• Transactions of Materials Processing
• /
• v.17 no.8
• /
• pp.643-648
• /
• 2008

Ultra-thin sheet metal forming techniques are required in precision forming of miniaturized and integrated products. In order to manufacture a good quality and low cost ultra-thin sheet metal products, a highly precise high-speed press is needed. The precision of a press is related with its vibration characteristics during pressing operation. This study evaluated the vibration characteristics of a proposed press design using computer simulation. The analysis compares the static deformation characteristics of the slide and the slide motion for the metal forming of an ultra-thin sheet of thickness less than 0.1mm. Further, in order to minimize the vibrations during high speed pressing operation, revolution balances of the eccentric shaft and the balance weight device is also considered. Finally, modal analysis is used to characterize the natural frequency of vibration of the press.

• Transactions of Materials Processing
• /
• v.19 no.3
• /
• pp.179-184
• /
• 2010

The present study is focused on the deep drawability and product qualities of ultra thin beryllium copper sheet metal. The goal of this research is to investigate the limit drawing ratio in deep drawing of ultra thin beryllium copper metal. For the experiment, beryllium copper(C1720, $50{\mu}m$ in thickness) is used. Tensile test are also carried out to find out the material properties. Deep drawing experiments are carried out in Universal Testing Machine(UTM) to obtain limit drawing ratio. Deep drawing tests are carried out for various specimen sizes. Teflon film is used as a lubricant and constant blank holding force is imposed. Sheet thickness and surface hardness are measured along radial direction after deep drawing. Thickness is measured using optical microscope. For beryllium copper(C1720), the maximum LDR of 2.4 is obtained when the die shoulder radius is 20 or 30 times of sheet thickness.

• Transactions of Materials Processing
• /
• v.29 no.6
• /
• pp.323-330
• /
• 2020

The surface region of a sheet metal may have different characteristics from the inner region because the surface region is less restricted than the interior. In addition, the grains on the free surface are less hardened because of surface adsorption of the dislocations, rather than piling up. In the case of bulk or thick sheet metals, this effect is negligible because the fraction of the surface region is much smaller than that of the inner region. However, this surface effect is important in the case of ultra-thin sheet metals. In order to evaluate the surface effect, tensile and bending tests were performed for the SS304 stainless steel with a thickness of 0.39 mm. The bending force predicted using the tensile behavior is higher than the measurement because of the surface effect. To account for the surface effect, the surface layer model was developed by dividing the sheet section into surface and inner layers. The mechanical behaviors of the two regions were calibrated using the tensile and bending properties. The surface layer model reproduced the bending behavior of the ultra-thin sheet metal.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
• /
• 2001.10a
• /
• pp.253-257
• /
• 2001

This study reveals the sheet metal working with multi-forming type ultra precision process. They require analysis of many kinds of important factors, i.e. theory and practice of metal press working and its phenomena, die structure, machining condition for die making, die material, heat treatment of die components, know-how and so on. In this study, we designed and constructed a multi-forming ultra precision progressive die as a bending and drawing working of multi-stage and performed through the try out for thin sheet metal. This part I of papers related to the analysis of production part and strip process layout design through the metal forming simulation by DEFORM and IDEAS.

• Transactions of Materials Processing
• /
• v.21 no.6
• /
• pp.348-353
• /
• 2012

Micro-drawn parts have received wider acceptance as products become smaller and more precise. The subject of this study was the deformation characteristics of ultra thin sheet metal in micro drawing of a rectangular shaped part. The influence of drawing speed and blank holding force on the product quality was investigated in micro-drawing of ultra thin sheet of beryllium copper (C1720) alloy. The specimen had a diameter of 4.8 mm and a thickness of $50{\mu}m$. Experiments were carried out in which, different blank holding force and drawing speed were considered. The product quality was evaluated by measuring the thickness and hardness along two specified directions, namely, the side and diagonal directions. The distribution of the thickness strain showed severe thinning especially around the punch radius in both directions. In the diagonal direction, thickening occurred in the flange area due to the axi-symmetric drawing mode. The increase of blank holding force and/or drawing speed was found to cause severe thinning around the punch radius. The blank holding force had a greater effect on thinning of the product than the drawing speed.

