• Title/Summary/Keyword: Thermal Stress Analyses

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Stress and Thermal Analyses of Pressure Housing of SMART CEDM (SMART제어봉구동장치의 압력용기에 대한 응력 및 열해석)

  • 조대희;유제용;김지호;김종인
    • Proceedings of the Computational Structural Engineering Institute Conference
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    • 2002.04a
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    • pp.343-350
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    • 2002
  • The structural stability of pressure housing of SMART CEDM forming pressure boundary must be evaluated. In this paper, the stress and thermal analyses of the upper pressure housing of CEDM are performed for design pressure, hydraulic test pressure and thermal loading. Finite element and boundary condition were generated from the model which is made by I-DEAS program and the stress and thermal analyses were performed by ANSYS Program. The upper Pressure housing was analysed using 2D axisymmetric model because it is symmetry about an axis. The stress values obtained by analysis were compared with the stress intensity limit of ASME and KEPIC MNB standard.

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Thermal Stress Analysis for the Printed Circuit Board of Electronic Packages (전자장비 회로기판의 열응력해석)

  • Kwon Y. J.;Kim J. A.
    • Korean Journal of Computational Design and Engineering
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    • v.9 no.4
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    • pp.416-424
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    • 2004
  • In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

Thermal Stress Analysis and Flow Characteristics of a Bellows-Seal Valve for High Pressure and Temperature (고온.고압용 벨로우즈 실 밸브의 유동 특성 및 열응력 해석)

  • Kim, Kwang-Su;Lee, Jong-Chul;Kim, Youn-Jea
    • The KSFM Journal of Fluid Machinery
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    • v.8 no.6 s.33
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    • pp.40-46
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    • 2005
  • Because of design and manufacturing costs, it is important to predict an expected life of bellows with component stresses of bellows as its design factors and material characteristics. In this study, numerical analyses are carried out to elucidate the thermal and flow characteristics of the bellows-seal gate and globe valves for high temperature (max. $600^{\circ}C$) and for high pressure (max. $104 kgf/cm^2$) conditions. Using commercial codes, FLUENT, which uses FVM and SIMPLE algorithm, and ANSYS, which uses FEM, the pressure and temperature fields are graphically depicted. In addition, when bellows have an axial displacement, thermal stress affecting bellows life is studied. The pressure and temperature values obtained from the flow analyses are adopted as the boundary conditions for thermal stress analyses. As the result of this study, we got the reasonable coefficients for valve and thermal stress for bellows, compared with existing coefficients and calculated values.

SURGE LINE STRESS DUE TO THERMAL STRATIFICATION

  • Jhung, Myung-Jo;Choi, Young-Hwan
    • Nuclear Engineering and Technology
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    • v.40 no.3
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    • pp.239-250
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    • 2008
  • If there is a water flow with a range of temperature inside a pipe, the wanner water tends to float on top of the cooler water because it is lighter, resulting in the upper portion of the pipe being hotter than the lower portion. Under these conditions, such thermal stratification can play an important role in the aging of nuclear power plant piping because of the stress caused by the temperature difference and the cyclic temperature changes. This stress can limit the lifetime of the piping, even leading to penetrating cracks. Investigated in this study is the effect of thermal stratification on the structural integrity of the pressurizer surge line, which is reported to be one of the pipes most severely affected. Finite element models of the surge line are developed using several element types available in a general purpose structural analysis program and stress analyses are performed to determine the response characteristics for the various types of top-to-bottom temperature differentials due to thermal stratification. Fatigue analyses are also performed and an allowable environmental correction factor is suggested.

V-Factor Estimation Under Thermal and Mechanical Stress for Circumferentially Cracked Cylinder (열하중 및 기계하중이 작용하는 원주 방향 균열 배관에 대한 V-계수 평가)

  • Song, Tae-Kwang;Oh, Chang-Kyun;Kim, Yun-Jae
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.32 no.12
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    • pp.1123-1131
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    • 2008
  • This paper provides V-factor estimation under combined mechanical and thermal load for circumferential cracks. Results are based on finite element analyses and effect of types and magnitudes of the thermal stress, crack geometry, the loading mode and plastic strain hardening on variations of the V-factor are investigated. The results of finite element analyses are compared with R6 values. As a result, it is shown that R6 gives generally conservative results. The conservatism is especially increased for the combination of large mechanical and thermal load. As a result, new estimation method which uses failure assessment line in R6 is proposed for V-factor and gives less conservative results.

A Convergent Investigation on the thermal and stress analyses of CPU Cooler (CPU 쿨러의 열 및 응력 해석에 관한 융합 연구)

  • Choi, Kye-Kwang;Cho, Jae-Ung
    • Journal of the Korea Convergence Society
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    • v.11 no.8
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    • pp.153-158
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    • 2020
  • In this study, the thermal and stress analyses were performed by applying a temperature condition of 100℃ at CPU cooler model. The value of heat flux value is shown to be the most at the lower rod area. The upper part becomes, the smaller the heat flow rate. The highest temperature is shown at the bottom of the CPU cooler model. Overall, the upper part becomes, the smaller the temperature becomes. Based on the temperature analysis, the thermal deformation caused by expansion, the deformation becomes smaller as the upper part of the overlapping plates. The great deformation happens at the bent area of the small rod as the lower part of model and the least deformation is shown at the lowest floor of model. In addition, the maximum thermal stress of 570.63 MPa happens at the floor below model. The stress is shown to decrease as the upper part of the overlapping plates becomes. But the stress is shown to increase somewhat at the middle part of model. By applying the study result on the thermal and stress analyses of CPU cooler, this study is seen to be suitable for the aesthetic convergence.

