• Title/Summary/Keyword: Thermal diffusion coefficient

Search Result 99, Processing Time 0.034 seconds

Evaluation of Thermal Characteristics for Warm Forging Die due to Lubricants and Surface Treatments (윤활제와 표면처리에 따른 온간단조 금형의 열적특성 평가)

  • 김종호;김동진;정덕진;김병민
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2000.05a
    • /
    • pp.833-836
    • /
    • 2000
  • The mechanical and thermal load. and thermal softening which is happened by the high temperature of die, in hot and warm forging, cause wear. heat checking and plastic deformation, etc. This study is for the effects of solid lubricants and surface treatments for warm forging die Because cooling effect and low friction are essential to the long lift of dies. optimal surface treatments and lubricants are very important to hot and warm forging Process. The heat that is generated by repeated forging processes. and its transfer are important factors to affect die life. The main factors, which affect die hardness and heat transfer, are surface treatments and lubricants, which are related to thermal diffusion coefficient and heat transfer coefficient, etc. For verifying these. experiments art performed for diffusion coefficient and heat transfer coefficient in various conditions - different initial billet temperatures and different loads. Carbonitriding and ionitriding are used as surface treatments. and oil- base and water-base graphite lubrirants are used. The effects of lubricant and surface treatment for warm forging die lift are explained by their thermal characteristics.

  • PDF

DISTRIBUTIONS OF RESIDUAL STRESSES IN DIFFUSION BONDING OF DISSIMILAR MATERIALS TIAL TO STEEL 40CR

  • Peng, He;Jicai, Feng;Yiyu, Qian;Jiecai, Han
    • Proceedings of the KWS Conference
    • /
    • 2002.10a
    • /
    • pp.785-790
    • /
    • 2002
  • Distributions of residual stress in diffusion bonding of dissimilar materials intermetallics TiAl to steel 40Cr were simulated by FEM calculation. Results showed that destructive residual stresses presented in the minute area adjacent to bond-line of the base material with smaller coefficient of thermal expansion. Reducing bonding temperature and diminishing bonding time are in favor of the mollification of interface tresses.

  • PDF

Diffusion coefficient estimation of Si vapor infiltration into porous graphite

  • Park, Jang-Sick
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2015.08a
    • /
    • pp.190.1-190.1
    • /
    • 2015
  • Graphite has excellent mechanical and physical properties. It is known to advanced materials and is used to materials for molds, thermal treatment of furnace, sinter of diamond and cemented carbide tool etc. SiC materials are coated on the surface and holes of graphite to protect particles emitted from porous graphite with 5%~20% porosity and make graphite hard surface. SiC materials have high durability and thermal stability. Thermal CVD method is widely used to manufacture SiC thin films but high cost of machine investment and production are required. SiC thin films manufactured by Si reaction liquid and vapore with carbon are effective because of low cost of machine and production. SiC thin films made by vapor silicon infiltration into porous graphite can be obtained for shorter time than liquid silicon. Si materials are evaporated to the graphite surface in about $10^{-2}$ torr and high temperature. Si materials are melted in $1410^{\circ}C$. Si vapor is infiltrated into the surface hole of porous graphite and $Si_xC_y$ compound is made. $Si_x$ component is proportional to the Si vapor concentration. Si diffusion coefficient is estimated from quadratic equation obtained by Fick's second law. The steady stae is assumed. Si concentration variation for the depth from graphite surface is fitted to quadratic equation. Diffusion coefficient of Si vapor is estimated at about $10^{-8}cm^2s^{-1}$.

  • PDF

THERMAL CONDUCTION IN MAGNETIZED TURBULENT GAS

  • CHO JUNGYEON;LAZARIAN A.
    • Journal of The Korean Astronomical Society
    • /
    • v.37 no.5
    • /
    • pp.557-562
    • /
    • 2004
  • We discuss diffusion of particles in turbulent flows. In hydrodynamic turbulence, it is well known that distance between two particles imbedded in a turbulent flow exhibits a random walk behavior. The corresponding diffusion coefficient is ${\~}$ ${\upsilon}_{inj}{\iota}_{turb}$, where ${\upsilon}_{inj}$ is the amplitude of the turbulent velocity and ${\iota}_{turb}$ is the scale of the turbulent motions. It Is not clear whether or not we can use a similar expression for magnetohydrodynamic turbulence. However, numerical simulations show that mixing motions perpendicular to the local magnetic field are, up to high degree, hydrodynamical. This suggests that turbulent heat transport in magnetized turbulent fluid should be similar to that in non-magnetized one, which should have a diffusion coefficient ${\upsilon}_{inj}{\iota}_{turb}$. We review numerical simulations that support this conclusion. The application of this idea to thermal conductivity in clusters of galaxies shows that this mechanism may dominate the diffusion of heat and may be efficient enough to prevent cooling flow formation when turbulence is vigorous.

