• Restorative Dentistry and Endodontics
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• v.29 no.4
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• pp.386-398
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• 2004

Objectives: The purpose of this study was to observe the reaction kinetics and the degree of polymerization of composite resins when cured by different light sources and to evaluate the effectiveness of the blue Light Emitting Diode Light Curing Units (LED LCUs) compared with conventional halogen LCUs. Materials and Methods: First, thermal analysis was performed by a differential scanning calorimeter (DSC). The LED LCU (Elipar Freelight, $320{\;}mW/\textrm{cm}^2$) and the conventional halogen LCU (XL3000, $400{\;}mV/\textrm{cm}^2$) were used in this study for curing three composite resins (SureFil, Z-250 and AEliteFLO). Second. the degree of conversion was obtained in the composite resins cured according to the above curing mode with a FTIR. Third, the measurements of depth of cure were carried out in accordance with ISO 4049 standards. Statistical analysis was performed by two-way ANOVA test at 95% levels of confidence and Duncan's procedure for multiple comparisons. Results: The heat of cure was not statistically different among the LCUs (p > 0.05). The composites cured by the LED (Exp) LCUs were statistically more slowly polymerized than by the halogen LCU and the LED (Std) LCU (p < 0.05). The composite resin groups cured by the LED (Exp) LCUs had significantly greater degree of conversion value than by the halogen LCU and the LED (Std) LCU (p =0.0002). The composite resin groups cured by the LED (Std) LCUs showed significantly greater depth of cure value than by the halogen LCU and the LED (Exp) LCU (p < 0.05).

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.144.2-144.2
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• 2010

Bipolar plate는 고분자 전해질 연료전지(PEMFC)에서 핵심 부품 중의 하나이고, 전해질 막이나 촉매 등에 비해서는 상대적으로 쉽게 접근할 수 있기 때문에 많은 연구가 수행되고 있다. Bipolar plate를 제조하는 기술은 크게 금속을 프레스 가공하는 방법, graphite 판을 직접 밀링하는 방법 및 고분자/카본계의 press molding 법 등 3가지로 분류되며, 본 연구에서는 3번째 방법에 의해서 bipolar plate를 대량 생산하는 방법에 대해 연구하였다. 고분자 매트릭스는 에폭시계 수지를 사용하였고, 카본계 재료는 graphite 분말과 carbon nanotube를 사용하였다. 이들 재료들을 일정한 비율로 혼합한 후 differential scanning calorimetry(DSC)를 사용하여 열분석 하였고, 그 결과를 Kissinger equation에 대입하여 경화반응 속도론을 연구하였다. 또한, 경화된 에폭시/탄소 복합재료의 전기전도도, 유리전이온도, 표면에너지 특성 등을 분석하였다.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.147-150
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• 2002

The cure kinetics of blends of epoxy (DGEBA:diglycidyl ether of bisphenol A)/anhydride (NMA:nadic methyl anhydride) resin with synthesized amino terminated polyetherimide (AT-PEI) were studied using differential scanning calorimetry (DSC) and Dynamic Mechanical Analysizer(DMA) under isothermal condition to determine the reaction parameters and gel-vitrification behavior. The fracture toughness of AT-PEI 20phr/epoxy resin system was improved over 224% and 42.5% more than neat epoxy resin and commercial PEI/Epoxy Resin System.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1847-1850
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• 2008

The process conditions during ultraviolet nanoimprint lithography (UV-NIL) process such as temperature, stamping pressure, UV irradiation, etc. are effective factors for successful imprinting of complex and fine patterns. In this study, the effects of aluminum mold on the thermal characteristics of UV-NIL process were investigated through imprinting experiments and numerical simulations. The temperature of polymer resin on mold was measured to study thermal characteristics during UV curing. From the experimental and numerical results, the importance of curing reaction control for UV-NIL process was discussed for deformation characteristics.

• Journal of Conservation Science
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• v.28 no.3
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• pp.265-276
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• 2012

Physicochemical properties of HBA epoxy resins were controlled by varying hardener mixture and reactive diluent to improve applicability for stone conservation. The epoxy risen comprises hydrogenated Bisphenol-A based epoxide (HBA), fast curing agent (FH), slow curing agent poly(propyleneglycol)bis(2- aminopropylether) (SH) and difunctional polyglycidyl epoxide (DPE). Talc was used as an inorganic additive. The changes in viscosity and temperature during curing reactions depending on the composition of the epoxy resins were investigated. Additionally, bending, tensile and adhesive strengths were measured to identify the effective mechanical strength in stone conservation. Finally various compositions of epoxy resin/inorganic additives were developed for stone conservation by controlling cure kinetics and mechanical properties.

