• Title/Summary/Keyword: Thermal resistance

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Characterization of Thermal Contact Resistance Doped with Thermal Interface Material (접촉열전도재를 도포한 접촉열저항 특성연구)

  • Bajracharya, Iswor;Ito, Yoshimi;Nakayama, Wataru;Moon, Byeong-Jun;Lee, Sun-Kyu
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.9
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    • pp.943-950
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    • 2013
  • This paper describes the thermal contact resistance and its effect on the performance of thermal interface material. An ASTM D 5470 based apparatus is used to measure the thermal interface resistance. Bulk thermal conductivity of different interface material is measured and compared with manufacturers' data. Also, the effect of grease void in the contact surface is investigated using the same apparatus. The flat type thermal interface tester is proposed and compared with conventional one to consider the effect of lateral heat flow. The results show that bulk thermal conductivity alone is not the basis to select the interface material because high bulk thermal conductivity interface material can have high thermal contact resistance, and that the center voiding affects the thermal interface resistance seriously. On the aspect of heat flow direction, thermal impedance of the lateral heat flow shows higher than that of the longitudinal heat flow by sixteen percent.

Effects of some factors on the thermal-dissipation characteristics of high-power LED packages

  • Ji, Peng Fei;Moon, Cheol-Hee
    • Journal of Information Display
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    • v.13 no.1
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    • pp.1-6
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    • 2012
  • Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.

The effects of Clothing Materials and Multi-layered Textiles on Thermal Resistance Value (보온력에 미치는 피복재료와 겹침의 영향)

  • 손원교;차옥선
    • Journal of the Korean Home Economics Association
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    • v.37 no.11
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    • pp.157-165
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    • 1999
  • This study was carried out to examine the effect of clothing materials and multi-layered textiles on thermal resistance value. Cotton, polyester, wool, silk, rayon and acetate were selected for the specimens. Thermal resistance value was tested with 2 kinds of methods(thermo labo II and BK type tester). The results were as follows; 1. The effects of clothing materials for thermal resistance value were decreased by adding layers. 2. When the fabrics are measured with multiple layers, the fabric of the lowest thermal resistance value at single layer was showed the highest increasing tendency for all test methods.

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The Effects of Parka on Subject Wear Sensation as to Thermal Resistance (파카의 보온성에 따른 착용감에 관한 연구)

  • Lee Yoon-Jung;Lee Soon-Won
    • Journal of the Korean Society of Clothing and Textiles
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    • v.13 no.3 s.31
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    • pp.295-303
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    • 1989
  • This study is to measure the thermal resistance of 7 types of Parka of different materials with thermal manikin and to compare their effects on physiological responses & subjective wear sensations. Following are the results obtained from the experiments 1) From the thermal manikin experiment, i) As an outer layer, although not significant, water proof fabric was warmer than water proof-vapor permeable fabric. ii) In case of insulating material, down was better for thermal resistance than polyester wadding of the same thickness. Moreover, as the down was thicker, it had more efficiency in thermal resistance. However, the marginal efficiency of thickness was found to be decreasing. 2) From the male-subject experiments, i) Chest temperature, mean skin temperature & microclimate temperature showed the same results on thermal resistance as those of the thermal manikin experiment. ii) Only during rest periods, there was a significant difference among 5 insulating materials in the sense of microclimate humidity. The almost same conclusion was obtained from the above experiments. Even the outer layer did not significantly affect thermal resistance & subjective wear sensation, insulating materials had a significant influence upon them. But in case of 3.5 cm down, it gave less comfortable than that of the thinner. Therefore the optional one for the best comfort & thermal resistance among 7 combinatins is the outer layer of water proff-vapor permeable & insulating material of 2.1 cm down.

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Fundamental Studies on the Thermal conductivity and Thermal Diffusivity of Rough rice (벼의 열전도계수와 열확산계수에 관한 기초연구)

  • 김만수;고학균
    • Journal of Biosystems Engineering
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    • v.4 no.2
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    • pp.53-63
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    • 1979
  • The knowlege of thermal properties of rough rice has become of greate importance to the analysis of heat and mass transfer phenomenon in rice drying and storage process. Some information is available on the thermal properties of rough rice in foreign countries but is not available for these properties in Korea. A fundamental study was made to determine the thermal conductivity and thermal diffusivity of rough rice with line source method and to select current and resistance suitable for these properties from investigating the effect of current and resistance of heating wire on the temperature rise. The result of this study may be summarized as follows ; 1. Even through the power per unit length of heating wires is about the same, the tendency of temperature rise showed a little difference among them , and the suitable range of it for thermal properties was found to be 3.56-5.37w/m. 2. the most desirable resistance and current of heating wire was 18.40 ohm/m, 0.44 amperes among three kinds of heating wires and currents, respectively. because it took 13 minutes or so for the heating wire to reach equilibrium temperature. 3. The thermal conductivity of rough rice was 0.120-0.130 w/m$ ^\circ C$. and thermal diffusivity of it was $5.8210 $\times10^{-8} -9.7529 $\times10^{-8} m^2 /s.$ 4.The thermal conductivity showed a little difference in variation with resistance of heating wire but the variation of current of heating wire at the same resistance did not affect the thermal conductivity , and the thermal diffusivity was not affected by the variation of resistance and current.

