• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1489-1492
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• 2005

Compared to other nano-patterning techniques, Nano imprint Lithography (NIL) has some advantages of high throughput and low process cost. To imprint low temperature and pressure, UV Nano imprint Lithography, which using the monomer based UV curable resin is suggested. Because fabrication of high fidelity pattern on topographical substrate is difficult, bi-layer Nano imprint lithography, which are consist of easily removable under-layer and imprinted pattern, is being used. If residual layer is not remained after imprinting, and under-layer is removed by oxygen RIE etching, we might be able to fabricate the bi-layer pattern for easy lift-off process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.499-500
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.359-360
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• 2009

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1934-1938
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• 2008

Formation of air bubble is the one of common defects in UV nano imprint lithography. Location of dispensing and volume of droplets are among the most important parameters in the process. ]n this study, UV curable resin droplets with different volumes were dispensed at different locations and pressed to investigate air bubble formation. By varying volume of droplet and dispensing location, process conditions were found for minimum air bubble area.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.7
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• pp.67-73
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• 2020

Shrinkage is inevitable in the curing of resins during the nanoimprint process. The degree of shrinkage that occurs as the resin transforms from a viscous liquid to solid differs depending on the type of resin. However, if the cured material is repeatedly cured using the same material, constant shrinkage can be confirmed. In this study, the pattern of change was observed by repeatedly performing the nanoimprint process using a resin with a constant shrinkage rate. The observed pattern for the change of shape was made using a triangular pyramid-shaped aluminum master mold and a flexible replica mold made from the master. Shrinkage that results from the nanoimprint process occurs linearly in the longitudinal direction of the pattern and can be predicted by simple calculations. The change of the pattern due to shrinkage occurred as expected. If the shrinkage rate remains constant, various patterns can be manufactured with high accuracy by correcting these changes before producing a specific shape. This study confirms that the pattern of the desired angle can be obtained by performing the repeated imprint without having to manufacture a master mold.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.37-41
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• 2018

This paper presents the integrated fluorescent oxygen sensor probe module based on planner lightwave circuits using UV imprint lithography. The oxygen sensor system is consisted of the optical source part, optical detector part and optical sensing probe part to be composed of the planner lightwave circuit and oxygen sensitive thin film layer. Firstly, we optimally designed the planner lightwave circuit with asymmetric $1{\times}2$ beam splitter using beam propagation method. Then, we fabricated the planner lightwave circuits using UV imprint lithography process. This planner lightwave circuits transmitted the optical power with 76% efficiency and the fluorescence signal with 70% efficiency. The oxygen sensitive thin film layer is coated on the end face of planner lightwave circuit. The oxygen sensor system using this sensor probe module with planner lightwave circuit could measure the concentration with 0.3% resolution from 0% to 20% gas range. This optical oxygen sensor probe module make it possible to compact, simple and cheap measurement system.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.633-636
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• 2005

Imprint lithography is a promising method for high-resolution and high-throughput lithography using low-cost equipment. As with other nanoimprint methods, ultraviolet-nanoimprint lithography (UV-NIL) resolution appears to be limited only by template resolution, and offers a significant cost of ownership reduction when compared to other next generation lithography (NGL) methods such as EUVL and 157 nm lithography. The purpose of this paper is to suggest optimum values of control parameters of Imprio 100 manufactured by Molecular Imprint, Inc., which is the first commercially available UV-NIL tool, for sound nanoimprint. UV-NIL experiments were performed on Imprio 100 to find dispensing recipe for avoiding air entrapment. Dispensing recipe related to residual layer thickness and uniformity was optimized and 40 nm thick residual layer was achieved.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.5
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• pp.30-35
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• 2013

In order to increase cell efficiency in crystalline silicon solar cell, reduction of light reflection is one of the essential problem. Until now silicon wafer was textured by wet etching process which has random patterns along crystal orientation. In this study, high aspect ratio patterns are manufactured by nano imprint process and reflectance could be minimized under 1%. After that, screen printed solar cell was fabricated on the textured wafer and I-V characteristics was measured by solar simulator. Consequently cell efficiency of solar cell fabricated using the wafer textured by nano imprint process increased 1.15% than reference solar cell textured by wet etching. Internal quantum efficiency was increased in the range of IR wave length but decreased in the UV wavelength. In spite of improved result, optimization between nano imprinted pattern and solar cell process should be followed.

• Journal of the Korean institute of surface engineering
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• v.49 no.2
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• pp.178-185
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• 2016

In this study, we have fabricated light guide plates (LGPs) in thin film form for edge type back light unit (BLU) by using UV imprint lithography. In the LGPs, the pattern of functional resins on PC and PMMA substrates were successfully transferred from original master mold through PVC stamp. Optimized pattern arrays with slowly-sloped density were designed to obtain high brightness and uniformity. We could obtain a relatively improved brightness of $950cd/m^2$ and a uniformity of 87.3% by using the NP-S20 functional resins at an input power of 1.3 W because NP-S20 resin could show high formability after UV hardening process. The LGP prepared on polymethylmethacrylate (PMMA) substrate exhibited higher brightness than that on polycarbonate (PC) substrate because PMMA has lower refractive index resulting in more refraction toward the vertical direction.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.9 s.240
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• pp.1169-1174
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• 2005

Imprint lithography is a promising method for high-resolution and high-throughput lithography using low-cost equipment. In particular, ultraviolet-nanoimprint lithography (UV-NIL) is applicable to large area imprint easily. We have proposed a new UV-NIL process using an elementwise patterned stamp (EPS), which consists of a number of elements, each of which is separated by channel. Experiments on UV-NIL are performed on an EVG620-NIL using the EPS with 3mm channel width. The replication of uniform sub 70 nm lines using the EPS is demonstrated. We investigate the nonuniformity of residual layer caused by wafer deformation in experiment with varying wafer thickness. Severely deformed wafer works as an obstacle in spreading of dropped resin, which causes nonuniformity of thickness of residual layer. Numerical simulations are conducted to analyze aforementioned phenomenon. Wafer deformation in the process is simulated by using a simplified model, which is a good agreement with experiments.