Study of Equivalent Retention among Different Polymer-Solvent Systems is Thermal Field-Flow Fractionation

  • 김원숙;박영훈;문명희;유유경;이대운
    • Bulletin of the Korean Chemical Society
    • /
    • v.19 no.8
    • /
    • pp.868-874
    • /
    • 1998
  • An equivalent retention has been experimentally observed in thermal field-flow fractionation (ThFFF) for different polymer-solvent systems. It is shown that iso-retention between two sets of polymer-solvent systems can be obtained by adjusting the temperature difference (ΔT) according to the difference in the ratio of ordinary diffusion coefficient to thermal diffusion coefficient. This method uses a compensation of field strength (ΔT) in ThFFF at a fixed condition of cold wall temperature. It is applied for the calculation of molecular weight of polymers based on a calibration run of different standards obtained at an adjusted AT. The polymer standards used in this study are polystyrene (PS), polymethylmethacrylate (PMMA), and polytetrahydrofuran (PTHF). Three carrier solvents, tetrahydrofuran (THF), methylethylketone (MEK) and ethylacetate (ETAc) were employed. Though the accuracy in the calculation of molecular weight is dependent on the difference in the slope of log λ vs. log M which is related to Mark-Houwink constant a, it shows reasonable agreement within about 6% of relative error in molecular weight calculation for the polymer-solvent systems having similar a value.

Diffusion of Si Vapor Infiltrating into Porous Graphite (다공성 흑연의 기공내부로 침투하는 Si 증발입자의 확산)

  • Park, Jang-Sick;Hwang, Jungtae
    • Journal of the Korean institute of surface engineering
    • /
    • v.49 no.1
    • /
    • pp.104-109
    • /
    • 2016
  • Graphite's thermal stability facilitates its widespread use as crucibles and molds in high temperatures processes. However, carbon atoms can be rather easily detached from pores and outer surfaces of the graphite due to the weak molecular force of the c axis of graphites. Detached carbon atoms are known to become a source of dust during fabrication processes, eventually lowering the effective yield of products. As an effort to reduce these problems of dust scattering, we have fabricated SiC composites by employing Si vapor infiltration method into the pores of graphites. In order to understand the diffusion process of the Si vapor infiltration, Si and C atomic percentages of fabricated SiC composites are carefully measured and the diffusion law is used to estimate the diffusion coefficient of Si vapor. A quadratic equation is obtained from the experimental results using the least square method. Diffusion coefficient of Si vapor is estimated using this quadratic equation. The result shows that the diffusion length obtained through the Si vapor infiltration method is about 10.7 times longer than that obtained using liquid Si and clearly demonstrates the usefulness of the present method.

Molecular Dynamics Simulation Study for Transport Properties of Diatomic Liquids

  • Lee, Song-Hi
    • Bulletin of the Korean Chemical Society
    • /
    • v.28 no.10
    • /
    • pp.1697-1704
    • /
    • 2007
  • We present results for transport properties of diatomic fluids by isothermal-isobaric (NpT) equilibrium molecular dynamics (EMD) simulations using Green-Kubo and Einstein formulas. As the molecular elongation of diatomic molecules increases from the spherical monatomic molecule, the diffusion coefficient increases, indicating that longish shape molecules diffuse more than spherical molecules, and the rotational diffusion coefficients are almost the same in the statistical error since random rotation decreases. The calculated translational viscosity decreases with the molecular elongation of diatomic molecule within statistical error bar, while the rotational viscosity increases. The total thermal conductivity decreases as the molecular elongation increases. This result of thermal conductivity for diatomic molecules by EMD simulations is again inconsistent with the earlier results of those by non-equilibrium molecular dynamics (NEMD) simulations even though the missing terms related to rotational degree of freedom into the Green-Kubo and Einstein formulas with regard to the calculation of thermal conductivity for molecular fluids are included.

