• Title/Summary/Keyword: copper-water nanofluid

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Flow and Heat Transfer Analysis of Copper-water Nanofluid with Temperature Dependent Viscosity Past a Riga Plate

  • Ahmad, A.;Ahmed, S.;Abbasi, F.M.
    • Journal of Magnetics
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    • v.22 no.2
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    • pp.181-187
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    • 2017
  • Flow of electrically conducting nanofluids is of pivotal importance in countless industrial and medical appliances. Fluctuations in thermophysical properties of such fluids due to variations in temperature have not received due attention in the available literature. Present investigation aims to fill this void by analyzing the flow of copper-water nanofluid with temperature dependent viscosity past a Riga plate. Strong wall suction and viscous dissipation have also been taken into account. Numerical solutions for the resulting nonlinear system have been obtained. Results are presented in the graphical and tabular format in order to facilitate the physical analysis. An estimated expression for skin friction coefficient and Nusselt number are obtained by performing linear regression on numerical data for embedded parameters. Results indicate that the temperature dependent viscosity alters the velocity as well as the temperature of the nanofluid and is of considerable importance in the processes where high accuracy is desired. Addition of copper nanoparticles makes the momentum boundary layer thinner whereas viscosity parameter does not affect the boundary layer thickness. Moreover, the regression expressions indicate that magnitude of rate of change in effective skin friction coefficient and Nusselt number with respect to nanoparticles volume fraction is prominent when compared with the rate of change with variable viscosity parameter and modified Hartmann number.

Experimental Study of Evaporation of Nanofluid Droplet (나노유체 액적의 증발에 관한 실험적 연구)

  • Kim, Yeung Chan
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.37 no.7
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    • pp.647-653
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    • 2013
  • The evaporation characteristics of nanofluid droplets on a heated solid surface were experimentally investigated. The experiments were conducted using pure water and a nanofluid of water mixed with CuO nanoparticles, and the solid surface was made of a copper block heated by a nine cartridge heater. The experimental results showed that the evaporation rate of the nanofluid droplet was higher than that of the pure water droplet on the heated solid surface because nanoparticles increased the thermal conductivity of the nanofluid. Furthermore, it was found that the evaporation rate of the nanofluid droplet increased with the solid surface roughness. This may be because the actual area of the liquid-solid interface increased with the solid surface roughness.

Effects of Surface Roughness on Contact Angle of Nanofluid Droplet (표면조도가 나노유체 액적의 접촉각에 미치는 영향)

  • Kim, Yeung Chan
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.37 no.6
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    • pp.559-566
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    • 2013
  • The effects of solid surface roughness on the contact angle of a nanofluid droplet were experimentally investigated. The experiments were conducted using the solid surface of a 10 mm cubic copper block and the nanofluid of water mixed with CuO nanoparticles. The experimental results showed that the contact angles of nanofluid droplets were lower than those of water droplets and that the contact angle of the nanofluid droplet increased with the solid surface roughness. Furthermore, it was found that the contact angles of water droplets on the solid surface quenched by both water and the nanofluid were lower than those of water droplets on the pure solid surface. However, significant differences were not observed between the contact angles on the solid surfaces quenched by water and the nanofluid.

A Study on Thermal Conductivity Characteristics of Nanofluids (나노유체 열전도도 특성 연구)

  • Hwang, Yu-Jin;Park, Jae-Hong;Kim, Hong-Suk;Lee, Jae-Keun
    • Proceedings of the SAREK Conference
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    • 2006.06a
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    • pp.162-167
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    • 2006
  • Nanofluid is a kind of new engineering material consisting of nanoparticles dispersed in base fluid. Nanofluids could have various applications such as magnetic fluids, heat exchanger working fluids, lubricants, drug delivery and so on in present study, various nanoparticles, such as MWCNT (Multi-walled Carbon Nanotube), fullerene, copper oxide, and silicon dioxide are used to produce nanofluids. As base fluids, DI-water, ethylene glycol, oil, and silicon oil are used. To investigate the thermo-physical properties of nanofluids, thermal conductivity and kinematic viscosity are measured. Stability estimation of nanofluid is conducted with UV-vis spectrophoto-meter. In this study, the high pressure homogenizer is the most effective method to produce nanofluid with the prepared nanoparticle and base fluid. Excellently stable nanofluids are produced with the magnetron sputtering system. Thermal conductivity of nanofluid increases with increasing particle volume fraction except water-based fullerene nanofluid which has lower thermal conductivity than base fluid due to its lower thermal conductivity, 0.4 W/mK. The experimental results can't be predicted by Jang and Choi model.

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A Study on the Heat Transfer Enhancement of Miniature loop Heat Pipes by Using the Cu Nanofluids

  • Kim, Young-Sik;Jeong, Hyo-Min;Chung, Han-Shik;Tanshen, Md.Riyad;Lee, Dae-Chul;Ji, Myoung-Kuk;Bae, Kang-Youl
    • Journal of Power System Engineering
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    • v.17 no.2
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    • pp.70-77
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    • 2013
  • An experimental study was carried out to understand the heat transfer performance of a miniature loop heat pipes using water-based copper nanoparticles suspensions as the working fluid. The suspensions consisted of deionized water and copper nanoparticles with an average diameter of 80 nm. Effects of the cupper mass concentration and the operation pressure on the average evaporation and condensation heat transfer coefficients, the critical heat flux and the total heat resistance of the mLHPs were investigated and discussed. The pressure frequency also depends upon the evaporator temperature which has been maintained from $60^{\circ}C$ to $90^{\circ}C$. The Investigation shows 60% filling ratio gives the highest inside pressure magnitude of highest number pressure frequency at any of setting of evaporator temperature and 5wt% results the lowest heat flow resistance.