Thermal Stress Calculations Using Enhanced Green's Function Considering Temperature-dependent Material Properties (온도 의존적 재료물성치를 고려한 개선된 그린함수 기반 열응력 계산)

  • Han, Tae-Song;Huh, Nam-Su;Jeon, Hyun-Ik;Ha, Seung-Woo;Cho, Sun-Young
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.24 no.5
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    • pp.535-540
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    • 2015
  • We propose an enhanced Green's function approach to predict thermal stresses by considering temperature-dependent material properties. We introduce three correction factors for the maximum stress, the time taken to reach maximum stress, and the time required to attain steady state based on the Green's function results for each temperature. The proposed approach considers temperature-dependent material properties using correction factors, which are defined as polynomial expressions with respect to temperatures based on Green's functions, that we obtain from finite-element (FE) analyses at each temperature. We verify the proposed approach by performing detailed FE analyses on thermal transients. The Green's functions predicted by the proposed approach are in good agreement with those obtained from FE analyses for all temperatures. Moreover, the thermal stresses predicted using the proposed approach are also in good agreement with the FE results, and the proposed approach provides better predictions than the conventional Green's function approach using constant, time-independent material properties.

An Experimental Study on the Measurement of Temperature and Thermal Stress of Wall Type Mass Concrete Structure (벽체형 매스콘크리트구조물의 온도 및 온도응력측정에 관한 실험적 연구)

  • 강석화;이용호;정한중;박칠림
    • Proceedings of the Korea Concrete Institute Conference
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    • 1995.10a
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    • pp.173-177
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    • 1995
  • Thermal cracks ard occured when thermal stress due to the hydration of cement exceeds the tensile strength of concrete. Since cracking causes poor durability of concrete, the effect of thermal cracking should be included for the desing and construction of massive concrete structures. In this study, an experiments are performed for the investigation of time dependent temperature and thermal stress of massive concrete structure at early ages. In order to measure temperatures and thermal stresses, concrete stress meter, embedded strain meter, non-stress meter, and thermocouples are used. Based on the analyses of measured thermal stress data, measured values by concrete stress meter are more reliable than those by embedded strain meter and non-stress meter, And measured values by concrete stress meter are compared with the calculated values by FEM program developed by DICT (DWTS2D). Calculated values by DWTS2D show good agreement with measured values.

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Estimations of the C(t)-Integral in Transient Creep Condition for Pipe with Crack Under Combined Mechanical and Thermal Stress (I) - Elastic-Creep - (복합응력이 작용하는 균열 배관에 대한 천이 크리프 조건에서의 C(t)-적분 예측 (I) - 탄성-크리프 -)

  • Song, Tae-Kwang;Kim, Yun-Jae
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.9
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    • pp.949-956
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    • 2009
  • The C(t)-integral describes amplitude of stress and strain rate field near a tip of stationary crack under transient creep condition. Thus the C(t)-integral is a key parameter for the high-temperature crack assessment. Estimation formulae for C(t)-integral of the cracked component operating under mechanical load alone have been provided for decades. However, high temperature structures usually work under combined mechanical and thermal load. And no investigation has provided quantitative estimates for the C(t)-integral under combined mechanical and thermal load. In this study, 3-dimensional finite element analyses were conducted to calculate the C(t)-integral of elastic-creep material under combined mechanical and thermal load. As a result, redistribution time for the crack under combined mechanical and thermal load is re-defined through FE analyses to quantify the C(t)-integral. Estimates of C(t)-integral using this proposed redistribution time agree well with FE analyses results.

Treatment of Stainless Steel Cladding in Pressurized Thermal Shock Evaluation: Deterministic Analyses

  • Changheui Jang;Jeong, lll-Seok;Hong, Sung-Yull
    • Nuclear Engineering and Technology
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    • v.33 no.2
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    • pp.132-144
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    • 2001
  • Fracture mechanics is one of the major areas of the pressurized thermal shock (PTS) evaluation. To evaluate the reactor pressure vessel integrity associated with PTS, PFM methodology demands precise calculation of temperature, stress, and stress intensity factor for the variety of PTS transients. However, the existence of stainless steel cladding, with different thermal, physical, and mechanical property, at the inner surface of reactor pressure vessel complicates the fracture mechanics analysis. In this paper, treatment schemes to evaluate stress and resulting stress intensity factor for RPV with stainless steel clad are introduced. For a reference transient, the effects of clad thermal conductivity and thermal expansion coefficients on deterministic fracture mechanics analysis are examined.

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