• Title/Summary/Keyword: crosstalk

Search Result 505, Processing Time 0.03 seconds

A Study On Effects of The Termination Conditions on Crosstalk in The A/D Converter Circuit (A/D 변환기 회로에서 터미네이션 임피던스의 crosstalk에 대한 영향 분석)

  • Lim, Han-Sang
    • Journal of the Institute of Electronics Engineers of Korea SC
    • /
    • v.47 no.2
    • /
    • pp.35-42
    • /
    • 2010
  • In this study, crosstalk between dominant interconnect pairs in an A/D converter circuit is analyzed in frequency domain and effects of termination conditions on crosstalk are described, based on the practical circuit conditions. An A/D converter circuit is a mixed circuit where both clean and noisy signals coexist such that the circuit probably suffers from distortion by crosstalk. An analog input signal and the reference voltage signal, which dominate the overall conversion performance of the A/D converter circuit, are ready to be distorted by crosstalk and include specific termination conditions, such as non-matching and capacitive termination, respectively. Thus, this study presents the model of crosstalk considering impedance mismatch at both ends and analyzes effects of the practical termination conditions in the analog input and the reference voltage interconnects on crosstalk. A typical circuit configuration of the two interconnects is described and crosstalk including near-end and far-end termination impedances is modeled. Effects of the near-end impedance mismatch in the analog input interconnect and the far-end capacitive termination in the reference voltage interconnect are estimated in the frequency domain by using the model of crosstalk and experiments are performed to confirm the estimated results. Microstrip lines are used as interconnects, involving the increase of loss in high frequencies.

Analysis of the Different Influences of Additive or Subtractive Three-dimensional Crosstalk on the Level of the Visual Fatigue

  • Park, Minyoung;Kim, Joohwan;Choi, Hee-Jin
    • Journal of the Optical Society of Korea
    • /
    • v.19 no.1
    • /
    • pp.38-44
    • /
    • 2015
  • Three-dimensional (3D) crosstalk is one of the main causes of visual fatigue and needs to be suppressed. The 3D crosstalk can be categorized into two different kinds according to its appearance-additive 3D crosstalk and subtractive 3D crosstalk. In this paper, we analyze the influence of different kinds of 3D crosstalk to the perceived level of visual fatigue in order to suppress the perceived 3D crosstalk effectively.

An Efficient Crosstalk Cancellation Algorithm Using Pole-zero Dewarping (Pole-zero Dewarping을 이용한 효율적인 Crosstalk 제거 알고리듬)

  • Lee Junho;Park Young-cheol;Youn Dae-hee;Jeong Jae-woong
    • The Journal of the Acoustical Society of Korea
    • /
    • v.24 no.3
    • /
    • pp.133-140
    • /
    • 2005
  • Crosstalk canceller in stereo channel audio reproduction system has the purpose to deliver desired signals exactly at the listener's ear. Generally. it has a Poor performance in low frequency bands. Frequency-warped Otters are used to provide improved performance in crosstalk canceller for these problems. However. such filters are more complex to implement than conventional filters. This paper presents an efficient method for low-order IIR approximation of frequency warped crosstalk cancellation filters using Pole-zero dewarping. The method preserves the advantages of frequency warping, but has a computational complexity that is similar to the conventional method. This Paper also presents a series of experiments that validate the method of crosstalk canceller.

Crosstalk Noise by Shrinkage of Thick Holographic Photopolymer (광폴리머를 사용한 두꺼운 홀로그램의 수축에 의한 혼선잡음)

