• Journal of Welding and Joining
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• v.16 no.5
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• pp.67-75
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• 1998

This study aimed at he experimental and finite element analytic investigation of the effect of preheating on he residual stress of weldment. In this study, an autogenous arc welding was used on type 304 stainless steel and MARC as F.E.M. common code was utilized in analysis The analyses include transient and moving heat source and thermal properties as function of temperature. During welding, the thermal cycles of four locations in the weldment were recorded to investigate of the behavior of thermal stress and residual stress. The experimental and analytic results had good coincidence and show that there are two factors influencing the formation of welding residual stress in preheat process. One is the elevation of welding equilibrium temperature and the other is the increase of amount of heat input. The former decrease welding residual stress and the latter increase welding residual stress. Therefore, the cumulative effects result in the welding residual stress not being improved significantly with preheating in 304 stainless steel.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.1-6
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• 2013

In carrying out the elastic-plastic analysis, four conditions (equilibrium equation, constitutive equation, condition of compatibility and yield condition) should be satisfied. In welding, the temperature largely changed from a melting temperature to a room temperature. So, yield stress of materials largely changed, too. In particular, yield stress becomes about zero over $700^{\circ}C$. The analysis should be carried out under the condition that equivalent stress generated in temperature increment ${\Delta}T$ did not exceed yield stress of materials at high temperature over $700^{\circ}C$. It should be sufficiently recognized that the obtained results were not reliable if this condition was not satisfied.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.757-762
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• 2002

Many reports have been shown that the buoyancy, electromagnetic force, surface tension, and gas shear stress are the driving forces of weld pool circulation in arc welding. Among them, the surface tension of molten metal plays an important role in the flow in weld pool, which are clarified by the specially designed experiments with small particles as well as the numerical simulations. The surface tension is also related to the penetration in arc welding. Therefore, a quantitative evaluation of surface tension is demanded for the development of materials and arc process control. However, there are few available data published on the surface tension of molten metals, since it depends on the temperature and the composition of materials. In this study, a new method was proposed for the evaluation of surface tension and its temperature dependence, in which it is evaluated by the equilibrium condition of acting forces under a given surface geometry, especially back surface. When this method was applied to the water pool and to the back surface of molten pool in the stationary gas tungsten arc welding of thin plate, following results were obtained. In the evaluation of surface tension of water, it was shown that the back surface geometry was very sensitive to the evaluation of surface tension and the evaluated value coincided with the surface tension of water. In the measurement of molten pool in the stationary gas tungsten arc welding, it was also shown that the comparison between the surface tension and temperature distribution across the back surface gave the temperature dependent surface tension. Applying this method to the mild steel and stainless steel plates, the surface tension with negative gradient for temperature is obtained. The evaluated values are well matched with ones in the published papers.

• Journal of Welding and Joining
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• v.16 no.2
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• pp.93-99
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• 1998

The effects of welding conditions of gas metal arc welding on the elements loss of solid wire, oxygen content and impact toughness of weld metals were studied. Deoxidizing elements loss was increased with increase of arc voltage in both short-circuit transfer mode and globular transfer mode. It is believed that increase of arc voltage results in increase of reaction time between elements in the droplet and surrounding gas at the end of wire and in the arc column. Based on the thermodynamic equilibrium model, the oxygen content of weld metal can be predicted with the content of silicon and manganese as following : [%O] = $K([%Si][%Mn])^{-0.25}$, K = -15518/T+6.01. The equilibrium temperature was dependent on shielding gas, and it was 187$0^{\circ}C$ for $CO_2$ gas and 180$0^{\circ}C$ for 20%$CO_2$-80%Ar gas. The oxygen content of weld metal which shows maximum impact toughness was varied with deoxidizing alloy system of wires, 0.041 wt% for Si-Mn type wire and 0.026 wt% for Si-Mn-Ti type wire.

• Journal of Welding and Joining
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• v.4 no.3
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• pp.50-57
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• 1986

In this study, the experiments were earried out for the purpose of the clarifying the optimum metal arc spraying conditions, such as spraying distance, wire feed speed, arc current, etc, by using the stainless steel wire ER 308L. Main results obtained are as follows: 1. Optimum spraying distance is closely related to the equilibrium temperature of base material in back surface. 2. The size fused metal particles is increased according to the temperature of fused metal. 3. The maximum adhesion strength of coatings is obtained under the optimum spraying conditions of which the temperature of fundamental is maximum.

