• ETRI Journal
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• v.27 no.5
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• pp.497-503
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• 2005

In this paper, we present a performance analysis for an MPEG-4 video codec based on the on-chip network communication architecture. The existing on-chip buses of system-on-a-chip (SoC) have some limitation on data traffic bandwidth since a large number of silicon IPs share the bus. An on-chip network is introduced to solve the problem of on-chip buses, in which the concept of a computer network is applied to the communication architecture of SoC. We compared the performance of the MPEG-4 video codec based on the on-chip network and Advanced Micro-controller Bus Architecture (AMBA) on-chip bus. Experimental results show that the performance of the MPEG-4 video codec based on the on-chip network is improved over 50% compared to the design based on a multi-layer AMBA bus.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.7
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• pp.641-648
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• 2002

The study on the chip waveform design to minimize multiple-access interference (MAI) and its performance evaluation are very important since chip waveform decides the signal quality and system capacity of the direct-sequence CDMA wireless communication system. This paper suggests the analytical chip waveform to minimize the MAI. The BER and throughput performances achieved by the proposed analytical optimum chip waveform are compared with those of the conventional chip waveforms in the Nakagami-m distribution frequency selective channel when the differential phase shift keying (DPSK) is employed in DS-CDMA system. From the numerical results, capacity and throughput are improved about 2 times and 1.4 times respectively when it is compared with the Kaiser chip waveform that is considered as one of the best in the conventional ones.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.7
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• pp.583-591
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• 2000

It this paper the multilayer chip band pass filter for next generation mobile communication phone is fabricated and designed. For the design the multilayer chip filter of non-contented equivalent circuit and contented equivalent circuit with attenuation pole is presented. Finally it is fabricated and designed using the multilayer chip filter of contented equivalent circuit with attenuation pole. The size insertion loss center frequency and band width of multilayer chip filter are 4.5$\times$3.2$\times$2.0[mm], 3.0[d.B] and 1945$\pm$25 MHz respectively. The multilayer chip filter was fabricated by screen printing with Ag electrode after tape casting. Simulation results of multilayer chip filter are compared with experimental results and found to be in excellent agreements.

• Smart Media Journal
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• v.1 no.1
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• pp.27-35
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• 2012

In this paper, the performance analysis for multimedia video codec(MPEG-4, H.264) on on-chip network communication architecture is presented. The On-Chip Network (OCN) is the new communication architecture of multimedia SoC design that overcomes the limits of On-Chip Bus architecture by providing higher data traffic bandwidth, reusability and higher scalability. We compared the performance of MPEG-4, H.264 decoder based on-chip network and AMBA on-chip bus. Experimental results show that the performance of MPEG-4, H.264 based on on-chip network is improved over 33~56% compared to the design based on AMBA on-chip bus.

• Journal of electromagnetic engineering and science
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• v.4 no.2
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• pp.63-67
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• 2004

DAM(Delay-And-Multiplier) intercept receiver usually detects the symbol rate of the transmitted DS spread spectrum signal for the feature extraction. It is important for secure communication to reduce the normalized output signal-to-noise ratio that is generated at the DAM intercept receiver as a measure of detectability. In this paper, several kinds of chip waveforms are novelly analyzed for LPI(Low-Probability of Intercept) communication against DAM intercept receiver. Consequently, it is shown that the rectangular chip waveform shows the best LPI performance in the bandwidth of 2/$T_c$TEX>, 4/$T_c$TEX>, and 6/$T_c$TEX>/. Except the rectangular waveform, kaiser chip waveform show better LPI performance than the other waveforms in the bandwidth of 4/$T_c$TEX> and 6/$T_c$TEX>.

