• Title/Summary/Keyword: dry ashing

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Atmospheric Plasma application for dry cleaner, PR ashing & PI rework in the $5^{th}$ generation and beyond LCD production

  • Park, Young-Chun;Lee, Bong-Ju
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.421-424
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    • 2003
  • An AP plasma technology has been developed for the application of dry cleaner, PR ashing and PI rework in the large glass size. The technology is cost effective, environment friendly, and best fits for coming generation LCD production since the design is easily scalable to bigger size glasses. Surface cleaning results based on the contact angle study has been presented for $5^{th}$ generation LCD bare glass. PR ashing results and various parametric studies have been also presented.

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대기압 플라즈마 Photoresist Ashing에 관한 연구

  • ;Kim, Yun-Hwan;Lee, Sang-Ro
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.464-464
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    • 2012
  • 본 연구에서는 DBD (Dielectric Barrier Discharge)방식을 통해 발생된 대기압 plasma를 이용한 Photoresist (PR) Ashing에 관한 연구를 하였다. 사용된 DBD 반응기는 기존의 blank planar plate 형태의 Power가 인가되는 anode 부분과 Dielectric Barrier 사이 공간을 액상의 도전체로 채워 넣은 형태의 전극이 사용 하였으며, 인가 Power는 40 kHz AC 최대 인가 전압 15 kV를 사용 하였고(본 연구에서 인가 power는 30 KHz,전압 14 KV를 고정시킴) 플라즈마를 발생시 라디칼의 활성화를 유지하기 위해 전극 온도가 $180^{\circ}C$ 정하였다. Feeding 가스는 N2, 반응가스로는 CDA(Clean Dry Air), SF6와 CF4가스를 사용 하였으며 모든 공정은 In-line type으로 시편을 처리 하였다. CDA ratio의 경우에 질소대비 0.2%때 이송속도 30 mm/sec 1회 처리 기존 PR ashing은 최대 $320{\AA}$의 ashing 두께를 얻을 수 있었다. SF6와 CDA가스를 같이 반응하는 경우 ratio는 CDA : SF6 = 0.6% : 0.6%에서 PR ashing rate이 $841{\AA}/pass$의 값을 얻을 수 있었고, CDA가스만 첨가하는 경우보다 약2.6배 증가함을 관찰할 수 있었다. CF4 가스를 사용하는 경우 ratio는 CDA : CF4 = 0.2% : 0.2%에서 PR ashing rate이 $687{\AA}/pass$의 값을 얻을 수 있으며 CDA가스만 첨가하는 경우보다 약 2.1배 증가함을 관찰할 수 있었다. 그리고 PR ashing rate가 가스첨가종류와 비율에 따라서 변화함을 관찰하였고 최적조건을 찾기 위해 연구를 진행하였다. 추후 PR ashing rate가 향상을 하기 위해 가스혼합비율 및 stage 온도등 조건을 조절하여 공정최적조건을 얻기 위해 연구를 진행하였다.

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Study on the Pretreatment of Seafood for the Determination of Total Arsenic using Wet Ashing Method (습식 분해법을 이용한 해산물 중 총 비소 분석을 위한 전처리 방법 연구)

  • Kim, Sun Tae;Park, Kyung Su
    • Analytical Science and Technology
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    • v.16 no.6
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    • pp.509-512
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    • 2003
  • Pretreatment method for the determination of total arsenic in seafood sample was studied. NIST SRM 1566a oyster tissue ($14.0{\pm}1.2mg\;As/kg$) as a standard arsenic compound in order to establish the decomposition method. We confirmed that the best way for pretreatment of seafoods to analyze total arsenic content precisely was $HNO_3-H_2SO_4-HCIO_4$ method by comparison of two methods which are dry ashing and wet ashing methods.

