• Title/Summary/Keyword: Viscoelastic Layer

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Analysis of Crack Induced in Polymeric Layer (고분자 층에서 발생하는 균열 해석)

  • Lee Sang Sun
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.11a
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    • pp.247-250
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    • 2003
  • In this paper, the boundary element analysis of viscoelastic strain energy release ,ate G(t) for the cracked linear viscoelastic materials is attempted. This study proposes the G(t) equation and the calculating method of G(t) by time-domain boundary element analysis for the viscoelastic solids. The G(t) is defined as the derivative of the viscoelastic potential energy $\Pi(t)$ with respect to crack length a. Two example problems are presented to show the applicability of the proposed method to the analysis of the cracked linear viscoelastic solids. Numerical results of example problems show the accuracy and effectiveness of the proposed method.

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Nonlinear vibration of SSMFG cylindrical shells with internal resonances resting on the nonlinear viscoelastic foundation

  • Kamran, Foroutan;Habib, Ahmadi
    • Structural Engineering and Mechanics
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    • v.84 no.6
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    • pp.767-782
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    • 2022
  • In this paper, the nonlinear vibration behavior of the spiral stiffened multilayer functionally graded (SSMFG) cylindrical shells exposed to the thermal environment and a uniformly distributed harmonic loading using a semi-analytical method is investigated. The cylindrical shell is surrounded by a nonlinear viscoelastic foundation consisting of a two-parameter Winkler-Pasternak foundation augmented by a Kelvin-Voigt viscoelastic model with a nonlinear cubic stiffness. The distribution of temperature and material constitutive of the stiffeners are continuously changed through the thickness direction. The cylindrical shell has three layers consisting of metal, FGM, and ceramic. The interior layer of the cylindrical shell is rich in metal, while the exterior layer is rich in ceramic, and the FG material is located between two layers. The nonlinear vibration problem utilizing the smeared stiffeners technique, the von Kármán equations, and the Galerkin method has been solved. The multiple scales method is utilized to examine the nonlinear vibration behavior of SSMFG cylindrical shells. The considered resonant case is 1:3:9 internal resonance and subharmonic resonance of order 1/3. The influences of different material and geometrical parameters on the vibration behavior of SSMFG cylindrical shells are examined. The results show that the angles of stiffeners, temperature, and elastic foundation parameters have a strong effect on the vibration behaviors of the SSMFG cylindrical shells.

Numerical Analysis of Pressure and Temperature Effects on Residual Layer Formation in Thermal Nanoimprint Lithography

  • Lee, Ki Yeon;Kim, Kug Weon
    • Journal of the Semiconductor & Display Technology
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    • v.12 no.2
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    • pp.93-98
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    • 2013
  • Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. To successfully imprint a nanosized pattern with the thermal NIL, the process conditions such as temperature and pressure should be appropriately selected. This starts with a clear understanding of polymer material behavior during the thermal NIL process. In this paper, a filling process of the polymer resist into nanometer scale cavities during the thermal NIL at the temperature range, where the polymer resist shows the viscoelastic behaviors with consideration of stress relaxation effect of the polymer. In the simulation, the filling process and the residual layer formation are numerically investigated. And the effects of pressure and temperature on NIL process, specially the residual layer formation are discussed.

Cyclic testing of a new visco-plastic damper subjected to harmonic and quasi-static loading

  • Modhej, Ahmad;Zahrai, Seyed Mehdi
    • Structural Engineering and Mechanics
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    • v.81 no.3
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    • pp.317-333
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    • 2022
  • Visco-Plastic Damper (VPD) as a passive energy dissipation device with dual behavior has been recently numerically studied. It consists of two bent steel plates and segments with a viscoelastic solid material in between, combining and improving characteristics of both displacement-dependent and velocity-dependent devices. In order to trust the performance of VPD, for the 1st time this paper experimentally investigates prototype damper behavior under a wide range of frequency and amplitude of dynamic loading. A high-axial damping rubber is innovatively proposed as the viscoelastic layer designed to withstand large axial strains and dissipate energy accordingly. Test results confirmed all assumptions about VPD. The behavior of VPD subjected to low levels of excitation is elastic while with increasing levels of excitation, a significant source of energy dissipation is provided through the yielding of the steel elements in addition to the viscoelastic energy dissipation. The results showed energy dissipation of 99.35 kN.m under a dynamic displacement with 14.095 mm amplitude and 0.333 Hz frequency. Lateral displacement at the middle of the device was created with an amplification factor obtained ranging from 2.108 to 3.242 in the rubber block. Therefore, the energy dissipation of viscoelastic material of VPD was calculated 18.6 times that of the ordinary viscoelastic damper.

Viscoelastic Analysis for Behavior of Edge Cracks at the Bonding Interface of Semiconductor Chip (반도체 칩 접착 계면에 존재하는 모서리 균열 거동에 대한 점탄성 해석)

  • 이상순
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.14 no.3
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    • pp.309-315
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    • 2001
  • The Stress intensity factors for edge cracks located at the bonding interface between the elastic semiconductor chip and the viscoelastic adhesive layer have been investigated. Such cracks might be generated due to stress singularity in the vicinity of the free surface. The domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The overall stress intensity factor for the case of a small interfacial edge crack has been computed. The magnitude of stress intensity factors decrease with time due to viscoelastic relaxation.

