• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2426-2431
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• 2007

The microchannel waterblock has a good capability in the cooling of electronic devices. The object of this paper is to estiblish the scheme of design for the microchannel waterblock. The effects of flow rate and channel size on the cooling performances are investigated. It was found that the optimum flow rates were ragned from 0.7 lpm to 1.4 lpm. The thermal resistance at 2.0 lpm and 100 W was 0.13 $^{\circ}C$/W. Decrease in the width of channels is more effective for the improvement in the cooling performances of microchannel waterblock than increase in the height of channels. The increase of pressure drop resulted from decrease in the width of channels can be decreased by increasing the hight of channels.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.264-269
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• 2007

The microchannel waterblock has a good capability in the cooling of electronic devices. The object of this paper is to study on thermal performance of microchannel water block for cooling of CPU in desktop. The effects of header shape, liquid flow rate, and inlet temperature on the thermal performances of microchannel waterblock are investigated experimentally. Three types of waterblock with different header shape are manufactured from the micro milling and brazing processing. The experiments are conducted using water, over a liquid flow rate ranging from 0.7 to 2.0 LPM and inlet temperature ranging from 20 to $35^{\circ}C$. Waterblocks are attached both horizontally and vertically on the test section to anticipate a performance of waterblock under the actual state in computer. The base temperature and thermal resistance decrease with increasing of liquid flow rate. It was found that the sample #1 was appropriate for the prototype of liquid cooling system.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.25 no.6
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• pp.331-337
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• 2013

An experimental study on the performance of a liquid electric component cooling system was performed. The thermal resistance and pressure drop at a heat sink were measured, for aluminum waterblocks with four different internal shapes, with either smooth surface, porous media filling, or with fins of 5 mm height, or of 7 mm height. The fins had 0.5 mm thickness, and the gap between the fins was 0.5 mm. The waterblock internal dimension was $36.5{\times}36.5{\times}7mm$. Compared with the waterblock with smooth surface, the thermal resistance reduction was 11%, 46%, and 42% for waterblocks with porous media filling, 5 mm, and 7 mm fins, respectively. A new dimensionless parameter was suggested to evaluate the waterblock performance, with the simultaneous consideration of thermal resistance and pressure drop. The performance of the waterblock with fins of 5 mm height was best by parameter.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2432-2437
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• 2007

The demand of high speed and miniaturization of electronic devices results in increased power dissipation requirement for thermal management. In this work, the effects of microchannel width, height and liquid flowrate on the cooling performances of microchannel waterblock are investigated experimentally. The microchannel waterblock considered ranged in width from 0.5 to 0.9 mm, with the channel height being nominally 1.7 to 9 times the width in each case. The experiments were conducted using water, over a liquid flow rate ranging from 0.2 to 2.0 lpm. The base temperature, thermal resistance and pressure drop increase with increasing of liquid flow rate. The measured thermal resistances ranged from 0.10 to 0.23 $^{\circ}C$/W for the channel 5.

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.1135-1140
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• 2009

The present study has been studied on a thermal and flow characteristic of the microchannel waterblock with pass variations in 8 samples. Results of a numerical analysis using the CFX-11 were compared with results of an experiment. Numerical analysis and experiment were conducted under an input power of 150 W, inlet temperature of $35^{\circ}C$ and mass flow rates of $0.7{\sim}2.0\;kg/min$. The numerical results showed reasonably good agreement with the experimental results within about $3{\sim}5%$. Also, the numerical results showed that the sample 2 types with the 2 pass gave better performance than the sample 1 types with the 1 pass from the viewpoints of heat transfer and pressure drop.

• Proceedings of the SAREK Conference
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• 2008.11a
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• pp.269-274
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• 2008

The present study has been studied on a thermal and flow characteristic of the microchannel waterblock with flow distributions in each channels. Results of a numerical analysis using the CFX-11 are compared with results of an experiment. Numerical analysis and experiment are conducted under a heat transfer rate of 150W, inlet temperature of $20^{\circ}C$ and mass flow rates of $0.7{\sim}2.0\;kg$/min. Base temperature and pressure drop are investigated with standard deviations of mass flow rates in each channels of samples at 0.7 kg/min.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.21 no.7
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• pp.386-393
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• 2009

The present study has been studied on a thermal and flow characteristic of the microchannel waterblock with flow distributions in each channels. Results of a numerical analysis using the CFX-11 are compared with results of an experiment. Numerical analysis and experiment are conducted under an input power of 150 W, inlet temperature of $20^{\circ}C$ and mass flow rates of $0.7{\sim}2.0$ kg/min. Base temperature and pressure drop are investigated with standard deviations of mass flow rates in each channels of samples. The flow distribution and j/f factor of the sample 4 is increased by about 65.7% and 42.6%, compared to that of the reference model sample 3.

• Proceedings of the SAREK Conference
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• 2007.06a
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• pp.220-220
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• 2007