치석의 무기질 분석에 관한 연구

  • Kim, Hyun-Pung
    • The Journal of the Korean dental association
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    • v.12 no.7
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    • pp.521-526
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    • 1974
  • This observation was carried out to investigate the inorganic constituents of dental calculus of varying locations and different ages. Supragingival calculus was obtained from 540 patients with the periodontal disease. The results were as follows : 1. The weight loss rate in ashing by aging was the highest in the 2nd decade (63.7%) and followed in order by 3rd decade (60.8%), seventh decade 959.8%), fourth decade (55.9%), sixth decade (52.6%) and fifth decade (43.2%). 2. The weight loss rate by ashing was more prominent in the buccal surfaces of the upper posterior teeth (62.0%) than in the lingual surface of the lower anterior teeth (59.7%). 3. The difference in contents of the inorganic constituents by sex was not remarkable. (male, Ca:373.0 P:333.9, female, Ca: 380.2, P: 339.6 ㎍/mg dry weight) 4. In the dry calulus, contents of the inorganic constituents were as follows: Ca:325.8 P:269.10 Mg:1.21 Na:8.44 K:1.32, Zn:0.67 ㎍/mg. 5. The Ca/P ratio was the lowest in the upper anterior region (1.11) and the highest in the lower posterior region (1.29) and the average was 1.20.

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Effect of Pre-treatment Methods on Heavy Metals Analysis of organic Solid Wastes during Composting (퇴비화 과정중 전처리방법에 따른 중금속함량의 변화)

  • Park, Joon-Seok;Ahn, Byung-Koo;Ha, Eun-A
    • Journal of the Korea Organic Resources Recycling Association
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    • v.10 no.2
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    • pp.117-124
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    • 2002
  • This study was carried out to investigate variation of heavy metal contents for feed materials during composting and to evaluate the effect of pre-treatment methods on heavy metal analysis. Dry ashing, $HNO_3-HClO_4$, aqua-regia, HCl reflux, $HNO_3-HClO_4-HF$, autoclaving methods of $HNO_3$, HCl, and $HNO_3(2+1)$ were used as pre-treatment for heavy metal analysis. In analyzing standard material SRM 2781, recovery efficiencies of pre-treatment methods were 50-60% for Cr and Zn, >100% for Ni, and 80-90% for Cd and Cu. Recovery efficiency of dry ashing for SRM 2781 was the lowest. In composting raw material, Cd concentration by autoclaving methods was 3 to 4 times higher than the other methods and recovery efficiency of dry ashing was also the lowest. During composting, Cd content was the highest in autoclaving. Cr and Cu concentrations were the lowest in dry ashing and aqua-regia, respectively. Variation coefficients of Pb and Zn between pre-treatment methods were generally low.

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Removal of Post Etch/Ash Residue on an Aluminum Patterned Wafer Using Supercritical CO2 Mixtures with Co-solvents and Surfactants: the Removal of Post Etch/Ash Residue on an Aluminum Patterned Wafer

  • You, Seong-sik
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.2
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    • pp.55-60
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    • 2017
  • The supercritical $CO_2$ (sc-$CO_2$) mixture and the sc-$CO_2$-based Photoresist(PR) stripping(SCPS) process were applied to the removal of the post etch/ash PR residue on aluminum patterned wafers and the results were observed by scanning of electron microscope(SEM). In the case of MDII wafers, the carbonized PR was able to be effectively removed without pre-stripping by oxygen plasma ashing by using sc-$CO_2$ mixture containing the optimum formulated additives at the proper pressure and temperature, and the same result was also able to be obtained in the case of HDII wafer. It was found that the efficiency of SCPS of ion implanted wafer improved as the temperature of SCPS was high, so a very large amount of MEA in the sc-$CO_2$ mixture could be reduced if the temperature could be increased at condition that a process permits, and the ion implanted photoresist(IIP) on the wafer was able to be removed completely without pre-treatment of plasma ashing by using the only 1 step SCPS process. By using SCPS process, PR polymers formed on sidewalls of metal conductive layers such as aluminum films, titanium and titanium nitride films by dry etching and ashing processes were removed effectively with the minimization of the corrosion of the metal conductive layers.