• Transactions of Materials Processing
• /
• v.26 no.3
• /
• pp.181-186
• /
• 2017

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.13 no.9
• /
• pp.729-734
• /
• 2000

Recently, Very Large Scale Integrated (VLSI) circuit & deep-submicron bulk Complementary Metal Oxide Semiconductor(CMOS) devices require gate electrode materials such as metal-silicide, Titanium-silicide for gate oxides. Many previous authors have researched the improvement sub-micron gate oxide quality. However, few have reported on the electrical quality and reliability on the ultra thin gate oxide. In this paper, at first, I recommand a novel shallow trench isolation structure to suppress the corner metal-oxide semiconductor field-effect transistor(MOSFET) inherent to shallow trench isolation for sub 0.1${\mu}{\textrm}{m}$ gate oxide. Different from using normal LOCOS technology deep-submicron CMOS devices using novel Shallow Trench Isolation(STI) technology have a unique"inverse narrow-channel effects"-when the channel width of the devices is scaled down, their threshold voltage is shrunk instead of increased as for the contribution of the channel edge current to the total channel current as the channel width is reduced. Secondly, Titanium silicide process clarified that fluorine contamination caused by the gate sidewall etching inhibits the silicidation reaction and accelerates agglomeration. To overcome these problems, a novel Two-step Deposited silicide(TDS) process has been developed. The key point of this process is the deposition and subsequent removal of titanium before silicidation. Based on the research, It is found that novel STI structure by the SEM, in addition to thermally stable silicide process was achieved. We also obtained the decrease threshold voltage value of the channel edge. resulting in the better improvement of the narrow channel effect. low sheet resistance and stress, and high threshold voltage. Besides, sheet resistance and stress value, rms(root mean square) by AFM were observed. On the electrical characteristics, low leakage current and trap density at the Si/SiO$_2$were confirmed by the high threshold voltage sub 0.1${\mu}{\textrm}{m}$ gate oxide.

• Korea-Australia Rheology Journal
• /
• v.14 no.2
• /
• pp.71-76
• /
• 2002

Metal thin films, which are indispensable constituents of ULSI (Ultra Large Scale Integration) circuits, have been fabricated by physical or chemical methods. However, these methods have a drawback of using expensive high vacuum instruments. In this work, the fabrication of tungsten metal film by spin coating was investigated. First of all, inorganic peroxopolytungstic acid (W-IPA) powder, which is soluble in water, was prepared by dissolving metal tungsten in hydrogen peroxide and by evaporating residual solvent. Then, the solution of W-IPA was mixed with organic solvent, which was spin-coated on wafers. And then, tungsten metal films, were obtained after reduction procedure. By selecting an appropriate organic solvent and irradiating UV, the sheet resistance of the tungsten metal film could be remarkably reduced.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
• /
• 2001.10a
• /
• pp.287-291
• /
• 2001

In this study, we designed and constructed a multi-forming progressive die with a bending, embossing on the multi-stage and performed through the try out. Out of the characteristics of this paper that nothing might be ever seen before such as this type of research method on the all of processes of thin and high precision production part.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2008.05a
• /
• pp.383-386
• /
• 2008

Magnesium alloy sheets have been extending their field of applications to automotive and electronic industries taking advantage of their excellent light weight property. In addition to their excellent light property, magnesium alloys have several other advantages: high specific strength, good welding capability and corrosion resistance. Taking advantage of these benefits, magnesium alloys have also been substituting the polymeric materials in the electronic devices industries. In sheet metal forming application with magnesium alloys, the lower formability and high springback due to the lower elastic property (Young's modulus=45 GPa) at room temperature are major hurdles by which magnesium alloys have limited applications. In this study, commercial notebook case was adopted as the benchmark model, and then design parameters and process conditions are analyzed by the finite element simulation and physical try-outs.