• Journal of KIISE:Computer Systems and Theory
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• v.32 no.9
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• pp.465-474
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• 2005

For high density SoC design, on-chip communication based on bus interconnection encounters bandwidth limitation while an NoC(Network-on-Chip) approach suffers from unacceptable complexity in its Implementation. This paper introduces a new on-chip communication protocol, SNP (SoC Network Protocol) to overcome these problems. In SNP, conventional on-chip bus signals are categorized into three groups, control, address, and data and only one set of wires is used to transmit all three groups of signals, resulting in the dramatic decrease of the number of wires. SNP efficiently supports master-master communication as well as master-slave communication with symmetric channels. A sequencing rule of signal groups is defined as a part of SNP specification and a phase-restoration feature is proposed to avoid redundant signals transmitted repeatedly over back-to-back transactions. Simulation results show that SNP provides about the same bandwidth with only $54\%$ of wires when compared with AMBA AHB.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.6
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• pp.832-841
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• 2016

The voltage-frequency island (VFI) design paradigm has strong potential for achieving high energy efficiency in communication centric manycore system-on-chip (SoC) design called network-on-chip (NoC). However, because of the diminished scaling of wire-dimension and supply voltage as well as threshold voltage in modern CMOS technology, the vulnerability to link failure in VFI NoC is becoming a crucial challenge. In this paper, we propose an energy-optimized topology generation technique for VFI NoC to cope with permanent link failures. Based on the energy consumption model, we exploit the on-chip communication traffic patterns and characteristics of link failures in the early design stage to accommodate diverse applications and architectures. Experimental results using a number of multimedia application benchmarks show the effectiveness of the proposed three-step custom topology generation method in terms of energy consumption and latency without any degradation in the fault coverage metric.

• Journal of electromagnetic engineering and science
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• v.1 no.2
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• pp.120-125
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• 2001

The capacity improvement in the DS-CDMA system can be obtained by allowing spectrum-overlap between adjacent channels. In this paper, an analysis for capacity improvement is newly considered according to the various chip waveforms in the partial spectrum-overlapped DS-CDMA system. Optimum-overlapping ratio is numerically found to obtain maximum capacity improvement for each chip waveform. Assuming the bandwidth containing 95% of the total power, i.e., 95% power bandwidth, rectangular chip waveform has the largest capacity improvement in the considered chip waveforms and then the amount of improvement is 136.5% at overlapping ratio 1.5 for BER = $10^{-3}$TEX> . Furthermore, as the required BER becomes lower, the capacity improvement gets smaller for a1l of chip waveforms. For the unequal power channels, it is shown that the larger capacity improvement is achieved as the power of desired channel becomes larger than that of adjacent channels. And the capacity improvement can be obtained even though the desired channel power is lower than the adjacent channel power.

• Journal of the Institute of Electronics and Information Engineers
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• v.49 no.9
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• pp.259-269
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• 2012

With the lower supply voltage and the higher operating frequency in integrated circuits, the analysis of the power distribution network (PDN) including on-chip inductances becomes more important. In this paper, an effective inductance extraction method for a regular on-chip power grid structure is proposed. The loop inductance model applicable to chip layout is proposed and the inductance extraction tool using the proposed inductance model based on post layout RC circuits is developed. The accuracy of the proposed loop model and the developed tool is verified by comparing the test circuit simulation results with those from the partial element equivalent circuit (PEEC) model. The voltage fluctuation from the RLC circuits extracted by the developed tool was examined for the analysis of on-chip inductance effects. The significance of on-chip power grid inductance was investigated by the co-simulation of chip-package-PCB.

• ETRI Journal
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• v.27 no.1
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• pp.81-88
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• 2005

In this paper, interface circuits that are suitable for point-to-point interconnection with an over 1 Gbps data rate per pin are proposed. To achieve a successful data transfer rate of multi-gigabits per-second between two chips with a point-to-point interconnection, the input receiver uses an on-chip parallel terminator of the pass gate style, while the output driver uses the pullup and pulldown transistors of the diode-connected style. In addition, the novel dynamic voltage level converter (DVLC) has solved such problems as the access time increase and valid data window reduction. These schemes were adopted on a 64 Mb DDR SRAM with a 1.5 Gbps data rate per pin and fabricated using a 0.10 ${\mu}m$ dual gate oxide CMOS technology.