• Proceedings of the KSME Conference
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• 2000.04a
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• pp.741-744
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• 2000

In general there occur warpage in one way long part. Warpage is caused by differential shrinkage-Orientation Effect, Volumetric Shrinkage Effect, Differential Cooling Effect -over the part. Deco-Top is located at the top of 29"TV set and it's shape is one way long$(626{\times}130mm)$. Material is used transparency ABS resin. So we can't design ribs in this part. And we use film gate to avoid weld line. In these reasons we must develop no ribs and no warpage product. In this study we use MOLDFLOW's software-MF/FLOW, MF/COOL, MF/WARP. Using MF/FLOW, set the flow balance and gate positioning. And we can set cooling channel layout and the optimum processing condition through MF/COOL and MF/WARP. In result we reduced trials and obtained good product.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.983-988
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• 2004

In the present study, the effects of orthogonal ribs on structural warpage during injection molding process were investigated. Basic ribbed models for the evaluation of degree of warpage were introduced and designed. Injection molds for these models are manufactured based on the full 3D CAD/CAM technology and specimens are prepared for experiment. Numerical analysis using commercial plastic injection molding analysis software was also performed to compare the results with experimental ones. The variations of materials and parameters such as injection time, mold temperature, melt temperature, holding time were considered in the present work. It was shown that orthogonal ribs have significant effect on the reduction of warpage during the injection molding process.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.3
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• pp.90-97
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• 2009

In the study, a design methodology for robust minimization of a warpage in injection-molded part is presented. Taguchi's parameter design method is integrated with a computer simulation tool for injection molding to search for best design with robustness against the process variability by noises. The proposed methodology is based on a two-stage process: (1) reducing a warpage in the part by optimizing the part geometry including the layout and size of ribs, and (2) additionally minimizing the warpage by optimizing process conditions. An example is used to illustrate the usefulness of the design methodology.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.141-146
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• 2005

In the present study, the characteristic of warpage and flow balance for family mould, which is able to mold parts with different shapes in a mold, is considered. To obtain an optimal gate and runner system, plastic injection molding analysis with commercial code is performed. Design and manufacturing of family mould is then carried out on the basis of this computer aided engineering result. Flow balance and warpage comparisons between experiment and numerical analysis give good agreement with each other. However, it was shown that results of warpage measured by CMM was about $20\~55\%$ lower than those of numerical analysis.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.3
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• pp.241-246
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• 2012

A layered planer SOFC module was designed from planar-type SOFC. It was prepared by multi-layered ceramic technology. To form the cathode and the anode in the layered structure, reliable channels should be made on the both side of electrolyte perpendicularly. However, monolithic SOFC using multi-layered ceramic technology hasn't been studied another group, and the warpage of electrolyte in the channel, also, hasn't been studied, when electrode is printed on the electrolyte. In this study, the channels are prepared with electrode printing, and their warpage are evaluated. In the case of YSZ without electrode, the warpages are nothing in the limit of measurement using optical microscope. The warpage of 'YSZ-NiO printed' increases than that of 'NiO printed', and also, the case of 'double electrode printed' is similar to 'YSZ-NiO printed'. It is thought that, in the printed electrolyte, the warpage is related to the difference of the sintering behavior of each material.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.4
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• pp.1171-1177
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• 2010

This paper presents a robust design procedure for minimizing warpage in plastic injection-molded products, where the Pick-the-Winner rule based on Taguchi's Orthogonal Array experiments and the Design Space Reduction Method are integrated for optimization. Two-step optimization approach is applied to reduce warpage in the part design stage and additionally to minimize the warpage in the process conditions design stage. Taguchi's S/N ratio is introduced as a design metric to evaluate robustness against process variations. The effectiveness of proposed optimization process is shown with an example of warpage minimization problem.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.12
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• pp.781-786
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• 2015

It is necessary for ferrite sheets to be fabricated with high packing density for excellent electrical properties and high strength. In this study, the relationship between the warpage and the packing density of ferrite green sheet, was investigated with amount variation of organic additives. With 0.4 wt% of dispersant, the packing density was about 48% and warpage appeared 0.5~1.3 mm high. With 1.4 wt% of dispersant, the packing density increased up to 57% and warpage appeared 0.8~2.1 mm high. With high packing density, warpage appeared along the edges of specimen, while with low packing density, deformation appeared over whole specimen inhomogeneously. It is thought that inhomogeneous deformation after sintering came from the inhomogeneity in green sheet prepared with badly dispersed slurry. With good homogeneity in green sheet from well-dispersed slurry, isotropic shrinkage is thought to have occurred along the distance from center to edges of specimen during sintering.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.12
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• pp.36-43
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• 2021

In this study, the optimal feed system and process conditions that can simultaneously minimize each warpage occurring in the two shape features of the 2P Header HSG, a connector part for automobiles, were determined through injection molding simulation analysis. First, we defined each warping deformation of the two features geometrically and quantified them approximately using the injection molding simulation data. For design optimization, a full factorial experiment was conducted considering the feed system, resin temperature, and packing pressure as design variables, and a follow-up experiment was conducted based on the analysis of the average warpage. In this study, an optimal design was generated considering both the warpage result and resin-saving effect. In the optimal design, the warpages of the two shape features were predicted to be 0.18 and 0.29 mm, and these warpages were found to meet the allowable limit of warpage, which is 0.3 mm, for part assembly.

• Elastomers and Composites
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• v.44 no.4
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• pp.373-377
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• 2009

Most of the plastics products are being manufactured by injection molding. Warpage in injection molded affects the product dimension and it causes assembling problem. In this study, warpages in the injection molded part been studied. Specimens are rectangular flat shapes with and without ribs. Amorphous polymers (PC and ABS) and crystalline polymers (PP and PA66) were used for material. Flat shape with ribs showed higher warpage than flat shape without ribs by 6 to 9%. The specimens with ribs that are located parallel to the flow direction has higher warpage than specimens with ribs that are located perpendicular to the flow direction by 25 to 39%. Crystalline polymers have higher warpage than amorphous polymers by 23 to 67%. Warpage decreases as packing time increases and it increases as injection temperature increases.

• Journal of the Semiconductor & Display Technology
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• v.20 no.1
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• pp.32-36
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• 2021

The number of processes in the manufacture of semiconductors, displays and solar cells is increasing. And as the processes is performed, multiple layers of films and various patterns are formed on the wafer. At this time, substrate warpage occurs due to the difference in stress between each film and pattern formed on the wafer. the substrate warping phenomenon occurs due to the difference in stress between each film and pattern formed on the wafer. We developed a new warpage measurement method to measure wafer warpage during real-time processing. We performed an experiment to measure the presence and degree of warpage of the substrate in real time during the process by adding only measurement equipment for applying additional electrical signals to the existing ESC and detecting the change of the additional electric signal. The additional electrical measurement signal applied at this time is very small compared to the direct current (DC) power applied to the electrostatic chuck whit a frequency that is not generally used in the process can be selectively used. It was confirmed that the measurement of substrate warpage can be easily separated from other power sources without affecting.