• Transactions of Materials Processing
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• v.21 no.1
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• pp.30-35
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• 2012

FIM(Film Insert Molding) is an innovative method of producing decorated parts for a wide range of products. Because it requires fewer steps when compared to conventional production methods, the time and cost of manufacturing high quality components can be reduced considerably. In this paper, the effects of processing conditions on the warpage of film-insert molded plate were investigated by using a design of experiments. The dominant factors affecting warpage were mold temperature and holding pressure. Warpage increased with the temperature difference between stationary mold and fixed one. Even when the mold temperature difference was zero, the plate with a film was bent after ejection such that the film side protruded. As holding pressure increased, warpage decreased significantly. In addition warpage increased with time increment for the film-insert molded plates.

• Smart Structures and Systems
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• v.29 no.6
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• pp.767-775
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• 2022

Metal additive manufacturing (AM), also known as metal three-dimensional (3D) printing, produces 3D metal products by repeatedly adding and solidifying metal materials layer by layer. During the metal AM process, products experience repeated local melting and cooling using a laser or electron beam, resulting in product defects, such as warpage, cracks, and internal pores. Such defects adversely affect the final product. This paper proposes the in situ monitoring-based warpage prediction of metal AM products with experimental feature extraction. The temperature profile of the metal AM substrate during the process was experimentally collected. Time-domain features were extracted from the temperature profile, and their relationships to the warpage mechanism were investigated. The standard deviation showed a significant linear correlation with warpage. The findings from this study are expected to contribute to optimizing process parameters for metal AM warpage reduction.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.1-9
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• 2016

The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.57-62
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• 2012

In this paper, numerical analysis by finite element method, parameter design by the Taguchi method and ANOVA method were used to analyze about effect of design deviations and thickness variations on warpage of FCCSP substrate. Based on the computed results, it was known that core material in substrate was the most determining deviation for reducing warpage. Solder resist, prepreg and circuit layer were insignificant effect on warpage relatively. But these results meant not thickness effect was little importance but mechanical properties of core material were very effective. Warpage decreased as Solder resist and circuit layer thickness decreased but effect of prepreg thickness was conversely. Also, these results showed substrate warpage would be increased to maximum 40% as thickness deviation combination. It meant warpage was affected by thickness tolerance under manufacturing process even if it were met quality requirements. Threfore, it was strongly recommended that substrate thickness deviation should be optimized and controlled precisely to reduce warpage in manufacturing process.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.41-45
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• 2018

We have simulated the process induced warpage for panel level package using finite element method. Silicon chips of $5{\times}5mm^2$ were redistributed on $122.4{\times}93.6mm^2$ size panel and the total number of redistributed chips was 221. The warpage at each process step, for example, (1) EMC molding, (2) attachment of detach core, (3) heating, (4) removal of a carrier, and (5) cooling was simulated using ANSYS and the effects of detach core and carrier materials on the warpage were investigated. The warpage behaved complexly depending on the materials for the detach core and carrier. However, glass carrier showed the lower warpage than FR4 carrier regardless of detach core material, and the minimum warpage was observed when the glass was used for the detach core and carrier at the same time.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.8 s.179
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• pp.1968-1799
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• 2000

A warpage analysis program has been developed for fiber-reinforced injection molded parts. The warpage is predicted from the residual stress and anisotropic thermo-mechanical properties coupled with fiber orientation in the integrated injection molding simulation. A simple elastic model is used for the calculation of thermally and pressure-induced residual stresses which are employed as the initial conditions in the structural analysis. To improve the reliability of warpage analysis, a new triangular flat shell element superimposing well-known efficient plate bending and membrane element is presented. The numerical examples address the necessity to use anisotropic models for fiber-reinforced materials and show that predicted warpage is in good agreement with experimentally measured one.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.745-750
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• 2000

A warpage analysis program has been developed for fiber-reinforced injection molded parts. The warpage is Predicted from the residual stress and anisotropic thermo-mechanical properties coupled with fiber orientation in the integrated injection molding simulation. A simple elastic model is used for the calculation of thermally and pressure-induced residual stresses which are employed as the initial conditions in the structural analysis. To improve the reliability of warpage analysis, a new triangular flat shell element superimposing well-known efficient plate bending and membrane element is presented. The numerical examples address the neccesity to use anisotropic models for fiber-reinforced materials and show that predicted warpage is in good agreement with experimentally measured one.

• Design & Manufacturing
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• v.16 no.1
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• pp.62-69
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• 2022

In the present study, the injection molding optimization of a large thick LH type elastic frames for the reduction of warpage was performed. Two kinds of fine and coarse finite element models were prepared to investigate the efficiency of analysis time and quality on simulation results. In order to derive injection molding conditions that can minimize distortion of parts, it was investigated that the effects of mold temperature, resin temperature, injection time, hold pressure switching time, holding pressure and the hold time on deformation characteristics using the design of experiments. The main influential factors on the warpage were found from the optimization simulation and the geometry data of the warpage result was converted into an initial model for injection simulation. It was shown that a coarse model with good mesh quality could be adapted for mold design since the total analysis time using the proposed model was reduced to 1/10. The suggested inversed warpage model produced the best minimized result of warpage.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.439-440
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• 2010