• Journal of the Korean Solar Energy Society
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• v.38 no.4
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• pp.33-42
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• 2018

In the application of the BIPV system, it is expected that the workability is lowered due to the difficulty in securing the space for wiring in the frame and the performance of the frame due to the wiring hole processing is lowered. Therefore, In this study, we propose a method to improve the wiring of the inner space of the BIPV frame, and through the simulation evaluation process, the thermal and condensation performance are secured by complementing the problems caused by the hole machining, and the time and effort required for BIPV construction are reduced. For this purpose, a wiring treatment method using a flange insertion tube was proposed, and the thermal and condensation performance was evaluated through simulation analysis.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.289-296
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• 1999

The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.39-43
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• 2012

Via-filling plating and through-hole plating are absolutely imperative for manufacturing of printed-wiring board. This Paper is introducing the latest developments of our company worked on the high-performance of acid copper plating additives for them.

• Journal of Korean Society for Quality Management
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• v.25 no.2
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• pp.15-27
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• 1997

This paper describes a highly accelerated life test (HALT, USPCBT) method for rapid qualification testing of STH PWB(Silver Through Hole Printed Wiring Boards). This method was carried out to be an alternative to the present time-consuming standard 1344 hours life testing(THB). The accelerated life test conditions were $121^{\circ}C$/95%R.H. at 50V bias and without bias. Their results are compared with those observed in the standard 1344 hours life test at $40^{\circ}C$/95%R.H. at 50V bias and without bias. The studies were focused on the samples time-to-failure as well as the associated conduction and failure mechanisms. The abrupt drop of insulation resistance is due to the absorption of water vapour. And the continuous drop of insulation resistance is due to the Ag migration. The ratios of time-to-failure of HALT(USPCBT) to THB were 25 and 11 at 50V bias and without bias respectively.

• Journal of Trauma and Injury
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• v.29 no.1
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• pp.22-27
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• 2016

Purpose: The optimal method of fixation of symphysis pubis (SP) diastasis in pelvic ring injuries is still controversial. In this study, we investigated the radiological and the clinical results of a precontoured 4.5-mm symphysis pubis (SP) plate with tension band wiring (TBW) after an anterior pelvic injury in pelvic fractures. Methods: We treated 25 patients with traumatic SP diastasis by open reduction and internal fixation with plates and wires. We used a four-hole 4.5-mm precontoured SP plate with a tension band wiring. Results: Patients with a SP with TBW fixation achieved excellent or good results at final follow-up. Post-operative complications included two (8%) patients with metal work movement. The mean symphyseal width was smaller in 4.5 mm SP plate with TBW during 1-year follow up period. Conclusion: A precontoured symphysis pubis plate (4.5 mm) with figure-of-eight fashion tension band wiring shows favorable radiological results, excellent or good clinical outcome, and a lower complication (hardware failure and revision surgery).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.999-1000
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• 2009

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.136-136
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• 2015

2007년 일본에서 지갑전화나 지상파 디지털TV 방송기능을 탑재한 휴대전화개발에 힘을 쏟고 있을 무렵, 해외에서 컴퓨터에 가까운 스마트폰이라는 다기능단말기 개발이 진행되고 있었다. 스마트폰은 젊은이를 중심으로 인기가 높아지고 있다. 휴대전화를 시작으로 정밀전자기기에는 인쇄배선판(이하, PWB: Printed Wiring Board)이 내장되어 있다. PWB는 향후 하이브리드차나 전기자동차의 발전과 함께, 차량탑재 수요도 높아질 것이다. 본고에서는 PWB를 지탱하는 동 도금 Via Hole메움에 대하여 기술하였다.

• Journal of Veterinary Clinics
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• v.39 no.6
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• pp.378-383
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• 2022

A 3-year-old, 24-kg intact female Border Collie was referred for a toe-touch weight-bearing stance, intermittent weight-bearing lameness, and moderate pain reaction of the right forelimb on physical examination and right humerus olecranon avulsion fracture on diagnostic imaging examination. Surgical repair was performed using tension band wiring to re-attach the triceps tendon and distal olecranon. Migration of the distal olecranon fragment was observed due to comminuted fracture of the fragment 5-days after surgery, and revision surgery was performed. The tension-relieving sutures were passed through the pre-drilled hole in the olecranon, and the polyester mesh was augmented to the suture region, covering the triceps tendon and olecranon drilling hole using the Krackow suture pattern. The elbow joint was immobilized using a type IA transarticular external fixator, which was removed 8 weeks after surgery. Fourteen weeks after surgery, no lameness was observed on gait evaluation. At follow-up after 7 months, the distal olecranon fragment had stabilized, and no lameness was observed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.14-15
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• 2006

Application of the parallel Build-up is increasing continuously. This report presents about the PCB Build-up technology since 2000. Among the parallel build-up technologies, PALAP application - after making the via, filling the via with electric conductive paste, then expose to make wiring pattern and put them by layer without any glue or middle - is actively developing, especially DENSO company.

• Tribology and Lubricants
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• v.29 no.3
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• pp.180-185
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• 2013

The purpose of this study was to analyze the tribological characteristics of the Electronic control suspension System in a car. In the first example, the cilp used to attach the front electronic control suspension(ECS) system's control actuator was fastened very tightly. Thus, the wire was cut because of continual rotation of the shock-up shover piston rod used to adjust the height of the car. This verified the disconnection phenomenon where wire damaged makes it impossible for the ECS system to send signal to the actuator. The second example, involved a minute hole that allowed gas to leak from the ECS system. As a result, the height of the car verified the down phenomenon. In the third example, the resistance of a wire measured at $0.21{\Omega}$, when the G sensor was disconnected from the system. This verified the system shutdown and lighting of the ECS warning lamp because of body interference caused by a slight pressure on the battery cover. Therefore, quality control is always necessary to ensure safety and durability of a car.