  • Hwang Yongsop;Kim Kun-Yul;Park Jooyoun;Nam Haeun
    • 정보저장시스템학회:학술대회논문집
    • /
    • 2005.10a
    • /
    • pp.134-138
    • /
    • 2005
  • The crosstalk noise of thick holographic photopolymer is studied. Three different experiments, (1) reading area dependency (2) post-exposure effect (3) effect of later recorded holograms on earlier recorded holograms, have been accomplished and a tendency of crosstalk noises has been found for each case. The larger reading area, the higher crosstalk noises fur the later recorded holograms. Before the post-exposure the crosstalk noises are higher in the earlier recorded holograms, but after the post-exposure the crosstalk noises we higher in the later recorded holograms. The crosstalk noises of the earlier recorded holograms become higher as more holograms are recorded by multiplexing. To explain the tendency of crosstalk noises of these experiments, we suggest a model considering the anisotropic shrinkage of the photopolymer According to the model. the shrinkage is more dominant at the center of the recorded region than the edge of that. After the post-exposure, however, the amount of shrinkage becomes the same far the whole recorded region. The results of all three experiments are well explained by this model.

  • PDF

Analysis of crosstalk of dual-offset stripline in a FR-4 high multilayer PCB (박판화된 다층기판에서 dual-offset stripline 구조의 누화 해석)

  • 이명호;전용일;전병윤;박권철;강석열
    • Journal of the Korean Institute of Telematics and Electronics S
    • /
    • v.35S no.4
    • /
    • pp.20-29
    • /
    • 1998
  • In this paper, we find the values of near-end crosstalk coefficients in dual-offset stripline of a FR-4 multilayer PCB by an analytic method and a HSPICE simulation method, define calculation errors inananlytic method and the application range, simulate near-end crosstalk coefficients of the FCT(Fast CMOS TTL) in complicated dual-offset stripline by HSPICE and analyze near-end crosstalk and far-end crosstalk coefficients in dual-offset stripline. So, we analyze coupling structure of the near-end crosstalk and far-end crosstalk in the complicated dual-offset striplines that are 1[pF] capacitors termainated, and define a coupling formula of near-end crosstalk and far-end crosstalk coefficients dual-offset striplines.

  • PDF

Modeling of Crosstalk Behaviors in Thermal Inkjet Print Heads (열 잉크젯 프린트헤드의 채널간 간섭현상의 모델링)

  • Lee, You-Seop;Sohn Dong-Ki;Kim Min-Soo;Kuk Keon
    • Transactions of the Korean Society of Mechanical Engineers B
    • /
    • v.31 no.2 s.257
    • /
    • pp.141-150
    • /
    • 2007
  • This paper presents a lumped model to predict crosstalk characteristics of thermally driven inkjet print heads. Using the lumped R-C model, heating characteristics of the head are predicted to be in agreement with IR temperature measurements. The inter-channel crosstalk is simulated using the lumped R-L network. The values of viscous flow resistance, R and flow inertance, L of connecting channels are adjusted to accord with the 3-D numerical simulation results of three adjacent jets. The crosstalk behaviors of a back shooter head as well as a top shooter head have been investigated. Predictions of the proposed lumped model on the meniscus oscillations are consistent with numerical simulation results. Comparison of the lumped model with experimental results identifies that abnormal two-drop ejection phenomena are related to the increased meniscus oscillations because of the more severe crosstalk effects at higher printing speeds. The degree of crosstalk has been quantified using cross-correlations between neighboring channels and a critical channel dimension for acceptable crosstalk has been proposed and validated with the numerical simulations. Our model can be used as a design tool for a better design of thermal inkjet print heads to minimize crosstalk effects.

Crosstalk analysis of laser-diode array modules for wavelength division multiplexing (파장 분할 다중화 방식을 위한 고속 레이저 다이오드 배열 모듈의 혼신해석)

  • 김성일;이해영
    • Journal of the Korean Institute of Telematics and Electronics D
    • /
    • v.34D no.7
    • /
    • pp.71-78
    • /
    • 1997
  • In this paper, we analyzed the crosstalk characteristics of LD array modules for WDM and improved the crosstalk levels using a screening line between access lines. From the calculation resutls, we have found that inductive crosstalk of access lines is dominant for the low impedance LD arrays with short bondwire interconnections. The proposed array interconnecton with the screening line and ouble bondwires, rduces the crosstalk level about 10dB compared to conventional interconnections using simple access lines and a single bondwire. This proposed structure also can be easily imlemented with transmission reliability.