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Dynamic impedance of a floating pile embedded in poro-visco-elastic soils subjected to vertical harmonic loads

  • Cui, Chunyi;Zhang, Shiping;Chapman, David;Meng, Kun
    • Geomechanics and Engineering
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    • v.15 no.2
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    • pp.793-803
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    • 2018
  • Based on the theory of porous media, an interaction system of a floating pile and a saturated soil in cylindrical coordinates subjected to vertical harmonic load is presented in this paper. The surrounding soil is separated into two distinct layers. The upper soil layer above the level of pile base is described as a saturated viscoelastic medium and the lower soil layer is idealized as equivalent spring-dashpot elements with complex stiffness. Considering the cylindrically symmetry and the pile-soil compatibility condition of the interaction system, a frequency-domain analytical solution for dynamic impedance of the floating pile embedded in saturated viscoelastic soil is also derived, and reduced to verify it with existing solutions. An extensive parametric analysis has been conducted to reveal the effects of the impedance of the lower soil base, the interaction coefficient and the damping coefficient of the saturated viscoelastic soil layer on the vertical vibration of the pile-soil interaction system. It is shown that the vertical dynamic impedance of the floating pile significantly depends on the real stiffness of the impedance of the lower soil base, but is less sensitive to its dynamic damping variation; the behavior of the pile in poro-visco-elastic soils is totally different with that in single-phase elastic soils due to the existence of pore liquid; the effect of the interaction coefficient of solid and liquid on the pile-soil system is limited.

Analysis of Residual Stresses Induced during Adhesion Process of Chip and Leadframe (칩과 리드페임의 접착과정에서 발생하는 잔류 응력 해석)

  • 이상순
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.13 no.1
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    • pp.97-103
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    • 2000
  • This paper deals with residual stresses induced at the viscoelastic adhesive layer between the semiconductor chip and the leadframe during adhesion process. The adhesive layer has been assumed to be“thermorheologically simple”. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. Numerical results show that very large stress gradients are present at the interface corner and such singularity might lead to local yielding or edge delamination.

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Nonlinear damping and forced vibration analysis of laminated composite plates with composite viscoelastic core layer

  • Youzera, Hadj;Ali, Abbache;Meftah, Sid Ahmed;Tounsi, Abdelouahed;Hussain, Muzamal
    • Steel and Composite Structures
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    • v.44 no.1
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    • pp.91-104
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    • 2022
  • The purpose of the present work is to study the parametric nonlinear vibration behavior of three layered symmetric laminated plate. In the analytical formulation; both normal and shear deformations are considered in the core layer by means of the refined higher-order zig-zag theory. Harmonic balance method in conjunction with Galerkin procedure is adopted for simply supported laminate plate, to obtain its natural and damping properties. For these aims, a set of complex amplitude equations governed by complex parameters are written accounting for the geometric nonlinearity and viscoelastic damping factor. The frequency response curves are presented and discussed by varying the material and geometric properties of the core layer.

Optimum Design of Viscoelastic Layered Beam to Minimize Flexural Vibration (굽힘진동 감쇠를 위한 점탄성 적층보의 최적 설계)

  • Sa-Soo Kim;Dae-Seung Cho;Min-Woo Lee
    • Journal of the Society of Naval Architects of Korea
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    • v.36 no.1
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    • pp.90-98
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    • 1999
  • For the control of vibration and noise of metal structures having relatively low damping, viscoelastic materials are widely used and usually attached at metal structures with an additional constraining layer to secure them. The damping and elastic properties of structures having constrained viscoelastic material layers are dependent on not only temperature and frequency but also their thicknesses. Hence, optimal design of the thicknesses of viscoelastic and constraining layers for a certain base structure are very important to maximize their efficiency and to lighten their weight. In this study, the variation of loss factor of beams having a constrained viscoelastic layer according to the change of thickness has been carefully investigated. From these, optimal design method of the minimum thickness beam having a given loss factor is suggested and numerically verified for a real beam.

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Harmonic seismic waves response of 3D rigid surface foundation on layer soil

  • Messioud, Salah;Sbartai, Badredine;Dias, Daniel
    • Earthquakes and Structures
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    • v.16 no.1
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    • pp.109-118
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    • 2019
  • This study, analyses the seismic response for a rigid massless square foundation resting on a viscoelastic soil layer limited by rigid bedrock. The foundation is subjected either to externally applied forces or to obliquely incident seismic body or surface harmonic seismic waves P, SV and SH. A 3-D frequency domain BEM formulation in conjunction with the thin layer method (TLM) is adapted here for the solution of elastodynamic problems and used for obtained the seismic response. The mathematical approach is based on the method of integral equations in the frequency domain using the formalism of Green's functions (Kausel and Peck 1982) for layered soil, the impedance functions are calculated by the compatibility condition. In this study, The key step is the characterization of the soil-foundation interaction with the input motion matrix. For each frequency the impedance matrix connects the applied forces to the resulting displacement, and the input motion matrix connects the displacement vector of the foundation to amplitudes of the free field motion. This approach has been applied to analyze the effect of soil-structure interaction on the seismic response of the foundation resting on a viscoelastic soil layer limited by rigid bedrock.