Experimental Study of the Relationship between Weight Variation and Thermal Conductivity in Polyurethane Foam (단열재의 무게변화와 열전도도와의 상관관계에 관한 실험적 연구)

  • Lee, Hyo-Jin
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
    • /
    • v.27 no.5
    • /
    • pp.241-246
    • /
    • 2015
  • Cellular foamed insulation such as polyurethane foam ages and degrades the thermal conductivity. Aging of foam is a result from the diffusion of gases, initially consisting of $CO_2$ but eventually replaced by air from the environment. The variation of the cell gas content with time is primarily influenced by the increase of thermal conductivity of the cellular foam. The weight of foam also changes as the gas diffuses and exchanges. In this study, a weight measurement method has been proposed to evaluate the effective diffusion coefficients of $CO_2$ and Air, $D_{CO2}=7.08504E-11$ and $D_{air}=4.86086E-12$, respectively and are compared with the gas analysis method.

Thermal diffusion and diffusion thermo effects on an unsteady heat and mass transfer magnetohydrodynamic natural convection Couette flow using FEM

  • Raju, R. Srinivasa;Reddy, G. Jithender;Rao, J. Anand;Rashidi, M.M.
    • Journal of Computational Design and Engineering
    • /
    • v.3 no.4
    • /
    • pp.349-362
    • /
    • 2016
  • The numerical solutions of unsteady hydromagnetic natural convection Couette flow of a viscous, incompressible and electrically conducting fluid between the two vertical parallel plates in the presence of thermal radiation, thermal diffusion and diffusion thermo are obtained here. The fundamental dimensionless governing coupled linear partial differential equations for impulsive movement and uniformly accelerated movement of the plate were solved by an efficient Finite Element Method. Computations were performed for a wide range of the governing flow parameters, viz., Thermal diffusion (Soret) and Diffusion thermo (Dufour) parameters, Magnetic field parameter, Prandtl number, Thermal radiation and Schmidt number. The effects of these flow parameters on the velocity (u), temperature (${\theta}$) and Concentration (${\phi}$) are shown graphically. Also the effects of these pertinent parameters on the skin-friction, the rate of heat and mass transfer are obtained and discussed numerically through tabular forms. These are in good agreement with earlier reported studies. Analysis indicates that the fluid velocity is an increasing function of Grashof numbers for heat and mass transfer, Soret and Dufour numbers whereas the Magnetic parameter, Thermal radiation parameter, Prandtl number and Schmidt number lead to reduction of the velocity profiles. Also, it is noticed that the rate of heat transfer coefficient and temperature profiles increase with decrease in the thermal radiation parameter and Prandtl number, whereas the reverse effect is observed with increase of Dufour number. Further, the concentration profiles increase with increase in the Soret number whereas reverse effect is seen by increasing the values of the Schmidt number.

Equilibrium and Non-equilibrium Molecular Dynamics Simulations of Thermal Transport Coefficients of Liquid Argon

  • Chang Bae Moon;Gyeong Keun Moon;Song Hi Lee
    • Bulletin of the Korean Chemical Society
    • /
    • v.12 no.3
    • /
    • pp.309-315
    • /
    • 1991
  • The thermal transport coefficients-the self-diffusion coefficient, shear viscosity, and thermal conductivity-of liquid argon at 94.4 K and 1 atm are calculated by non-equilibrium molecular dynamics (NEMD) simulations of a Lennard-Jones potential and compared with those obtained from Green-Kubo relations using equilibrium molecular dynamics (EMD) simulations and with experimental data. The time-correlation functions-the velocity, pressure, and heat flux auto-correlation functions-of liquid argon obtained from the EMD simulations show well-behaved smooth curves which are not oscillating and decaying fast around 1.5 ps. The calculated self-diffusion coefficient from our NEMD simulation is found to be approximately 40% higher than the experimental result. The Lagrange extrapolated shear viscosity is in good agreement with the experimental result and the asymptotic formula of the calculated shear viscosities seems to be an exponential form rather than the square-root form predicted by other NEMD studies of shear viscosity. The agreement for thermal conductivity between the simulation results (NEMD and EMD) and the experimental result is within statistical error. In conclusion, through our NEMD and EMD simulations, the overall agreement is quite good, which means that the Green-Kubo relations and the NEMD algorithms of thermal transport coefficients for simple liquids are valid.