  • PDF

Crosstalk Analysis on Printed Circuit Board (인쇄뢰로기판의 누화해석)

  • 박경희;김제영;김수중
    • Journal of the Korean Institute of Telematics and Electronics A
    • /
    • v.28A no.9
    • /
    • pp.700-707
    • /
    • 1991
  • Transmission line crosstalk of a printed circuit baord terminated with the linear resistive and nonlinear terminal network is analyzed. Based on a quasi-static approximation, crosstalk voltage is computed in frequency domain by applying the modal analysis. A scheme to calculate the maximum crosstalk voltage for a line terminated with the nonlinear digital gate is proposed. And also, crosstalk quantities are numerically obtained for the microstrip and strip line, and compared with the experimental data to validate relevance of this method.

  • PDF

On the Minimization of Crosstalk Conflicts in a Destination Based Modified Omega Network

  • Bhardwaj, Ved Prakash;Nitin, Nitin
    • Journal of Information Processing Systems
    • /
    • v.9 no.2
    • /
    • pp.301-314
    • /
    • 2013
  • In a parallel processing system, Multi-stage Interconnection Networks (MINs) play a vital role in making the network reliable and cost effective. The MIN is an important piece of architecture for a multiprocessor system, and it has a good impact in the field of communication. Optical Multi-stage Interconnection Networks (OMINs) are the advanced version of MINs. The main problem with OMINs is crosstalk. This paper, presents the (1) Destination Based Modified Omega Network (DBMON) and the (2) Destination Based Scheduling Algorithm (DBSA). DBSA does the scheduling for a source and their corresponding destination address for messages transmission and these scheduled addresses are passed through DBMON. Furthermore, the performance of DBMON is compared with the Crosstalk-Free Modified Omega Network (CFMON). CFMON also minimizes the crosstalk in a minimum number of passes. Results show that DBMON is better than CFMON in terms of the average number of passes and execution time. DBSA can transmit all the messages in only two passes from any source to any destination, through DBMON and without crosstalk. This network is the modified form of the original omega network. Crosstalk minimization is the main objective of the proposed algorithm and proposed network.

A Low-Crosstalk Design of 1.25 Gbps Optical Triplexer Module for FTTH Systems

  • Kim, Sung-Il;Park, Sun-Tak;Moon, Jong-Tae;Lee, Hai-Young
    • ETRI Journal
    • /
    • v.28 no.1
    • /
    • pp.9-16
    • /
    • 2006
  • In this paper, we analyzed and measured the electrical crosstalk characteristics of a 1.25 Gbps triplexer module for Ethernet passive optical networks to realize fiber-tothe-home services. Electrical crosstalk characteristic of the 1.25 Gbps optical triplexer module on a resistive silicon substrate should be more serious than on a dielectric substrate. Consequently, using the finite element method, we analyze the electrical crosstalk phenomena and propose a silicon substrate structure with a dummy ground line that is the simplest low-crosstalk layout configuration in the 1.25 Gbps optical triplexer module. The triplexer module consists of a laser diode as a transmitter, a digital photodetector as a digital data receiver, and an analog photodetector as a cable television signal receiver. According to IEEE 802.3ah and ITU-T G.983.3, the digital receiver and analog receiver sensitivities have to meet -24 dBm at $BER=10^{-12}$ and -7.7 dBm at 44 dB SNR. The electrical crosstalk levels have to maintain less than -86 dB from DC to 3 GHz. From analysis and measurement results, the proposed silicon substrate structure that contains the dummy line with $100\;{\mu}m$ space from the signal lines and 4 mm separations among the devices satisfies the electrical crosstalk level compared to a simple structure. This proposed structure can be easily implemented with design convenience and greatly reduce the silicon substrate size by about 50 %.

  • PDF