• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.799-804
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• 1997

This paper is concerned with the heat flux distribution and energy partition for creep-feed grinding. Form measurements of transient grinding temperatures in the workpiece sub-surface using an embeded thermocouple, the overall energy partition to the workpiece was estimated form moving heat source theory for a triangular heat flux distribution as 3.0% for down grinding and 4.5% for up grinding. The higher energy partition for up grinding can be attributed to the need to satisfy thermal compatibility at the grinding zone. The influence of cooling outside the grinding zone can be analytically taken into account by specifying convective heat transfer coefficients on the workpiecs surface h /sab a/ heat source (grinding zone) and h /sab b/ behind the heat source. The smaller energy patition together with slightly lower grinding power favors down grinding over up grinding.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.6
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• pp.42-48
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• 1998

This paper is concerned with the heat flux distribution and energy partition for creep-feed grinding. From measurements of transient grinding temperatures in the workpiece sub-surface using an embedded thermocouple, the overall energy partition to the workpiece was estimated from moving heat source theory for a triangular heat flux distribution as 3.0% for down grinding and 4.5% for up grinding. The higher energy partition for up grinding can be attribute to the need to satisfy thermal compatibility at the grinding zone. The influence of cooling outside the grinding zone can be analytically taken into account by specifying convective heat transfer coefficients on the workpiece surface ha ahead of the heat source (grinding zone) and hb behind the heat source. The smaller energy partition together with slightly lower grinding power favors down grinding over up grinding.

• International Journal of Precision Engineering and Manufacturing
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• v.4 no.3
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• pp.62-67
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• 2003

The grinding force generated during the grinding process causes an elastic deformation of the workpiece, grinding wheel, and machine system. Thus, the true depth of cut is always smaller than the apparent depth of cut. This is known as machining elasticity phenomenon. The machining elasticity parameter is defined as a ratio between the true depth of cut and the apparent depth of cut. It is an important factor to understand the material removal mechanism of the grinding process. To increase productivity, the value of this machining elasticity parameter must be large. Therefore, it is essential to know the characteristics of this parameter. The objective of this research is to study the effect of the major grinding conditions, such as table speed, depth of cut, on this parameter experimentally, Through this research, it is found that this parameter value is increasing when the table speed is decreasing or the depth of cut is increasing. Also, this parameter value depends on the grinding mode (up grinding, down grinding).

• Journal of the Korean Society for Precision Engineering
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• v.15 no.8
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• pp.26-32
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• 1998

The grinding force generated during the grinding process causes an elastic deformation of the workpiece, grinding wheel, and machine system. Thus, the true depth of cut is always smaller than the apparent depth of cut. This is known as machining elasticity phenomenon. The machining elasticity parameter is defined as a ratio between the true depth of cut and the apparent depth of cut. It is an important factor to understand the material removal mechanism of the grinding process. To increase productivity, the value of this machining elasticity parameter must be large. Therefore, it is essential to know the characteristics of this parameter. The objective of this research is to study the effect of the major grinding conditions, such as table speed and depth of cut, on this parameter experimentally. Through this research, it is found that this parameter value is increasing when the table speed is decreasing or the depth of cut is increasing. Also, this parameter value depends on the grinding mode (up grinding, down grinding).

• Journal of the Korean Society of Safety
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• v.7 no.4
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• pp.13-21
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• 1992

The purpose of this reserch is to suggest grinding temperature for high effect grinding and to clarify the sufficient grinding heat by experiment and theory(developed finite element program). Main results to be obtained are as follows : 1) The grinding temperature distribution by F. E. M is comparatively in good apreement with the experimental results. 2) The up cut grinding method of grinding methods is decreased burning effect. 3) Regardless of the table speed on the temperature distribution in grinding surface layer, cooling effect is about 6-8times when developed nozzle is used.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.2
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• pp.171-176
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• 2001

This study focuses on the energy partition and heat flux distribution in creep-feed grinding. From the measurements of transient grinding temperature in the workpiece which the thermocouple was embedded, the overall energy partition to the workpiece was estimated with moving heat source theory using the developed scalene triangle heat model. The energy partition was calculated as 3.75% in down grinding smaller than 5.3% in up grinding. Also, the scalene triangle heat model was confirmed as the most optional heat model in correspond to the experimental data. Then, the heat flux distribution was calculated from temperature responses. The heat flux is negative behind the grinding zone where fluid was applied. In this experimental result, the total heat flow to the workpiece per unit width obtained by integrating the positive heat flux was 0,7W/mm for down grinding.

• Journal of the Korean Society for Precision Engineering
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• v.7 no.4
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• pp.65-72
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• 1990

After observing grinding characteristics according to variable grinding condition in order to raise the grinding effect without making worse the grinding quality by using general grinding machine, main conclusions of this study are as follows; 1) When grinding quality is constant, grinding effect is changed according to the speed of the workpiece. But the rapidly increasing critical speed of table is($V_w{\leq}4m/min$). 2) As grinding effect is equal, the lower the speed of the workpiece becomes, the lower the grinding force and surface roughness obtains good results. 3) In terms of grinding method, the down cut grinding method produces good grinding surface royghness in case of little grinding depth;otherwise, the up cut method in case of more grinding depth.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.5 no.1
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• pp.33-38
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• 2006

Silicon has been widely used in electronic parts as a semiconductor equipment. It, however, requires much effort to grind without microcrack and chipping because of its high hardness and brittleness. So far, many studies for the grinding of engineering ceramics have been done, but not for the grinding of silicon. In this paper, a theoretical analysis on the grinding forces is introduced. Grinding experiments were performed at various grinding conditions including grinding directions (Up grinding and Down grinding), table speeds and depth of cuts. The grinding forces were measured to compare at various grinding conditions. The experimental values agree well with theoretical ones.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.5
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• pp.165-171
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• 2000

To get smoother ground surface, it is required to replace the grinding wheel with a finer-grit wheel. When the operator replaces the grinding wheel, the balancing and dressing of the wheel surface are necessary. So this replacement has a lot of problems like inconvenience to operators, delays in the operation time, and ineffectiveness in the production process. Therefore, a laminated grinding wheel, which consists of three layers, is provided. The side layers are coarse grits and the middle layer is made up of fine grits. To show the effectiveness of the laminated grinding wheel, experiments on the surface roughness and the material removal rate were performed respectively. As a result, it was found that the grinding process using a laminated grinding wheel can generate smoother ground surface in shorter time.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.9
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• pp.59-65
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• 2002

Grinding temperature between a grinding wheel and a workpiece surface, rising rapidly during a machining operation, has bad effects on a surface integrity such as the burning, the residual stress and the crack. In this study, the temperature distribution was obtained briefly by the finite element method and the grinding temperature of a workpiece varying with the grinding condition was measured experimentally. For obtaining the grinding temperature, a thermocouple method was applied. Three thermocouples were inserted in a surface of each workpiece. Changed grinding conditions were the depth of cuts, the feedrate, the dry and wet grinding, the up and down grinding and the number of pieces.