• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.79-94
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• 2002

Root cause -Thermal expansion coefficient mismatch -Tape warpage -Initial die crack (die roughness) Guideline for failure prevention -Optimized tape/Substrate design for minimizing the warpage -Fine surface of die backside Root cause -Thermal expansion coefficient mismatch - Repetitive bending of a signal trace during TC cycle - Solder mask damage Guideline for failure prevention - Increase of trace width - Don't make signal trace passing the die edge - Proper material selection with thick substrate core Root cause -Thermal expansion coefficient mismatch -Creep deformation of solder joint(shear/normal) -Material degradation Guideline for failure Prevention -Increase of solder ball size -Proper selection of the PCB/Substrate thickness -Optimal design of the ball array -Solder mask opening type : NSMD -In some case, LGA type is better

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1315-1320
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• 2003

The thermal expansion coefficient, which causes the micro failure at the interfacial state of thin films is necessary to consider for proper designing MEMS. The effect of temperature on the coefficient of thermal expansion(CTE) of $SiO_2$ and $Si_3N_4$ film was investigated. Thermal strain induced by mismatch of CTE between substrate and thin film continuously measured with resolution-improved electronic speckle pattern interferometry(ESPI). The thermal stress induced by mismatch of CTE derivate through thermal strain. The thermal expansion coefficients of thin film were calculated with the general equation of CTE and thermal stress in thin films, and it confirmed that CTE of $SiO_2$changed from $0.25{\times}10^{-6}/^{\circ}C$ to $1.4{\times}10^{-6}/^{\circ}C$ with temperature increasing from 50 to $600^{\circ}C$

• Journal of the Korean Society for Precision Engineering
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• v.30 no.8
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• pp.802-808
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• 2013

Thermal barrier coating (TBC) is used to protect substrates and extend the operating life of gas turbines in power plant and aeronautical applications. The major causes of failure of such coatings is spallation, which results from thermal stress due to a thermal expansion coefficient mismatch between the top coating and the bond coating layers. In this paper, the effects of the material properties and the thickness of the top coating layer on thermal stresses were evaluated using the finite element method and the equation for the thermal expansion coefficient mismatch stress. In addition, we investigated a design technique for the top coating whereby thermal resistance is exploited.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.14-14
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• 2011

Graphene is known to possess excellent thermal properties, including high thermal conductivity, that make it a prime candidate material for heat management in ultra large scale integrated circuits. For device applications, the key parameters are the thermal expansion coefficient and the thermal conductivity. There has been no reliable experimental determination on the thermal expansion coefficient of graphene whereas the estimates of the thermal conductivity vary widely. In this work, we estimate the thermal expansion coefficient of graphene on silicon dioxide by measuring the temperature dependence of the Raman spectrum. The shift of the Raman peaks due to heating or cooling results from both the intrinsic temperature dependence of the Raman spectrum of graphene and the strain on the graphene film due to the thermal expansion mismatch with silicon dioxide. By carefully comparing the experimental data against theoretical calculations, it is possible to determine the thermal expansion coefficient. The thermal conductivity is measured by estimating the thermal profile of a graphene film suspended over a circular hole of the substrate.

• Journal of the Korean institute of surface engineering
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• v.35 no.5
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• pp.289-294
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• 2002

ZnTe films have been grown on (100) GaAs substrate with two representative problems. The one is lattice mismatch, the other is thermal expansion coefficients mismatch of ZnTe /GaAs. It claims here, the relationship of film thickness and defects distribution with (100) ZnTe/GaAs using hot wall epitaxy (HWE) growth was investigated by transmission electron microscopy (TEM). It analyzed on the two-sort side using TEM with cross-sectional transmission electron microscopy (XTEM) and high-resolution electron microscopy (HREM). Investigation into the nature and behavior of dislocations with dependence-thickness in (100) ZnTe/ (100) GaAs hetero-structures grown by transmission electron microscopy (TEM). This defects range from interface to 0.7 $\mu\textrm{m}$ was high density, due to the large lattice mismatch and thermal expansion coefficients. The defects of low density was range 0.7$\mu\textrm{m}$~1.8$\mu\textrm{m}$. In the thicker range than 1.8$\mu\textrm{m}$ was measured hardly defects.

• The Journal of Korean Academy of Prosthodontics
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• v.28 no.1
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• pp.165-191
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• 1990

Although a number of studies have been performed to assure that residual stress caused by a mismatch of alloy porcelain thermal expansion can contribute to clinical failure of a ceramometal restoration, the interactive influence of cooling rate on the magnitude of thermal expansion difference and on bond strength between them have not been extensively analyzed. The objective of this study was to determine the influence of cooling rate and the number of firing cycles on the expansion mismatch and the flexural failure resistance of metal porcelain strip. Tested alloys included one Pd-Ag alloy, one Ni-Cr-Be alloy with two kinds of porcelain, Vita and Ceramco. Metal specimens were cast into rods with a height of 13mm and a diameter of 5mm. Subsequently, the castings were subjected to scheduled firing cycles without porcelain. And the porcelain specimens after being fired were trimmed into a bar with a final dimension of $5{\times}5{\times}25mm$. Thermal expansions of the alloys and porcelains were measured by using a push rod or a differential dialometer respecitvely. Porcelain glass transition temperatures and expansion values were derived alloy-porcelain pairs were assessed by comparing expansion values of the components at a porcelain glass transition temperature. Calculations were made using combinations of a Ni-Cr alloy or Pd-Ag alloy with each of two porcelain products. Metal-porcelain strip specimens were subjected to four point loading in an Instron testing machine until crack occured at the metal-cramic interface at the time of sharp decrease of load on recorder. On the basis of this study, the following conclusions may be stated: 1. Regardless of the kinds of ceramometal combinations, both of calculated and experimental data revealed that the double fired specimens exhibited a significantly lower flexural strength. 2. By the rise of the amount of mismatch, bond strength were decreased. 3. Thermal expansion value of Pd-Ag alloys were higher than that of Ni-Cr alloys. 4. Expansion curves of metal were proportional to the increase of temperature and were not affected by the experimental conditions, however porcelains did not show the same magnitude of metal, and a shift of the glass transition temperature to higher temperatures was observed when cooled rapidly 5. Alloy-porcelain thermal compatibility appeared more dependent on the porcelain than the alloy.