• Journal of the Korean Chemical Society
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• v.46 no.3
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• pp.233-240
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• 2002

In this work, the cure kinetics and rheological and mechanical properties of diglycidylether of bispheonol A (DGEBA, EP)/polyurethane (PU) blends were investigated. The 1 wt% N-benzylpyrazinium hexafluoroantiminate (BPH) was used as a latent thermal catalyst. Latent properties were performed by measurement of the conversion as a function of reaction temperature using DSC. And the rheological properties of the blend systems were investigated under isothermal conditions using a rheometer. Crosslinking activating energies (Ec) were also determined from the Arrhenius equation based on gel time and curing temperature. The impact strengths were measured as mechanical properties of the casting specimens. The BPH in the blend systems could be an excellent latent thermal catalyst without any co-initiator. The rheological results showed that Ec was highest when PU content was 30 wt% which was in good agreement with the impact strengths. This was probably due to the intermolecular hydrogen bonding between the hydroxyl group in PU and EP, resulting in increasing the crosslinking density.

• Polymer(Korea)
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• v.27 no.1
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• pp.33-39
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• 2003

In this study, the bisphenol-based DGEBA/GEBS blend systems were studied in cure kinetics, thermal stabilities, and fracture toughness of the casting specimen. The content of DGEBA/DCEBS was varied in 100 : 0, 90 : 10, 80 : 20, 70 : 30, and 60 : 40 wt%. The cure activation energies ($E_a$) of the blend systems were determined by Ozawa's equation. The thermal stabilities, including initial decomposed temperature (IDT), temperatures of maximum rate of degradation ($T_{max}$), and integral procedural decomposition temperature (IPDT) of the cured specimen were investigated by thermogravimetric analysis (TGA). For the mechanical interfacial properties of the specimens, the critical stress intensity factor ($K_{IC}$) test was performed and their fractured surfaces were examined by using a scanning electron microscope (SEM). As a result, $E_a$, IPDT, and $K_{IC}$ show maximum values in the 20 wt% DGEBS content compared with the neat DGEBA resins. This was probably due to the fact that the elevated networks were farmed by the introduction of sulfonyl groups of the DCEBS resin.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.57-67
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• 2022

The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.

• Korea-Australia Rheology Journal
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• v.20 no.3
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• pp.165-173
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• 2008

Multiple particle tracking microrheology is used to characterize the viscoelastic properties of biomaterial and synthetic polymer gels near the liquid-solid transition. Probe particles are dispersed in the gel precursors, and their dynamics are measured as a function of the extent of reaction during gel formation. We interpret the dynamics using the generalized Stokes-Einstein relationship (GSER), using a form of the GSER that emphasizes the relationship between the probe particle mean-squared displacement and the material creep compliance. We show that long-standing concepts in gel bulk rheology are applicable to microrheological data, including time-cure superposition to identify the gel point and critical scaling exponents, and the power-law behavior of incipient network's viscoelastic response. These experiments provide valuable insight into the rheology, structure, and kinetics of gelling materials, and are especially powerful for studying the weak incipient networks of dilute gelators, as well as scarce materials, due to the small sample size requirements and rapid data acquisition.

• Journal of the Korean Wood Science and Technology
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• v.47 no.2
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• pp.221-228
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• 2019

This study reports the performance of urea-formaldehyde (UF) resins prepared at two different low formaldehyde/urea (F/U) mole ratios with different numbers of urea addition during synthesis. The second or third urea was added during the synthesis of UF resins to obtain two different low molar ratios of 0.7 and 1.0, respectively. The molecular weights, cure kinetics, and adhesion performance of these resins were characterized by the gel permeation chromatography, differential scanning calorimetry, and tensile shear strength of plywood, respectively. When the number of urea additions and F/U molar ratio increased, the gelation time decreased, whereas the viscosity and molecular weight increased. Further, the UF resins prepared with the second urea and 1.0 molar ratio resulted in greater activation energy than those with third urea and 0.7 molar ratio. Tensile shear strength and formaldehyde emission (FE) of the plywood that bonded with these resins increased when the number of urea additions and molar ratio increased. These results suggest that the UF resins prepared with 0.7 molar ratio and third urea addition provide lower adhesion performance and FE than those resins with 1.0 mole ratio and the second urea addition.