn-B 신뢰성 기준은 가속수명시험 방법을 포함하였고, 기본 성능 시험과 환경시험, 가속수명시험으로 분류되었으며, 80% 신뢰수준으로 B10수명 1 000시간을 보장하도록 고안되었다.

• 한국표면공학회지
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• 제18권3호
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• pp.105-115
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• 1985

Lead-tin-copper ternary alloy electrodeposition is conducted onto the inner bore surface of plain bearings as an overlay in order to investigate the effect of slot width, current density and fluoboric acid concentration on the uniformity of overlay. The thickness of overlay is analyzed by means of current distribution resulting from the overvoltage of plating bath and the apparent distance between cathode and anode. The result demonstrate that the uniformity of overlay is remarkably dependent of the slot size and current density, but has little bearing on the fluoboric acid concentration over 100g/L. This present study indicates that uniform overlay is obtainable within the tolerable thickness of ${\pm}2{\mu}m$ by using the slot width of 22mm. The surface morphology examination also shows the important role of concentration polarization of the micro-uniformity of overlay. The micro-uniformity has improved at the low concentration polarization which resulted from operating at the low current density and high fluoboric acid concentration. The surface morphology of deposits exhibits the vivid pyramid crystalline in the plating condition of low concentration polarizatio and all deposits have columnar structure parallel to the applied electric field regardless of the electroplating condition used.

• 한국표면공학회지
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• 제45권6호
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• pp.248-256
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• 2012

A Pd-based hydrogen membranes for hydrogen purification and separation need high hydrogen perm-selectivity. The surface roughness of the support is important to coat the pinholes free and thin-film membrane over it. Also, The pinholes drastically decreased the hydrogen perm-selectivity of the Pd-based composite membrane. In order to remove the pinholes, we introduced various surface pre-treatment such as alumina powder packing, nickel electro-plating and micro-polishing pre-treatment. Especially, the micro-polishing pretreatment was very effective in roughness leveling off the surface of the porous nickel support, and it almost completely plugged the pores. Fine Ni particles filled surface pinholes with could form open structure at the interface of Pd alloy coating and Ni support by their diffusion to the membrane and resintering. In this study, a $4{\mu}m$ surface pore-free Pd-Cu-Ni ternary alloy membrane on a porous nickel substrate was successfully prepared by micro-polishing, high temperature sputtering and Cu-reflow process. And $H_2$ permeation and $N_2$ leak tests showed that the Pd-Cu-Ni ternary alloy hydrogen membrane achieved both high permeability of $13.2ml{\cdot}cm^{-2}{\cdot}min^{-1}{\cdot}atm^{-1}$ permation flux and infinite selectivity.

• 한국표면공학회지
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• 제36권3호
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• pp.256-262
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• 2003

The current efficiency and the composition of Zn-Cr and Zn-Cr-X (X : Co, Mn) alloy electrodeposits were investigated by using chloride bath with EDTA auditive and flow cell plating system. The current efficiency of Zn-Cr alloy decreased with increasing current density, while it increased with the content of Co and Mn of the Zn-Cr-X alloy bath in high current density region. The Cr content in Zn-Cr alloy increased from 1.4-2.7 to $28wt\%$ with increasing current density and the phase structure of the alloys changed from $\eta-Zn$ through $\eta-Zn+\gamma'-ZnCr\;to\;\gamma'-ZnCr$ with Increasing Cr content of the alloys. The Co content in Zn-Cr-Co alloys increased with Co content of the bath, while Cr content of the alloy increased or decreased in low current density region $(10-75A/dm^2)$ or high current density region $(75-100A/dm^2)$, respectively. $\gamma-ZnCo$ phase was formed in the Zn-Cr-Co alloy with above $9.0wt\%$ Co. The content of Mn and Cr in Zn-Cr-Mn alloys increased or decreased with the increase of current density in high current density region, respectively while Cr content of the alloy decreased noticeably with the increase of Mn content in the bath. Two phases of $\delta_1-ZnMn$ and $\gamma'-ZnCr$ were formed in the Zn-Cr-Mn alloy with above $8.6wt\%$ Mn.

• 박물관보존과학
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• 제23권
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• pp.1-16
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• 2020

이 논문에서는 부여 규암리 출토 '금동관음보살입상(국보 제293호, M335번)' 1점을 현미경으로 확대 관찰하여 제작기법을 확인하였고, XRF 성분분석과 Hard X-선 조사로 구성 성분과 불상 표면 처리 방법, 주조법을 확인하였다. 이 불상은 연화대좌 위에 직립하는 보살상이다. 불상 양 측면으로 흘러내린 천의와 대좌에 표현된 연화문의 모양을 볼 때 7세기 이후에 만들어진 불상의 특징을 하고 있다. 대좌 안쪽에서 내형과 외형을 고정시키기 위한 틀잡이와 주물의 주입 흔적이 관찰되었다. 또한, 주조기법은 팔과 대좌 부분에 청동 주물시 형성된 기포가 확인되어 이를 종합해 볼 때 고대 중소형 금동불 제작에 많이 사용되는 밀납주조법으로 제작한 것으로 판단된다. 성분분석 결과, 불상 내부에서는 시기적으로 6~7세기에 많이 나타나는 구리(Cu)-주석(Sn)-납(Pb) 계열의 3원계 합금을 사용한 것으로 확인되며 이는 금속을 합금하여 주조를 쉽게 하고 불상에 표현된 문양 및 장식을 선명하게 표현하고자 하는 의도로 추정된다. 불상 표면에서는 수은(Hg)이 검출되어 금(Au)을 수은(Hg)에 용해시켜 도금하는 방식인 아말감도금기법을 사용했던 것으로 추정되며 이러한 도금방법은 고대 한반도에서 제작된 소형 금동불에서 주로 확인되는 불상의 도금 방식이다.

• 한국자기학회지
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• 제16권5호
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• pp.249-254
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• 2006

CoFeNi 합금은 HDD, MEMS 분야에서 head core 재료로 쓰이는 permalloy(FeNi)합금보다 뛰어난 우수한 자기적 특성을 가진 재료로써 최근 많이 연구되어지고 있다. 전기도금된 CoFeNi합금 박막의 열처리에 따른 미세구조 변화와 결정학적 특성이 자기특성에 미치는 영향을 조사하였다. 삼원계 합금을 열처리하면 전기도금 시 결정의 크기와 결정구조의 변화가 자기특성에 영향을 미친다. 이를 조사하여 열처리를 통하여 얻어지는 CoFeNi계 박막의 자기 특성을 향상시키고자 하였고, $300{\sim}400^{\circ}C$까지 열처리를 함으로써 보자력을 최소화하고 포화자화 값을 증가시켰다. 포화자화 값의 증가는 bcc상의 생성으로 야기되는 것으로 판단된다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.