• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.640-645
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• 2007

An experimental apparatus to show the hot spot cooling of an IC chip using a thermoelectric cooler is developed. The spot heating in very small area is achieved by the applying CO$_2$ laser source and temperatures are measured using miniature thermocouples. The active effects of thermoelectric cooler on the hot spot cooling system such as rapid heat spreading in the chip and lowering the peak temperature around the hot spot region are investigated. The experimental results are simulated numerically using the TAS program, which the performance characteristics such as Seebeck coefficient, electrical resistance and thermal conductivity of the thermoelectric cooler are searched by trial and error. Good agreements are obtained between numerical and experimental results if the appropriate performance data of the thermoelectric cooler are given.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.3
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• pp.211-217
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• 2006

The three-dimensional numerical analysis has been carried out to figure out the effect of the thermoelectric element thickness on the thermal performance of the thermo-electric micro-cooler. The small-size and column-type thermoelectric cooler is considered. It is known that tellurium compounds currently have the highest cooling performance around the room temperature. Thus, in the present study, $Bi_{2}Te_{3}$ and $Sb_{2}Te_{3}$ are selected as the n- and p-type thermoelectric materials, respectively. The thermoelectric leg considered is less than $20{\mu}m$ thick. The thickness of the leg may affect the thermal and electrical transport through the interfaces between the leg and metal conductors. The effect of the thermoelectric element thickness on the thermal performance of the cooler has been investigated with parameters such as the temperature difference, the current, and the cooling power.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.9
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• pp.1615-1620
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• 2010

A thin film thermoelectric cooler for COB direct assembly was proposed and the COB cooler structure was modeled by electrical equivalent circuit by using SPICE model of thermoelectric devices. The embedded cooler attached between the die chip and metal plate can offer the possibility of thin film active cooling for the COB direct assembly. We proposed a driving method of TEC by using pulse width modulation technique. The optimum power to the TEC is simulated by using a SPICE model of thermoelectric device and passive components representing thermal resistance and capacitance. The measured and simulated results offer the possibility of thin film active cooling for the COB direct assembly.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.11
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• pp.1291-1296
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• 2014

The thermoelectric cooler is receiving great interest because of advantages such as the precise temperature control capability, the compact and lightweight cooler, and the mechanical vibrationless structure which enhances the reliability compared with the existing vapor compression cooler. However, it is not easy to design the optimal thermoelectric cooler which appropriate to the application because the thermal analysis should be necessary required. Accordingly, this paper studies the methodology of the modelling, sizing and thermal analysis of the thermoelectric cooler using SINDA/FLUINT analysis tool.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.15 no.11
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• pp.889-894
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• 2003

The objectives of this study are to present a proper mathematical model for a thermoelectric cooler equipped with the spacer and to investigate the effect of its geometries by heat transfer analysis. In order to enhance the efficiency of the thermoelectric cooler, the spacer is inserted between TEM (thermoelectric module) and cold plate. The theoretical results show that the COP (coefficient of performance) increases nonlinearly as high as 0.63 with increasing the depth of spacer and the depth of TEM and with decreasing the area of insulator.

• Journal of Sensor Science and Technology
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• v.22 no.1
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• pp.44-48
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• 2013

For a successful commercialization of microbolometer, it is required to develop a robust package including thermal stabilizing mechanism. In order to regulate the temperature within some operating range, thermoelectric cooler is generally used but it's not easy to model the whole package due to the coupled physics nature of thermoelectric cooler. In this paper, SPICE-compatible modeling methodology of a microbolometer package is presented, whose steady-state results matched well with FEM results at the maximum difference of 5.95%. Although the time constant difference was considerable as 15.7%, it can be offset by the quite short simulation time compared to FEM simulation. The developed model was also proven to be useful for designing the thermal stabilizer through parametric and transient analyses under the various working conditions.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.1
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• pp.159-165
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• 1995

A double-heterostructure mesa-stripe-geometry laser diode integrated with thermoelectric Peltier cooler has been designed and fabricated. Epi-layers have been grown by metal organic chemical vapor deposition(MOCVD) method. Peltier cooling effect has been measured for devices with a mesa width of 14$\mu$m and a cavity length of 380$\mu$m. The effects of thermoelectric cooling could be shown by measuring the optical output of the laser with the increase of the current in the thermoelectric cooler. While the input courrent of the laser was maintained at 250mA, the optical output was decreased from 4.8mW to 3.8mW due to heating, but with the thermoelectric cooler on the optical output power was recovered by more than 40%. The results show that the complicated cooling device is not needed since the cooling can be achevied by the developement of the fabrication processing.

• Journal of Power System Engineering
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• v.16 no.2
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• pp.17-23
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• 2012

The steady three-dimensional computational thermal flow analysis using standard k-${\varepsilon}$ turbulence model was carried out to investigate the heat transfer characteristics of a cabin cooler for a commercial vehicle. The heat exchanging method of this cabin cooler is to use the cooling effect of a thermoelectric module. In view of the results so far achieved, the air system resistance of a cabin cooler is about 12.4 Pa as a static pressure, and then the operating point of a cross-flow fan considering in this study is formed in the comparatively low flowrate region. The air temperature difference obtained from the cold part of an thermoelectric module is about $26^{\circ}C$, and the cooling water temperature difference obtained from the hot part of an thermoelectric module is about $3.5^{\circ}C$.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1459-1462
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• 2007

In general a thermoelectric cooler (TEC) consists of a series of P type and N type thermoelectric materials sandwiched between two wafers. When a DC current passes through these materials, three different effects take place; Peltier effect, Joule heating effect and heat transfer by conduction due to temperature difference between hot and cold plates. In this study we have developed a micro TEC using $Bi_2Te_3$ (N type) and $Bi_{0.5}Sb_{1.5}Te_3$ (P type) thin films. In order to improve that performance of a micro TEC, we made 10 um height TE legs using special PR only for lift-off. We measured COP (coefficient of performance) and temperature difference between hot and cold connectors with current.

• Progress in Superconductivity and Cryogenics
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• v.23 no.3
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• pp.55-59
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• 2021

A thermoelectric cooler (TEC) is promising as an alternative refrigeration technology for the sake of its inherent advantages; no-moving parts and refrigerant-free in its operation. Due to the compactness, reliability and excellence in temperature stability, TECs have been widely used for small cooling devices. In recent years, thermoelectric devices have been attractive technologies that not only serve the needs of cooling and heating applications but also meet the demand for energy by recycling waste heat. In this research paper, multistage TEC is proposed as a concept of demonstrating the idea of transient cooling technology. The key idea of transient cooling is to harnesses the thermal mass installed at the interfacial level of the stages. By storing heat temporally at the thermal mass, the multistage TEC can readily reach lower temperatures than that by a steady-state operation. The multistage TEC consists of four different sizes of thermoelectric modules and they are operated with an optimized current. Once the cold-part of the uppermost stage is reached at the no-load temperature, the current is successively supplied to the lower stages with a certain time interval; 25, 50 and 75 seconds. The results show the temperatures that can be ultimately reached at the cold-side of the lowermost stage are 197, 182 and 237 K, respectively. It can be concluded that the timing or total amount of the current fed to each thermoelectric module is the key parameter to determine the no-load temperature.