• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.69-72
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• 2002

The geometry parameter of tool such as rake angle and clearance angle is defined clearly to solve the difference in communication between design and measurement stage. Using the developed simulation program, wheel is properly determined and end mill can be manufactured accurately. The performance test with well defined end mill provides sufficient information to decide optimal geometry. For machining hardened steel, end mills are designed and manufactured. Optimal rake angle and clearance angle is obtained from performance test. A specific software for automatic end mill production is developed far simulation and fur generation of NC code as Cad/CAM system.

• Journal of Sensor Science and Technology
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• v.28 no.4
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• pp.251-255
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• 2019

We propose a two-step lithography process to minimize edge-bead issues caused by thick photoresist (PR) coating. In the conventional PR process, the edge bead can be efficiently removed by applying an edge-bead removal (EBR) process while rotating the silicon wafer at a high speed. However, applying conventional EBR to the production of desired PR mold with unique negative patterns cannot be used because a lower rpm of spin coating and a lower temperature in the soft bake process are required. To overcome this problem, a two-step lithography process was developed in this study and applied to the fabrication of a polydimethylsiloxane (PDMS) film having super-hydrophobic characteristics. Following UV exposure with a first photomask, the exposed part of the silicon wafer was selectively removed by applying a PR developer while rotating at a low rpm. Then, unique PR mold structures were prepared by employing an additional under-exposure process with a second mask, and the mold patterns were transferred to the PDMS. Results showed that the fabricated PDMS film based on the two-step lithography process reduced the height difference from 23% to 5%. In addition, the water contact angle was greatly improved by spraying of hydrophobic nanosilica on the dual-scaled PDMS surface.

• Korean Journal of Optics and Photonics
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• v.21 no.6
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• pp.241-246
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• 2010

In this paper, we propose an electric field enhanced postexposure baking (EFE-PEB) method to obtain deep and high aspect ratio pattern profile in near-field recording. To describe the photoacid distribution under an external electric field during the PEB, we derived the governing equations based on Fick's second law of diffusion. From the results of the numerical calculations, it is found that the vertical movement of photoacid increases while the lateral movement is stationary as electric field varies from 0 to $8.0{\times}10^6\;V/m$. Also, it is proven that the profile of near-field recording is improved by using the EFE-PEB method with increased depth, higher aspect ratio and larger sidewall angle.