Warpage Analysis for Top and Bottom Packages of Package-on-Package Processed with Thin Substrates (박형 기판을 사용한 Package-on-Package용 상부 패키지와 하부 패키지의 Warpage 분석)
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- Journal of the Microelectronics and Packaging Society
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- v.22 no.2
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- pp.61-68
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- 2015