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Evaluation of Analytical Method for Determination of Potassium in Tobacco Leaf (담배 엽 중 칼륨 분석법의 평가)

  • Cho Sung-Eel;Kim Mi-Ju;Kim Sang-Un;Kim Yong-Ha;Min Young-Keun
    • Journal of the Korean Society of Tobacco Science
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    • v.28 no.1
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    • pp.51-57
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    • 2006
  • This study was carried out to improve and evaluate the analytical method for determination of potassium in tobacco leaf by various pre-treatment techniques. The time requirment of various pre-treatments was about 10 hour for dry ashing and 6 hour for microwave digestion and 3 hour for sonication. The results of recover in both pre-treatment techniques, microwave digestion and sonication, is greater than 85 % stably with reproducibility(RSD %) on replicates of less than 3 %. However the mean values for microwave digestion were lower than certified standard value of NlST SRM. Compared to the other pre-treatment techniques, analytical results for sonication technique strictly improved the accuracy and precision. In conclusion, the use of the simple sonication technique seems to be efficient for the determination of potassium in tobacco leaf in consideration for both the accuracy and reproducibility.

Comparison of the analytical methods for Cd in brown rice (현미중(玄米中) 카드뮴의 분석방법(分析方法)에 관(關)한 비교연구(比較硏究))

  • Kim, Bok-Young;Lee, Min-Hyo
    • Korean Journal of Environmental Agriculture
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    • v.14 no.3
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    • pp.338-344
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    • 1995
  • The wet ash method has been used as an official standard procedure for the analysis of Cd in brown rice in Korea, but this method involves several disadvantages. Thus, four analytical methods were compared in this experiment in order to find a more efficient method for the Cd analysis in brown rice. Evaluation was made based on both the Cd recovery percentages from the Cd-spiked samples and the relationships between Cd contents obtained by the official procedure and other methods. Results showed that ashing 50g brown rice at $600^{\circ}C$(dry ash method) recovered nearly 80% of the spiked Cd. This recovery percentage was a little lower than that of the wet ash method(87%) but higher than those of other methods. The dry ash method had the lowest standard deviations and revealed the highest correlation coefficient($r=0.98^{\ast\ast}$) in Cd contents with the standard wet ash method. These results demonstrated that the dry ash method, ashing 50g brown rice at $600^{\circ}C$, would be as efficient as the wet ash method and could be employed as a recommended procedure for the Cd analysis of brown rice.

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One- and Two-Dimensional Arrangement of DNA-Templated Gold Nanoparticle Chains using Plasma Ashing Method

  • Kim, Hyung-Jin;Hong, Byung-You
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.291-291
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    • 2010
  • Electron-beam lithography (EBL) process is a versatile tool for a fabrication of nanostructures, nano-gap electrodes or molecular arrays and its application to nano-device. However, it is not appropriate for the fabrication of sub-5 nm features and high-aspect-ratio nanostructures due to the limitation of EBL resolution. In this study, the precision assembly and alignment of DNA molecule was demonstrated using sub-5 nm nanostructures formed by a combination of conventional electron-beam lithography (EBL) and plasma ashing processes. The ma-N2401 (EBL-negative tone resist) nanostructures were patterned by EBL process at a dose of $200\;{\mu}C/cm2$ with 25 kV and then were ashed by a chemical dry etcher at microwave (${\mu}W$) power of 50 W. We confirmed that this method was useful for sub-5 nm patterning of high-aspect-ratio nanostructures. In addition, we also utilized the surface-patterning technique to create the molecular pattern comprised 3-(aminopropyl) triethoxysilane (APS) as adhesion layer and octadecyltrichlorosilane (OTS) as passivation layer. DNA-templated gold nanoparticle chain was attached only on the sub-5 nm APS region defined by the amine groups, but not on surface of the OTS region. We were able to obtain DNA molecules aligned selectively on a SiO2/Si substrate using atomic force microscopy (AFM).

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