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Evaluation of Ground Effective Thermal Properties and Effect of Borehole Thermal Resistance on Performance of Ground Heat Exchanger (지중 유효 열물성 산정 및 지중열교환기 성능에 대한 보어홀 열저항의 영향)

  • Sohn, Byonghu
    • Journal of the Korean Society for Geothermal and Hydrothermal Energy
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    • v.8 no.4
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    • pp.32-40
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    • 2012
  • Geothermal heat pump(GHP) systems use vertical borehole heat exchangers to transfer heat to and from the surrounding ground via a heat carrier fluid that circulates between the borehole and the heat pump. An Important feature associated with design parameters and system performance is the local thermal resistances between the heat carrier flow channels in the borehole and the surrounding ground. This paper deals with the in-situ experimental determination of the effective thermal properties of the ground. The recorded thermal responses together with the line-source theory are used to determine the thermal conductivity and thermal diffusivity, and the steady-state borehole thermal resistance. In addition, this paper compares the experimental borehole resistance with the results from the different empirical and theoretical relations to evaluate this resistance. Further, the performance simulation of a GHP system with vertical borehole heat exchangers was conducted to analyze the effect of the borehole thermal resistance on the system performance.

Thermal Design of IGBT Module with Respect to Stability (IGBT소자의 열적 안정성을 고려한 방열설계)

  • Lee Joon-Yeob;Song Seok-Hyun
    • Proceedings of the KIPE Conference
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    • 2002.11a
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    • pp.205-208
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    • 2002
  • Thermal design is required with considering thermal stability to verify the reliability of electric power device with using IGBT. Numerical analysis is performed to analyzed the change in thermal resistance with respect to the various thermal density of heating element. Correlations between thermal resistance and heat generation density are established. With using these correlations, performance curve is composed with respect to the change in thermal resistance of cooling conditions for natural convection and forced convection. Thermal fatigue is occurred at the Inside and outside of IGBT by repeated heat load. The crack is occurred between base plate and ceramic substrate for the inside. When the crack length is 4mm, the failure is occurred. Therefore, Thermal design method considering thermal density, thermal fatigue resistance is presented on this study and it is expected to thermal design with considering life prediction.

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Thermal Shock Resistance Property of TaC Added Ti(C,N)-Ni Cermets (TaC 첨가 Ti(C,N)-Ni 서멧의 내열충격 특성)

  • Shin, Soon-Gi
    • Korean Journal of Materials Research
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    • v.24 no.10
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    • pp.526-531
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    • 2014
  • Thermal shock resistance property has recently been considered to be one of the most important basic properties, in the same way that the transverse-rupture property is important for sintered hard materials such as ceramics, cemented carbides, and cermets. Attempts were made to evaluate the thermal shock resistance property of 10 vol% TaC added Ti(C,N)-Ni cermets using the infrared radiation heating method. The method uses a thin circular disk that is heated by infrared rays in the central area with a constant heat flux. The technique makes it possible to evaluate the thermal shock strength (Tss) and thermal shock fracture toughness (Tsf) directly from the electric powder charge and the time of fracture, despite the fact that Tss and Tsf consist of the thermal properties of the material tested. Tsf can be measured for a specimen with an edge notch, while Tss cannot be measured for specimens without such a notch. It was thought, however, that Tsf might depend on the radius of curvature of the edge notch. Using the Tsf data, Tss was calculated using a consideration of the stress concentration. The thermal shock resistance property of 10 vol% TaC added Ti(C,N)-Ni cermet increased with increases in the content of nitrogen and Ni. As a result, it was considered that Tss could be applied to an evaluation of the thermal shock resistance of cermets.

Thermal Characteristics of Men's Suit Ensembles (남성용 정장의 온열특성 연구)

  • Song, Min-Kyu;Jeon, Byung-Ik
    • Fashion & Textile Research Journal
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    • v.1 no.3
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    • pp.264-274
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    • 1999
  • The thermal resistance of 60 men's suits for summer and winter was measured to determine their thermal characteristics and physical properties, including air permeability, weight, and thickness of the jackets and trousers consisted of the ensembles were measured to predict the thermal resistance of garments and ensembles. In this study, general physical properties of the men' suit ensembles were determined. In general, thickness and weight of winter ensembles were greater than those of summer ensembles. A factor which could distinguish the difference between summer and winter ensembles was the air permeability. The air permeability of summer ensembles was 3~6 times greater than those of winter ensembles. For the thermal characteristics, the thermal resistance of winter ensembles were higher than those of summer ensembles. When the wind was involved, the thermal resistance of both ensembles decreased up to 30%. In addition, the equations were developed to predict the thermal resistance of the garments and ensembles when there was no air velocity and the thermal resistance of the ensembles with air velocity of 1.2 m/sec. Looking at the equations, thickness, weight, and size of the garments were the definite factors that affect the thermal resistance of the samples.

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A Study on the Effects of Design Parameters of Vertical Ground Heat Exchanger on the Borehole Thermal Resistance (수직밀패형 지중열교환기의 설계인자가 보어홀 전열저항에 미치는 영향에 관한 연구)

  • Chang, Keun Sun;Kim, Min-Jun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.10
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    • pp.128-135
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    • 2018
  • Currently, vertical closed ground heat exchangers are the most widely utilized geothermal heat pump systems and the major influencing parameters on the performance of ground heat exchangers are the ground thermal conductivity(k) and borehole thermal resistance($R_b$). In this study, the borehole thermal resistance was calculated from the in-situ thermal response test data and the individual effects of design parameters (flow rate, number of pipe, grout composition) on the borehole thermal resistance were analyzed. The grout thermal resistance was also compared with the correlations in the literatures. The borehole thermal resistance of the investigated ground heat exchanger results in 0.1303 W/m.K and the grout thermal resistance (66.6% of borehole thermal resistance) is the most influencing parameter on borehole heat transfer compared to the other design parameters (pipe thermal resistance, 31.5% and convective thermal resistance, 1.9%). In addition, increasing the thermal conductivity of grout by adding silica sand to Bentonite is more effective than the other design improvements, such as an increase in circulating flowrate or number of tubes on enhancing borehole heat transfer.