• Title/Summary/Keyword: auger electron analysis

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Simulation of Energy Resolution of Time of Flight System for Measuring Positron-annihilation induced Auger Electrons (양전자 소멸 Auger 전자 에너지 측정을 위한 Time of Flight의 분해도 향상에 관한 이론적 연구)

  • Kim, J.H.;Yang, T.K.;Lee, C.Y.;Lee, B.C.
    • Journal of the Korean Vacuum Society
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    • v.17 no.4
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    • pp.311-316
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    • 2008
  • Since the presence of the chemical impurities and defect at surfaces and interfaces greatly influence the properties of various semiconductor devices, an unambiguous chemical characterization of the metal and semiconductor surfaces become more important in the view of the miniaturization of the devices toward nano scale. Among the various conventional surface characterization tools, Electron-induced Auger Electron Spectroscopy (EAES), X-ray Photoelectron Spectroscopy (XPS) and Secondary Electron Ion Mass Spectroscopy (SIMS) are being used for the identification of the surface chemical impurities. Recently, a novel surface characterizaion technique, Positron-annihilation induced Auger Electron Spectroscopy (PAES) is introduced to provide a unique method for the analysis of the elemental composition of the top-most atomic layer. In PAES, monoenergetic positron of a few eV are implanted to the surface under study and these positrons become thermalized near the surface. A fraction of the thermalized positron trapped at the surface state annihilate with the neighboring core-level electrons, creating core-hole excitations, which initiate the Auger process with the emission of Auger electrons almost simultaneously with the emission of annihilating gamma-rays. The energy of electrons is generally determined by employing ExB energy selector, which shows a poor resolution of $6{\sim}10eV$. In this paper, time-of-flight system is employed to measure the electrons energy with an enhanced energy resolution. The experimental result is compared with simulation results in the case of both linear (with retarding tube) and reflected TOF systems.

The Formation Technique of Thin Film Heaters for Heat Transfer Components (열교환 부품용 발열체 형성기술)

  • 조남인;김민철
    • Journal of the Semiconductor & Display Technology
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    • v.2 no.4
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    • pp.31-35
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    • 2003
  • We present a formation technique of thin film heater for heat transfer components. Thin film structures of Cr-Si have been prepared on top of alumina substrates by magnetron sputtering. More samples of Mo thin films were prepared on silicon oxide and silicon nitride substrates by electron beam evaporation technology. The electrical properties of the thin film structures were measured up to the temperature of $500^{\circ}C$. The thickness of the thin films was ranged to about 1 um, and a post annealing up to $900^{\circ}C$ was carried out to achieve more reliable film structures. In measurements of temperature coefficient of resistance (TCR), chrome-rich films show the metallic properties; whereas silicon-rich films do the semiconductor properties. Optimal composition between Cr and Si was obtained as 1 : 2, and there is 20% change or less of surface resistance from room temperature to $500^{\circ}C$. Scanning electron microscopy (SEM) and Auger electron spectroscopy (AES) were used for the material analysis of the thin films.

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Effects of Oxide Layer Formed on TiN Coated Silicon Wafer on the Friction and Wear Characteristics in Sliding (미끄럼운동 시 TiN 코팅에 형성되는 산화막이 마찰 및 마멸 특성에 미치는 영향)

  • 조정우;이영제
    • Tribology and Lubricants
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    • v.18 no.4
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    • pp.260-266
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    • 2002
  • In this study, the effects of oxide layer farmed on the wear tracks of TiN coated silicon wafer on friction and wear characteristics were investigated. Silicon wafer was used for the substrate of coated disk specimens, which were prepared by depositing TiN coating with 1 ${\mu}{\textrm}{m}$ in coating thickness. AISI 52100 steel ball was used fur the counterpart. The tests were performed both in air for forming oxide layer on the wear track and in nitrogen to avoid oxidation. This paper reports characterization of the oxide layer effects on friction and wear characteristics using X-ray diffraction(XRD), Auger electron spectroscopy(AES), scanning electron microscopy (SEM) and multi-mode atomic force microscope(AFM).

미끄럼운동 시 TiN코팅에 형성되는 산화막이 마찰 및 마멸 특성에 미치는 영향

  • Jo, Jeong-U;Im, Jeong-Sun;U, Sang-Gyu;Lee, Yeong-Je
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2002.05a
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    • pp.310-316
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    • 2002
  • In this study, the effects of oxide layer formed on the wear tracks of TiN coated silicon wafer on friction and wear characteristics were investigated. Silicon wafer was used for the substrate of coated disk specimens, which were prepared by depositing TiN coating with $1{\mu}m$ in coating thickness. AISI 52100 steel ball was used for the counterpart. The tests were performed both in air for forming oxide layer on the wear track and in nitrogen to avoid oxidation. This paper reports characterization of the oxide layer effects on friction and wear characteristics using X-ray diffraction (XRD). Auger electron spectroscopy (AES), scanning electron microscopy (SEM) and sliding tests.

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Preparation and Characterization of Thin Films by Plasma Polymerization of Hexamethyldisiloxane

  • Lee, Sang-Hee;Lee, Duck-Chool
    • Electrical & Electronic Materials
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    • v.11 no.10
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    • pp.66-71
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    • 1998
  • Plasma polymerized hexamethyldisiloxane (PPHMDSO) thin films were produced using an electrode capacitively coupled apparatus. Fourier transform infrared spectroscopy analysis indicated that the thin film spectra are composed not only of the corresponding monomer bands but also of several new bands. Auger electron spectroscopy analysis indicated that the permeation depth of aluminum into the films is ca. 30nm when top electrode is deposited by evaporation aluminum. The increase of relative dielectric constant and decrease of dielectric loss tangent with the discharge power is originated from high cross-link of the films.

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A Study on the TiC Coating Using Hollow Cathode Discharge Ion Plating (HCD이온플레이팅 방법을 이용한 zzTiC코팅에 관한 연구)

  • 김인철;서용운;황기웅
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.41 no.8
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    • pp.875-882
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    • 1992
  • Titanium carbide(TiC) films, known as having excellent characteristics of resistance to wear and corrosion, were deposited on SUS-304 sheets using HCD(Hollow Cathode Discharge) reactive ion plating with acetylene gas as the reactant gas. The characteristics of TiC films were examined by X-ray diffraction, micro-Vickers hardness tester, ${\alpha}$-step, SEM(Scanning Electron Spectroscopy), ESCA(Electron Spectroscopy for Chemical Analysis), and AES(Auger Electron Spectroscopy) and the results were discussed with regard to the changes of various deposition conditions(bias voltage, acetylene flow rate, temperature).

The Interfacial Segregation of Elemental Ag in the Sputter-Deposited AgInSbTe Thin Films (스퍼터 증착시킨 AgInSbTe 박막에서 Ag의 계면편석)

  • Choi, Woo-S.;Kim, Myong-R.;Seo, Hun;Park, Jeong-W.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1996.05a
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    • pp.15-18
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    • 1996
  • The elemental segregation in the sputter-deposited AgInSbTe recording thin films was studied by means of Auger electron spectroscopy and ESCA for the specimens of as-deposited and as heat-treated conditions. Auger electron spectroscopy and ESCA revealed an extremely thin layer of elemental inhomogeneity, especially for the silver, even in as-deposited condition. The chemical analysis results obtained in this alloy system are discussed in terms of process parameters and target microstructure.

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