• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.641-644
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• 2005

The study on the interaction forces of some biological materials is important to understanding biological phenomena and their application to practical purpose. This paper introduces a measuring technique for biological adhesive forces using the AFM(Atomic Force Microscope). Since no standardized thesis on adhesive forces exist, the adhesive forces is defined as adhesive forces against a hardened surface of biological materials. To grant the results are meaningful, which is based on the understanding the surface characteristics of biological materials using the AFM, a nominal value of average adhesive force per unit area should be measured. Therefore the modified AFM probe with small micro glass bead was proposed so that it can guarantee the required contact area for measuring the average adhesive forces. A pyrex glass substrate with circular patterns, which was fabricated by micromachining technique, is introduced in order to controll the contact area. The two types of mussel adhesive proteins, Celltak and recombinant-MGFP5, were tested by the proposed measuring method. The test results show that the adhesive force of the mussel adhesive proteins can be reliably measured by use of this method.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.69-72
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• 2005

In this study, effects of IHPs with various resting times to cell adhesion were investigated through the measurements of cell adhesive force, number and area of focal contacts (stained vinculin spots), and projected cell area, perimeter and circularity. In addition correlation tests and curve estimations using the experimental results were performed fur the finding an essential factor for increment of cell adhesive force. Tn the results, immediately after mechanical stimuli (150 minutes after seeding) and one hour later (210 minutes after seeding), the average adhesive force of experimental group 5 (resting time: 15min) compared with that of control group at same culture time was increased significantly (p<0.05). Average projected area and perimeter of cells at Group 5 were increased significantly (p<0.05), while average circularity of cells at Group 5 incubated fur 210 minutes was decreased significantly (p<0.05). In the digital image analysis of focal contacts containing vinculins, area and numbers of focal contacts per cell at Group 5 were higher than those of the other groups. This study indicated that IHP with appropriate resting time could contribute in improving cell adhesive force, cell spreading, development of cytoskeleton and formation of focal contacts. And cell adhesive force was correlated to the morphological aspects of cell and development of focal contacts. Particularly, area of focal contacts was closely related to cell adhesive force.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.421-425
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• 2007

In the fabrication of dry adhesive structure, increasing contact-points or contact-area is the primary goal because the adhesive force grows in proportion to the contact-area. The simplest way to extend the contact surface is the fabrication by using soft materials. However, the column-array structure could confront the matting phenomenon which columns are stuck together. Therefore, we need a novel design to reduce the effective stiffness with adequate stiff materials like a gecko's setae. In this study, we propose a novel design for the dry adhesive structure. Moreover, we analyzed whether the adhesive structure conforms the rough surface sufficiently through finite element method adopted the non-bonding interaction as the body force. Also, we fabricated the novel structures via UV lithography and some techniques. In addition, we examined the adhesive force of the novel structures.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.115-120
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• 2008

In this study, effects of surface roughness on adhesive strength of heat-resistant adhesive RTV88 were examined. Sandblast was used to generate rough surfaces on aluminum adherends, and then tensile-shear tests of Al/RTV88 single lap joints were performed. The shear strength was shown to be affected by the surface roughness. Effective area, peel failure area, and cohesive failure area were introduced to explain the effects of surface roughness on the adhesive strength. An empirical relation for the failure force was proposed based on these parameters and verified by the test results.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2005년도 춘계 학술기술논문발표대회 논문집
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• pp.173-178
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• 2005

The tile construction methods for existing have been used materials within limit which adhesion by wet method in masonry wall and concrete structure. These existing adhesive tech can caused many problems in construction of large and reform tile, after that it can be happened loose scale, peel off, falling off tile by heat and vibration or impact. In according to, this study is to test tile for bond stability, adhesive property by impact, vibration. low property by heat and then, we have the results as below; (1) The tile adhesive stability can be effected as adhesive area between bond agent and tile, adhesive area can more wide and press enough to ensure property. (2) Existing adhesive strength and standard relative tile construction is limited to adjust performance tile on the concrete and masonry wall. In summary, It is necessary to establish standard of performance and test method to ensure tile adhesive salability in dry wall.

• 대한기계학회논문집A
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• 제28권6호
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• pp.783-790
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• 2004

Adhesive-bonded joints are widely used in the industry. Recently, applications of adhesive bonding joints have been increased extensively in automobile and aircraft industry. The strength of adhesive joints is influenced by the surface roughness, adhesive shape, stress distribution, and etc. However, the magnitude of the influence has not yet been clarified because of the complexity of the phenomena. In this study, as the fundamental research of adhesive bonding joints, the effects of adhesive shape and loading speed on bonding strength properties and durability of aluminum to polycarbonate single-lap joints were studied. To evaluate the effect of adhesive shape, several modified shapes were used, and loading speeds were varied from 0.05 to 5 mm/min. As a result, the load-displacement distribution was shown a brittle fracture tendency. The trigonal edged single lap and bevelled lap joints showed the higher strength than the plain single lap, trigonal single lap, joggle lap and double lap joints in same adhesive area. The fractures of trigonal single lap and trigonal edged single lap joints that had the higher strength level were shown as the mixture type of the cohesive and interfacial-failure, mostly joggle lap joints that had the lower strength level were shown as the adhesive-failure.

• International Journal of Korean Welding Society
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• 제4권1호
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• pp.53-60
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• 2004

Adhesive-bonded joints are widely used in the industry. Recently, applications of adhesive bonding joints have been increased extensively in automobile and aircraft industry. The strength of adhesive joints is influenced by the surface roughness, adhesive shape, stress distribution, and etc. However, the magnitude of the influence has not yet been clarified because of the complexity of the phenomena. In this study, as the fundamental research of adhesive bonding joints, the effects of adhesive shape and loading speed on bonding strength properties and durability of aluminum to polycarbonate single-lap joints were studied. To evaluate the effect of adhesive shape, several modified shapes were used, and loading speeds were varied from 0.05 to 5mm/min. As a result, the load distribution showed a brittle fracture tendency. The trigonal edged single lap and bevelled lap joints showed the higher strength than the plain single lap, trigonal single lap, joggle lap and double lap joints in same adhesive area. The fractures of trigonal single lap and trigonal edged single lap joints that had the higher strength level were shown as the mixture type of the cohesive and interfacial-failure, mostly joggle lap joints that had the lower strength level were shown as the adhesive-failure.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• International Journal of Aerospace System Engineering
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• 제1권1호
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• pp.44-47
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• 2014

This study proposes a development for the nano silver adhesive, which is applicable to high efficiency LED(light-emitting diode) light. The important issue of LED light is heat exhaust from LED. Generally, the middle area of LED light is increased up to 380K. Therefore, the bottleneck between LED chip and heat sink are caused by high temperature. In this work, the adhesive material between LED Chip and heat sink was newly developed for improvement of bottleneck. The nano silver was adopted to solve heat problem of chip on board package for LED light. In order to evaluate the performance of the nano silver adhesive, the thermal analysis was performed. Moreover both adhesive performance and heat exhaust were verified through the prototype test. From the experimental test results, it is found that the developed nano silver adhesive has the high performance.

• 한국공작기계학회논문집
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• 제17권3호
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• pp.14-19
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• 2008

In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).