• Journal of Korean Neurosurgical Society
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• v.65 no.2
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• pp.196-203
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• 2022

Objective : To perform a comparative analysis of therapeutic effects associated with two different shapes of ceria nanoparticles, ceria nanorods (Ceria NRs) and ceria nanospheres (Ceria NSs), in an in vitro model of traumatic brain injury (TBI). Methods : In vitro TBI was induced using six-well confluent plates by manually scratching with a sterile pipette tip in a 6×6-square grid. The cells were then incubated and classified into cells with scratch injury without nanoparticles and cells with scratch injury, which were treated separately with 1.16 mM of Ceria NSs and Ceria NRs. Antioxidant activities and anti-inflammatory effects were analyzed. Results : Ceria NRs and Ceria NSs significantly reduced the level of reactive oxygen species compared with the control group of SH-SY5Y cells treated with Dulbecco's phosphate-buffered saline. The mRNA expression of superoxide dismutases was also reduced in nanoparticle-treated SH-SY5Y cells, but apparently the degree of mRNA expression decrease was not dependent on the nanoparticle shape. Exposure to ceria nanoparticles also decreased the cyclooxygenase-2 expression, especially prominent in Ceria NR-treated group than that in Ceria NS-treated group. Conclusion : Ceria nanoparticles exhibit antioxidant and anti-inflammatory effects in TBI models in vitro. Ceria NRs had better anti-inflammatory effect than Ceria NSs, but showed similar antioxidant activity.

• Journal of the Korean Ceramic Society
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• v.36 no.4
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• pp.372-379
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• 1999

Hihg-toughened ceria-stabilized tetragonal zirconia ceramics with irregular grain shape and undulated grain boundary was prepared by ceria doping. Irregularity of grain shapes was increased with the amount of doped ceria. But in case of the large amount of doped ceria grain boundary was migrated to the reverse direction of DIGM. Ceria-stabilized zirconia ceramics annealed at 1650$^{\circ}C$ for 2h after twice dippings into cerium nitrate solu-tion of 0.2M and sintering at 1500$^{\circ}C$ for 2h showed the highest grain boundary length with a value of 23.6$\mu\textrm{m}$ Ceria concentration difference between convex and concave sides in irregular grains was observed over 1 mol% but not observed in normal grains, Specimens with normal grain shape showed intergranular fracture mode whereas the specimens with irregular grain shape showed transgranular fracture mode.

• Journal of Korean Society for Atmospheric Environment
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• v.15 no.5
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• pp.667-676
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• 1999

The roles of ceria on three-way catalyst is to improve the noble metal dispersion and thermal stability of support ${\gamma}$-$Al_2O_3$. And, ceria has a oxygen storage capacity(OSC) under fuel rich/lean conditions to improve the operating windows of NOx, THC and CO conversion. However, ceria has weak thermal stability under high temperature due to the crystallite growth. So that, the OSC of ceria is decreased, and then the conversions of NOx, THC and CO is decreased. One way of enhancing the thermal stability and NOx, THC and CO conversion Pd-only catalyst is to improve as well as its thermal stability and oxygen storage capacity of the ceria. Especially, the appropriate mixing ratios of bulk and stabilized ceria are very important for designing principles of Pd-only three-way catalysts. In this paper, we discussed the thermal properties of stabilizedand unstabilized (bulk) ceria, and the oxygen storage capacity (OSC) of catalysts, and found the correlation between activity and the OSC of Pd-only catalysts with various different mixing ratios of bulk and stabilized ceria. Finally, we propose the design principles to improve the thermal stability of washcoated Pd-only catalysts.

• Bulletin of the Korean Chemical Society
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• v.32 no.9
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• pp.3338-3342
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• 2011

We fabricated ceria ($CeO_2$) nanofibers by applying a mixed solution of polyvinylpyrrolidone (PVP) and various concentrations of cerium nitrate hydrate ($Ce(NO_3)_3$) ranging from 15.0 to 26.0 wt % by the electrospinning process. Ceria nanofibers were obtained after calcining PVP/$Ce(NO_3)_3$ nanofiber composites at 873 and 1173 K. The SEM images indicated that the diameters of $CeO_2$ nanofibers calcined at 873 and 1173 K were smaller than those of nanofibers obtained at RT. As the amount of cerium increased, the diameter of $CeO_2$ nanofibers increased. XRD analysis revealed that the ceria nanofibers were in cubic form. TEM results revealed that the ceria nanofibers were formed by the interconnection of Ce oxide nanoparticles. The ceria nanofibers obtained at low concentrations of Ce (CeL) showed spotty ring patterns indicated that the ceria nanofibers were polycrystalline structure. And the ceria nanofibers obtained at high concentration of Ce (CeH) showed fcc (001) diffraction pattern. XPS study indicated that the oxidation of Ce shifted from $Ce^{3+}$ to $Ce^{4+}$ as the calcination temperature increased.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.96-96
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• 2010

Monodispersed spherical silica-coated ceria nanoparticles were prepared through a sol-gel process using tetraethylorthosilicate (TEOS) and ceria fine particles. In this process, ceria fine particles were also prepared from cerium nitrate. The mean size of ceria particles was 300nm. Silica nanoparticles with narrow particle size distribution were prepared by controlled hydrolysis of TEOS solution. The silica sols were obtained by peptization, the process of redispersing a coagulated colloid, and were coated on ceria particles by the control of the weight ratio of silica/ceria and the pH of the mixture in aqueous solution. The morphologies of particles were characterized with scaning electron microscopy(SEM), transmission electron microscopy(TEM) and atomic force microscopy(AFM). The coating thickness of silica particles obtained by using this method was controlled in the range of 30 - 70nm.