• Journal of Welding and Joining
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• v.34 no.6
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• pp.55-61
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• 2016

Recently developed ferritic heat resistance steel, T24 was used to evaluate microstructure characteristics of simulated heat affected zone. Also, correlation between the prior austenite grain size and amount of $M_{23}C_6$ carbide dissolution was discussed. With the increasing of peak temperature, Grain size steadily increased up to $1050^{\circ}C$ and then rapidly increased at $1150^{\circ}C$. Of the peak temperature $950{\sim}1050^{\circ}C$, amounts of $M_{23}C_6$carbide dissolution are low. But Most of $M_{23}C_6$ carbide that is inhibited grain growth were dissolved above $1050^{\circ}C$ and decreased volume fraction of carbide. This indicates that grain growth may be achieved through dissolution of carbide in the base material. As of welding, due to very rapid heating rate, $M_{23}C_6$ carbide exists above equilibrium solution temperature that is $800^{\circ}C$, even at $1050^{\circ}C$. So, It was confirmed that close correlation between carbide dissolution in the base material and grain growth. Calculated grain size has a linear relationship with peak temperature, on the other hand, measured grain size discontinuously increased between $950{\sim}1050^{\circ}C$ and above $1050^{\circ}C$. Grain size of heat affected zone at $1350^{\circ}C$ peak temperature showed maximum 67um and minimum 4um. Also, The number of side showed 3 to 10.

• Journal of Ship and Ocean Technology
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• v.8 no.3
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• pp.50-60
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• 2004

In this paper, a continuum-based design sensitivity analysis (DSA) method is developed for the weakly coupled thermo-elasticity problems. The temperature and displacement fields are described in a common domain. Boundary value problems such as an equilibrium equation and a heat conduction equation in steady state are considered. The direct differentiation method of continuum-based DSA is employed to enhance the efficiency and accuracy of sensitivity computation. We derive design sensitivity expressions with respect to thermal conductivity in heat conduction problem and Young's modulus in equilibrium equation. The sensitivities are evaluated using the finite element method. The obtained analytical sensitivities are compared with the finite differencing to yield very accurate results. Extensive developments of this method are useful and applicable for the optimal design problems incorporating welding and thermal deformation problems.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.393-395
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• 2005

The bonding for Aluminum and Copper in the air is investigated in this study. This bonding method does not include the special process of removing aluminum oxide films. In case of this bending, each metal Is heated at bonding temperature where is above eutectic temperature of Al-Cu system and below melting point of Aluminum. The liquefaction around the bonding surface occurs after the diffusion at solid state of each metal. This phenomenon is predicted by the temperature range above eutectic temperature of Al-Cu equilibrium phase diagram.

• Journal of Welding and Joining
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• v.20 no.4
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• pp.505-509
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• 2002

Pb is considered to be eliminated from solder, due to its toxicity. However, melting temperatures of most Pb-free solders are known higher than that of Sn37Pb. Therefore, there is a difficulty to apply Pb-free solders to electronic industry. Since Sn3Ag8Bi5In has relatively lower melting range as $188~200^{\circ}C$, on this study. Wettability and soldering characteristics of Sn3Ag8Bi5In solder in BGA were investigated to solve for what kind of problem. Zero cross time, wetting time, and equilibrium force of Sn3Ag8Bi5In solder for Cu and plated Cu such as Sn, Ni, and Au/Ni-plated on Cu were estimated. Plated Sn on Cu showed best wettability for zero cross time, wetting time and equilibrium farce. Shear strength of the reflowed joint with Sn3Ag8Bi5In ball in BGA was investigated. Diameter of the ball was 0.5mm, UBM(under bump metallurgy) was $Au(0.5\mu\textrm{m})Ni(5\mu\textrm{m})/Cu(18\mu\textrm{m})$ and flux was RMA type. For the reflow soldering, the peak reflow temperature was changed in the range of $220~250^{\circ}C$, and conveyor speed was 0.6m/min.. The shear strength of Sn3Ag8Bi5In ball showed similar level as those of Sn37Pb. The soldered balls are aged at $110^{\circ}C$ for 36days and their shear strengths were evaluated. The shear strength of Sn3Ag8Bi5In ball was increased from 480gf to 580gf by aging for 5 days.

• Journal of Welding and Joining
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• v.20 no.6
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• pp.59-59
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.