• The Journal of Korean Academy of Prosthodontics
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• v.29 no.1
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• pp.111-137
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• 1991

Although a number of studies have been performed to assure that residual stress caused by a mismatch of alloy porcelain thermal expansion can contribute to clinical failure of a ceramometal restoratoin, the interactive influence of cooling rate on the magnitude of thermal expansion difference and on bond strength between them have not been extensively analyzed. The objective of this study was to determine the influence of cooling rate and the number of firing cycles on the expansion mismatch and the flexural failure resistance of metal porcelain strip. Tested alloys included one Pd-Ag alloy, one Ni-Cr-Be alloy with two kinds of porcelain, Vita and Ceramco. Metal specimens were cast into rods with a height of 13mm and a diameter of 5mm. Subsequently, the castings were subjected to scheduled firing cycles without porcelain. And the porcelain specimens after being fired were trimmed into a bar with a final dimension of 5 x 5 x 25mm. Thermal expansions of the alloys and porcelains were measured by using a push rod or a differential dialometer respectively. Porcelain glass transition temperatures and expansion values were derived alloy- porcelain pairs were assessed by comparing expansion values of the components at a porcelain glass transition temperature. Calculations were made using combinations of a Ni-Cr alloy or Pd-Ag alloy with each of two porcelain products. Metal- porcelain strip specimens were subjected to four point loading in an Instron testing machine until crack occured at the metal-cramic interface at the time of sharp decrease of load on recorder. On the basis of this study, the following conclusions may be stated : 1. Regardless of the kinds of ceramometal combinations, both of calculated and experimental data revealed that the double fired specimens exhibited a significantly lower flexural strength. 2. By the rise of the amount of mismatch, bond strength were decreased. 3. Thermal expansion value of Pd-Ag alloys were higher than of Ni-Cr alloys. 4. Expansion curves of metal were proportional to the increase of temperature and were not affected by the experimental conditions, however porcelains did not show the same magnitude of metal, and a shift of the glass transition temperature to higher temperatures was observed when cooled rapidly. 5. Alloy- porcelain thermal compatibility appeared more dependent on the porcelain than the alloy.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1997.10a
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• pp.183-190
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• 1997

The wear behaviors of $Al_2O_3-40%TiO_2$ deposited on casting aluminum alloy(ASTM A356) by plasma spray against SiC ball have been investigated experimentally. Friction and wear tests are carried out at room temperature. The friction coefficient of $Al_2O_3-40%TiO_2$ coating is lower than that of pure $Al_2O_3$ coating(APS). It is found that low friction correspond to low wear and high friction to high wear in the experimental result. The thickness of $Al_2O_3-40%TiO_2$ coatings indicated the existence of the optimal coating thickness. It is found that a voids and porosities of coating surface result in the crack generated. As the tensile stresses in coating increased with the increased friction coefficient. The columnar grain of coating will be fractured to achieve the critical stress. It is found that the cohesive of splats and the porosity of surface play a role in wear characteristics. It is suggested that the mismatch of thermal expansion of substrate and coating play an important role in wear performance. Tensile and compressire under thermo-mechanical stress may be occurred by the mismatch between thermal expansion of substrate and coating. This crack propagation above interface is observed in SEM.

• Tribology and Lubricants
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• v.15 no.1
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• pp.39-45
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• 1999

The wear behavior of $Al_2$O$_3$-40%TiO$_2$deposited on casted aluminum alloy (ASTM A356) by APS (Air Plasma Spray) against SiC ball has been investigated in this work. Wear tests were carried out at room temperature. The friction coefficient of $Al_2$O$_3$-40%TiO$_2$coating is lower than that of pure $Al_2$O$_3$coating(APS). $Al_2$O$_3$-40%TiO$_2$coating indicated the existence of the optimal coating thickness. It is found that voids and pores of coating surface resulted in the generation of cracks, and the cohesive of splats and the porosity of surface play a role in wear characteristics. It is suggested that the mismatch of thermal expansion of substrate and coating play an important role in wear performance. Tension and compression under thermo-mechanical stress may be occurred by the mismatch between thermal expansion of substrate and coating. The crack propagation above interface is observed in SEM.

• Journal of the Korean Ceramic Society
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• v.34 no.5
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• pp.535-543
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• 1997

The surface of SiC particles were partially oxidized to produce SiO2 layers on the SiC particles to prepare Al2O3/SiC composite by formation of mullite bonds between the grains of Al2O3 and SiC during sintering at 1$600^{\circ}C$. This process is considered to enable the sintering of Al2O3/SiC composite at lower temperature and also to relieve the stress, produced by thermal expansion mismatch between Al2O3 and SiC. In fact, Al2O3/SiC composite prepared by oxidation of SiC was observed to be more effectively sintered and densified at lower temperature. Maximum density, flexural strength and microhardness were obtained with 5.65 vol% of mullite content in Al2O3/SiC composite.