• Journal of the Korean Ceramic Society
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• v.46 no.3
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• pp.249-252
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• 2009

Nanocrystalline ceria particles were prepared by using the ultrasonic spray pyrolysis method. The prepared ceria particles were found to be spherical and non-agglomerated by the SEM and TEM analyses. It was found that carrier gas influences the size and morphology. It was found that the air stream of carrier gas results in porous agglomerated structure of ceria abrasives, whereas solid nano-sphere can be obtained in a more oxidizing atmosphere.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.120-124
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• 2004

본 연구는 Diluted Ceria 입자를 사용한 $SiO_2$(Oxide) CMP 현상에 대한 내용이다. Ceria Slurry의 경우 Silica Slurry와 비교하였을 때 Oxide Wafer 표면과 축합 화학반응을 일으키며 Chemistry Dominant한 CMP Mechanism을 따르고, Wafer Center Removal Rate(RR) Fast 의 특성을 가진다. Ceria Slurry의 문제점인 연마 불균일도를 해결하기 위해 Tribological System을 이용하였다. CMP Tribology는 Pad-Slurry 유막-Wafer의 System을 가지며 윤활막에 작용하는 마찰계수(COF)가 주요 인자이다. Tribology에 적용되는 Stribeck Curve를 통해 Slurry 윤활막의 두께(h) 정도를 예상할 수 있으며, 이 윤활막의 두께를 조절함으로써 Uniformity 향상이 가능하다. 이 Ceria Slurry CMP의 연마 불균일도를 향상시킬 수 있는 방법으로 pH 조절 및 점도 증가가 있다. Ceria 입자 CMP는 분산액의 pH 변화에 강한 작용을 받게 되며 PH5 근방에서 최적화된 Uniformity가 가능하다. 점도를 증가시키는 경우 유막 h가 증가하게 되어 Ceria Slurry의 유동이 균일 분포 상태에 가까워지며 Wafer Uniformity 향상이 가능하다.

• Transactions on Electrical and Electronic Materials
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• v.7 no.4
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• pp.167-172
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• 2006

Submicron colloidal silica coated with ceria were prepared by mixing of silica and nano ceria particles and modified by hydrothermal reaction. The polishing efficiency of the ceria coated silica slurry was tested over oxide film on silicon wafer. By changing the polishing pressure in the range of $140{\sim}420g/cm^2$ with the ceria coated silica slurries in $100{\sim}300nm$, rates, WIWNU and friction force were measured. The removal rate was in the order of 200, 100, and 300 nm size silica coated with ceria. It was known that the smaller particle size gives the higher removal rate with higher contact area in Cu slurry. In the case of oxide film, the indentation volume as well as contact area gives effect on the removal rate depending on the size of abrasives. The indentation volume increase with the size of abrasive particles, which results to higher removal rate. The highest removal rate in 200 nm silica core coated with ceria is discussed as proper combination of indentation and contact area effect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.118-118
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• 2008

The oxide CMP has been applied to interlayer dielectric(ILD) and shallow trench isolation (STI) in chip fabrication. Recently the slurry used in oxide CMP being changed from silica slurry to ceria (cerium dioxide) slurry particularly in STI CMP, because the material selectivity of ceria slurry is better than material selectivity of silica slurry. Moreover, the ceria slurry has good a planarization efficiency, compared with silica slurry. However ceria abrasives make a material removal rate too high at the region of wafer center. Then we focuses on why profile of material removal rate is convex. The material removal rate sharply increased to 3216 $\AA$/min by $4^{th}$ run without conditioning. After $4^{th}$ run, material removal rate converged. Furthermore, profile became more convex during 12 run. And average material removal rate decreased when conditioning process is added to end of CMP process. This is due to polishing mechanism of ceria. Then the ceria abrasive remains at the pad, in particular remains more at wafer center contacted region of pad. The field emission scanning electron microscopy (FE-SEM) images showed that the pad sample in the wafer center region has a more ceria abrasive than in wafer outer region. The energy dispersive X-ray spectrometer (EDX) verified the result that ceria abrasive is deposited and more at the region of wafer center. Therefore, this result may be expected as ceria abrasives on pad surface causing the convex profile of material removal rate.

• Transactions on Electrical and Electronic Materials
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• v.7 no.3
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• pp.112-117
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• 2006

In this paper we present that the effects of polymer adsorption on stabilities and CMP performance of ceria abrasive particles. Characterization of ceria abrasive particles in the presence of poly(vinyl pyrrolidone) (PVP) was performed by the measurements of adsorbed amounts of PVP, average sizes, and the back scattering intensities of the ceria abrasive particles as functions of PVP molecular weight and PVP concentration. The ceria abrasive particles in the presence of PVP were used to polish $SiO_2\;and\;Si_3N_4$ films deposited on Si wafers in order to understand the effect of PVP adsorption on chemical mechanical polishing (CMP) performance, together with ceria abrasive particles without PVP. Adsorption of PVP on the ceria abrasive particles enhanced the stability of ceria abrasive particles due to steric stabilization of the thick adsorbed layer of PVP. Removal rates of the deposited $SiO_2\;and\;Si_3N_4$ films by the ceria abrasive particles in the presence of PVP were much lower than those in the absence of PVP and their magnitudes were decreased with an increase in the concentration of free PVP chains in the dispersion media. This suggests that the CMP performance in the presence of PVP could be mainly controlled by the hydrodynamic interactions between the adsorbed PVP chains and the free ones. Moreover, the molecular weight dependence of PVP on the removal rates of the deposited films was hardly observed. On the other hand, high removal rate selectivity between the deposited films in the presence of PVP was not observed.